EP0143079A2 - Method of producing a microvalve device and application of this method for obtaining a light modulator - Google Patents

Method of producing a microvalve device and application of this method for obtaining a light modulator Download PDF

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Publication number
EP0143079A2
EP0143079A2 EP84810556A EP84810556A EP0143079A2 EP 0143079 A2 EP0143079 A2 EP 0143079A2 EP 84810556 A EP84810556 A EP 84810556A EP 84810556 A EP84810556 A EP 84810556A EP 0143079 A2 EP0143079 A2 EP 0143079A2
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EP
European Patent Office
Prior art keywords
grid
layer
flaps
organic material
fasteners
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP84810556A
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German (de)
French (fr)
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EP0143079A3 (en
Inventor
André Perret
Raymond Vuilleumier
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Centre Electronique Horloger SA
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Centre Electronique Horloger SA
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Publication of EP0143079A2 publication Critical patent/EP0143079A2/en
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Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/37—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements
    • G09F9/372—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements the positions of the elements being controlled by the application of an electric field

Definitions

  • the present invention relates to a method for manufacturing a micro-flap device and more particularly relates to a method for manufacturing a device comprising a flat support to which are fixed, by elastic fasteners, miniature flaps capable of being controlled by rotation as well as the application of such a method for obtaining a light modulation device.
  • an object of the invention is a method of manufacturing a microvolette device involving materials not having the drawbacks mentioned above.
  • Another object of the invention is a method of manufacturing a microvolette device based on the use of relatively inexpensive materials and involving photolithography operations similar to those used in the manufacture of integrated circuits.
  • Yet another object of the invention is the application of the method mentioned above for obtaining a light modulation device.
  • Yet another object of the invention is the application of the method mentioned above for obtaining a display device.
  • FIG. 1 One of the essential elements of the process of the invention is the support or retaining grid, an exemplary embodiment of which is shown in FIG. 1.
  • the drawing in FIG. 1 shows relatively large parts 1, intended to ensure sufficient rigidity of the grid and to allow easy handling, a frame 3 which delimits the actual useful area inside which is made a fine lattice 4 which defines cells 2. It is clear that several useful areas can be performed on a single grid as well as the configuration of this or these useful zones can be adapted to the envisaged application.
  • the method of the invention will be described in the context of its application to the production of a display device with microvolets, as described in the aforementioned patent application.
  • the grid can be made of aluminum using known photolithographic processes or by using other more rigid materials, such as metallic compounds such as those known under the brands Dilver, Kovar, Invar or even ceramic materials.
  • the essential qualities of this grid are its mechanical rigidity at low thicknesses and its compatibility with subsequent technological stages.
  • the typical dimensions used in the context of the application considered are:
  • the thickness of the grid can be reduced to about 100 ⁇ m without compromising its support function.
  • the dimensions of the cells can be significantly increased as will be seen later in connection with the description of the stiffening grid.
  • the second step of the process consists in making a flat surface on the retaining grid.
  • Figure 2 shows the grid 4 coated with a polyimide film, such as that known under the trade name Kapton.
  • This film 5 with a typical thickness of 25 ⁇ m, is bonded to the grid 4 using an adhesive, the property of which is to cause no distortion of the film 5.
  • the adhesive sold by the firm Ciba-Geigy under the name "AZ 15 Araldite” has this property.
  • Other materials than Kapton can also be used.
  • organic materials for example epoxy resins
  • the retaining grid thus coated constitutes a planar support for subsequent operations.
  • Figures 3.a to 3.d show in detail the phase of production of a diffusing surface. This phase is necessary if you want to make a display device for which specular reflection is detrimental to aesthetics.
  • Figure 3.a shows how the Kapton film 5 is covered with a photosensitive layer 6, which is exposed through a mask 7. This mask comprises a random distribution of holes which, after the conventional operations of exposure and development , is found reproduced on the photosensitive layer 6, as it appears in FIG. 3.b.
  • the photosensitive layer thus prepared is then etched in a plasma, which has the effect of reproducing on the Kapton film 5 the surface condition initially created on the photosensitive layer.
  • Figure 3.c shows how the outer surface of the Kapton film was changed.
  • FIG. 4 shows a variant according to which the cells of the grid 4 are closed with a polymerizable material, preferably organic, and which can be eliminated by means of a plasma attack.
  • this material can be an epoxy adhesive 8, which is deposited on a 'flat element 9 using a screen-printing device.
  • the grid 4 is then pressed against the glued surface of the element 9 so that the glue 8 is pushed into the cells of the grid.
  • the planar element 9 can be in Kapton. If it is desired to produce a diffusing surface, the face of the element 9, in contact with the epoxy adhesive 8, may have been previously treated as described above so as to present surface irregularities which will be reproduced on the external face of the glue 8.
  • a polymerization of the glue is then carried out, then the Kapton is attacked selectively and a grid is obtained having on one side a flat surface, possibly structured, the cells of which are partially filled with polymerized glue.
  • a stiffening grid is produced.
  • An aluminum layer with a thickness of the order of 1 ⁇ m is then deposited over the entire surface of the film 5. This layer is then selectively etched at the locations of the flaps.
  • the aluminum layer will be eliminated in the areas which will be occupied by shutters with the exception of ribs 21 disposed on the shutters, as indicated in FIG. 6.b.
  • Figure 5 shows, in section, the aluminum layer 20 and the ribs 2i.
  • This aluminum layer 20 has fairly stiff stop flanks 25 which can be softened by immersing the assembly in an aluminum etching bath for a relatively short time. This last operation is known by the Anglo-Saxon name of "dip".
  • Aluminum deposition and selective attack operations are classic operations of integrated circuit technology and their description can be found in the book "Handbook of thin film technology" by Maissel and Glang published by Editions McGraw-Hill Inc.
  • the ribs 21 have the same thickness as the aluminum layer 20 surrounding the flaps. It can however be envisaged that the thicknesses of the ribs 21 and of the layer 20 are different, in which case the layer 20, for example, can be produced by two successive deposits, the last deposit having the desired thickness for the ribs. Furthermore, it is understood that this stiffening grid 20 provides rigidity such that it makes it possible to envisage the use of a retaining grid 4 having cells 2 of large dimensions. In the extreme and for small display devices, the retaining grid 4 may have only one cell 2, the rigidity of the assembly then being ensured by the stiffening grid 20.
  • Figure 6.a shows how the stiffening grid 20 is then covered, by evaporation, with a thin layer of aluminum 26 with a thickness of about 50 nm.
  • the flaps 23 ( Figures 6.b and 6.c) and their fasteners 24 ( Figure 6.b) are then etched in the layer 26 using standard methods.
  • FIG. 6.c shows the flaps 23 resulting from the etching operation
  • FIG. 6.b shows, seen from above, the respective arrangements of the first grid 4, of the second grid 20, of the thin layer 26, of the flaps 23 and their fasteners 24.
  • Figure 6.b also shows the arrangement of the ribs 21 on the flaps 23. These ribs have the effect of stiffening the surface of the flaps without significantly increasing their mass or their thickness.
  • the ul-time phase of the process consists in releasing the flaps from their support, that is to say removing the film 5 under the flaps 23 inside the cells of the grid 4.
  • the Kapton film 5 is attacked by a plasma in the gas phase (oxygen plasma) until the flaps are completely released, which are therefore only attached to the support 20 by their fasteners 24 (FIG. 6.b).
  • FIG. 7 shows the flaps released and how the film 5 has been eliminated in the cells defined by the grid 4.
  • a preferred application of the method described above is for producing light modulation devices like that described in the aforementioned patent application.
  • the grid 4 is fixed, by gluing, on a base carrying electrodes so that these electrodes are arranged opposite each flap, if each flap is individually addressable, or each group of flaps, if several flaps are simultaneously addressable.
  • the bottom may also include an electronic control circuit. If the light modulation device is intended to operate in transmission, the background, provided with electrodes, must necessarily be transparent. On the other hand, if it is intended to operate in reflection, the bottom must have a face made of light absorbing material on the side of the shutters.
  • the light modulation device is then closed using a transparent plate kept at a suitable distance from the shutters by spacers.
  • the transparent plate as well as the bottom can be made of glass or any other similar material.
  • the electrodes for addressing the flaps are arranged on the transparent plate.

Abstract

Le procédé de l'invention comporte les étapes suivantes. - réalisation d'une première grille (4) présentant des alvéoles (2); - obtention d'un support plan par dépôt d'une couche de matière organique (5); - réalisation d'une deuxième grille (20) sur la couche (5); - dépôt d'une fine couche métallique (26) et gravure dans cette couche des volets (23); et - élimination de la couche (5) dans les alvéoles (2), en vue de libérer les volets (23).The method of the invention comprises the following steps. - Production of a first grid (4) having cells (2); - Obtaining a flat support by depositing a layer of organic material (5); - production of a second grid (20) on the layer (5); - deposit of a thin metallic layer (26) and etching in this layer of flaps (23); and - elimination of the layer (5) in the cells (2), in order to release the flaps (23).

Description

La présente invention se rapporte à un procédé de fabrication d'un dispositif à microvolets et concerne plus particulièrement un procédé de fabrication d'un dispositif comportant un support plan auquel sont fixés, par des attaches élastiques, des volets miniatures susceptibles d'être commandés en rotation ainsi que l'application d'un tel procédé pour l'obtention d'un dispositif de modulation de la lumière.The present invention relates to a method for manufacturing a micro-flap device and more particularly relates to a method for manufacturing a device comprising a flat support to which are fixed, by elastic fasteners, miniature flaps capable of being controlled by rotation as well as the application of such a method for obtaining a light modulation device.

On a déjà décrit dans la demande de brevet français No 81 04778, publiée le 18 septembre 1981 sous le No 2 478 352 et intitulée: "Dispositif d'affichage miniature", un dispositif d'affichage à microvolets de type électrostatique et réalisé sur une plaquette de silicium à l'aide de techniques analogues à celles utilisées pour la fabrication des circuits intégrés. Si l'utilisation d'un support de silicium offre certains avantages parmi lesquels celui de permettre l'application de techniques d'usinage connues et bien maîtrisées, elle implique cependant certaines contraintes ou limitations qui sont dues au matériau lui-même. Ainsi, les orientations cristallographiques du silicium monocristallin imposent des plans d'attaque chimique bien définis; ce qui limite, entre autres, les géométries possibles. On pourra, à ce sujet, se reporter pour plus d'informations à l'article de Kenneth E. Bean, intitulé: "Anisotropic et- ching of silicon" et paru dans Ta revue IEEE Transactions on Electron Devices, Vol. ED-25, No 10, d'Octobre 1978. Par ailleurs, les plaquettes de silicium actuellement disponibles sur le marché ont un diamètre maximum donné; ce qui limite d'autant la taille du dispositif d'affichage réalisable. D'autre part, lorsque l'épaisseur de la plaquette doit être réduite à des valeurs d'environ 200 pm, la fragilité mécanique de celle-ci est telle qu'elle requiert de très grandes précautions pour être manipulée.We have already described in French patent application No. 81 04778, published on September 18, 1981 under No. 2,478,352 and entitled: "Miniature display device", a display device with microvolets of electrostatic type and produced on a silicon wafer using techniques similar to those used for the manufacture of integrated circuits. If the use of a silicon support offers certain advantages, among which that of allowing the application of known and well mastered machining techniques, it however implies certain constraints or limitations which are due to the material itself. Thus, the crystallographic orientations of monocrystalline silicon impose well defined chemical attack planes; which limits, among other things, the possible geometries. On this subject, we can refer for more information to the article by Kenneth E. Bean, entitled: "Anisotropic etching of silicon" and published in Your review IEEE Transactions on Electron Devices, Vol. ED-25, No 10, of October 1978. Furthermore, the silicon wafers currently available on the market have a given maximum diameter; which therefore limits the size of the display device that can be produced. On the other hand, when the thickness of the wafer must be reduced to values of around 200 μm, the mechanical fragility of the latter is such that it requires very great precautions to be handled.

Aussi un objet de l'invention est un procédé de fabrication d'un dispositif à microvolets impliquant des matériaux ne présentant pas les inconvénients mentionnés ci-dessus.Also an object of the invention is a method of manufacturing a microvolette device involving materials not having the drawbacks mentioned above.

Un autre objet de l'invention est un procédé de fabrication d'un dispositif à microvolets basé sur l'utilisation de matériaux relativement peu coûteux et impliquant des opérations de photolithographie analogues à celles utilisées dans la fabrication des circuits intégrés.Another object of the invention is a method of manufacturing a microvolette device based on the use of relatively inexpensive materials and involving photolithography operations similar to those used in the manufacture of integrated circuits.

Encore un autre objet de l'invention est l'application du procédé mentionné ci-dessus pour l'obtention d'un dispositif de modulation de lumière.Yet another object of the invention is the application of the method mentioned above for obtaining a light modulation device.

Encore un autre objet de l'invention est l'application du procédé mentionné ci-dessus pour l'obtention d'un dispositif d'affichage.Yet another object of the invention is the application of the method mentioned above for obtaining a display device.

Pour éliminer les problèmes mentionnés dans l'introduction et liés à l'utilisation d'un substrat en silicium, on a prévu d'utiliser un substrat rigide, aisément usinable et préparé pour l'application envisagée, c'est-à-dire avec des cavités convenablement disposées. De plus la requérante a trouvé que l'utilisation de matériaux organiques ou polymères se prêtait avantageusement à l'application de techniques photolithographiques permettant ainsi de réaliser des géométries très petites avec une grande précision.To eliminate the problems mentioned in the introduction and related to the use of a silicon substrate, provision has been made to use a rigid substrate, easily machinable and prepared for the intended application, that is to say with suitably arranged cavities. Furthermore, the applicant has found that the use of organic or polymeric materials is advantageously suitable for the application of photolithographic techniques, thus making it possible to produce very small geometries with great precision.

tes caractéristiques essentielles de l'invention apparaissent dans la revendication 1 et les suivantes.your essential characteristics of the invention appear in claim 1 and the following.

D'autres objets, caractéristiques et avantages de la présente invention apparaîtront plus clairement au cours de la description suivante des différentes étapes du procédé, ladite description étant faite à titre d'exemple non limitatif et en relation avec les dessins joints dans lesquels:

  • - la figure 1 montre une vue partielle d'un exemple de réalisation d'une grille devant servir de support à un dispositif d'affichage à volets;
  • - la figure 2 montre, en coupe, la grille de la figure 1 recouverte d'un film plastique;
  • - les figures 3.a à 3.c montrent différentes étapes de la réalisation d'une surface diffusante;
  • - la figure 3.d montre la répartition des trous de la surface diffusante par rapport au volet à réaliser;
  • - la figure 4 montre une variante du procédé permettant d'obtenir un support plan à partir de la grille de la figure 1;
  • - la figure 5 montre la réalisation d'une deuxième grille servant à la rigidification;
  • - les figures 6.a et 6.c montrent différentes étapes pour l'obtention des volets;
  • - la figure 6.b montre, vue de dessus, la grille de rigidification et un groupe de deux volets; et
  • - la figure 7 montre une vue partielle, en coupe, d'un dispositif à microvolets après l'attaque du film plastique.
Other objects, characteristics and advantages of the present invention will appear more clearly during the following description of the different stages of the process, said description being given by way of nonlimiting example and in relation to the accompanying drawings in which:
  • - Figure 1 shows a partial view of an embodiment of a grid to serve as a support for a flap display device;
  • - Figure 2 shows, in section, the grid of Figure 1 covered with a plastic film;
  • - Figures 3.a to 3.c show different stages in the production of a diffusing surface;
  • - Figure 3.d shows the distribution of the holes in the diffusing surface with respect to the flap to be produced;
  • - Figure 4 shows a variant of the method for obtaining a flat support from the grid of Figure 1;
  • - Figure 5 shows the realization of a second grid used for stiffening;
  • - Figures 6.a and 6.c show different steps for obtaining the flaps;
  • - Figure 6.b shows, top view, the stiffening grid and a group of two components; and
  • - Figure 7 shows a partial view, in section, of a microvolette device after the attack of the plastic film.

L'un des éléments essentiels du procédé de l'invention est la grille de support ou de maintien dont un exemple de réalisation est représenté à la figure 1. Le dessin de la figure 1 montre des parties reTati- vement larges 1, destinées à assurer une rigidité suffisante de la grille et à permettre une manipulation aisée, un cadre 3 qui délimite la zone utile proprement dite à l'intérieur de laquelle est réalisé un fin treillis 4 qui définit des alvéoles 2. Il est clair que plusieurs zones utiles peuvent être réalisées sur une seule grille de même que la configuration de cette ou de ces zones utiles peut être adaptée à l'application envisagée. A titre d'exemple, le procédé de l'invention sera décrit dans le cadre de son application à la réalisation d'un dispositif d'affichage à microvolets, tel que décrit dans la demande de brevet précitée. La grille peut être réalisée en aluminium à l'aide de procédés photolithographiques connus ou en utilisant d'autres matériaux plus rigides, tels des composés métalliques comme ceux connus sous les marques Dilver, Kovar, Invar ou encore des matières céramiques. Les qualités essentielles de cette grille sont sa rigidité mécanique aux faibles épaisseurs et sa compatibilité avec les étapes technologiques ultérieures. Les dimensions typiques utilisées dans le cadre de l'application considérée sont:

Figure imgb0001
One of the essential elements of the process of the invention is the support or retaining grid, an exemplary embodiment of which is shown in FIG. 1. The drawing in FIG. 1 shows relatively large parts 1, intended to ensure sufficient rigidity of the grid and to allow easy handling, a frame 3 which delimits the actual useful area inside which is made a fine lattice 4 which defines cells 2. It is clear that several useful areas can be performed on a single grid as well as the configuration of this or these useful zones can be adapted to the envisaged application. By way of example, the method of the invention will be described in the context of its application to the production of a display device with microvolets, as described in the aforementioned patent application. The grid can be made of aluminum using known photolithographic processes or by using other more rigid materials, such as metallic compounds such as those known under the brands Dilver, Kovar, Invar or even ceramic materials. The essential qualities of this grid are its mechanical rigidity at low thicknesses and its compatibility with subsequent technological stages. The typical dimensions used in the context of the application considered are:
Figure imgb0001

Ces dimensions ne sont données qu'à titre illustratif. Ainsi, si des matériaux plus rigides que l'aluminium sont utilisés, l'épaisseur de la grille peut être abaissée jusque environ 100 pm sans compromettre sa fonction de support. Par ailleurs, les dimensions des alvéoles peuvent être notablement augmentées comme on le verra plus loin en relation avec la description de la grille de rigidification.These dimensions are given for illustrative purposes only. Thus, if more rigid materials than aluminum are used, the thickness of the grid can be reduced to about 100 μm without compromising its support function. Furthermore, the dimensions of the cells can be significantly increased as will be seen later in connection with the description of the stiffening grid.

La deuxième étape du procédé consiste à réaliser une surface plane sur la grille de maintien. La figure 2 montre la grille 4 revêtue d'un film de polyimide, tel celui connu sous le nom commercial Kapton. Ce film 5, d'une épaisseur typique de 25 pm, est collé sur la grille 4 à l'aide d'une colle dont la propriété est de ne provoquer aucune distorsion du film 5. La colle commercialisée par la firme Ciba-Geigy sous le nom de "AZ 15 Araldite" a cette propriété. D'autres matériaux que le Kapton peuvent également être utilisés. De préférence, on choisira des matières organiques (par exemple des résines époxy) qui sont compatibles avec le matériau de la grille et les étapes de fabrication et qui ont une bonne tenue en température et à l'humidité. La grille de maintien ainsi revêtue constitue un support plan pour les opérations ultérieures.The second step of the process consists in making a flat surface on the retaining grid. Figure 2 shows the grid 4 coated with a polyimide film, such as that known under the trade name Kapton. This film 5, with a typical thickness of 25 μm, is bonded to the grid 4 using an adhesive, the property of which is to cause no distortion of the film 5. The adhesive sold by the firm Ciba-Geigy under the name "AZ 15 Araldite" has this property. Other materials than Kapton can also be used. Preferably, organic materials (for example epoxy resins) will be chosen which are compatible with the material of the grid and the manufacturing steps and which have good resistance to temperature and humidity. The retaining grid thus coated constitutes a planar support for subsequent operations.

Les figures 3.a à 3.d montrent en détail la phase de réalisation d'une surface diffusante. Cette phase est nécessaire si l'on désire réaliser un dispositif d'affichage pour lequel une réflexion spéculaire nuit à l'esthétique. La figure 3.a montre comment le film de Kapton 5 est recouvert d'une couche photosensible 6, laquelle est exposée à travers un masque 7. Ce masque comporte une répartition aléatoire de trous qui, après les opérations classiques d'exposition et de développement, se retrouve reproduite sur la couche photosensible 6, comme cela apparaît à la figure 3.b. La couche photosensible ainsi préparée est ensuite attaquée dans un plasma, ce qui a pour effet de reproduire sur le film de Kapton 5 l'état de surface initialement créé sur la couche photosensible. La figure 3.c montre comment la surface externe du film de Kapton a été modifiée. On a représenté, à la figure 3.d, une vue de dessus partielle du film de Kapton sur lequel sera réalisé un volet 10. A la fin du procédé, le volet 10 sera maintenu au support grâce à des attaches élastiques 12 qui devront permettre la rotation du volet. On conçoit donc l'importance des qualités mécaniques de ces attaches. C'est pourquoi le masque 7 devra sauvegarder les zones des attaches 12; il devra de même sauvegarder une zone 11 qui entoure chaque volet et le sépare du support.Figures 3.a to 3.d show in detail the phase of production of a diffusing surface. This phase is necessary if you want to make a display device for which specular reflection is detrimental to aesthetics. Figure 3.a shows how the Kapton film 5 is covered with a photosensitive layer 6, which is exposed through a mask 7. This mask comprises a random distribution of holes which, after the conventional operations of exposure and development , is found reproduced on the photosensitive layer 6, as it appears in FIG. 3.b. The photosensitive layer thus prepared is then etched in a plasma, which has the effect of reproducing on the Kapton film 5 the surface condition initially created on the photosensitive layer. Figure 3.c shows how the outer surface of the Kapton film was changed. FIG. 3.d shows a partial top view of the Kapton film on which a flap 10 will be produced. At the end of the process, the flap 10 will be held on the support by means of elastic fasteners 12 which will allow flap rotation. So we design the importance of the mechanical qualities of these fasteners. This is why the mask 7 will have to save the areas of the fasteners 12; he must likewise save a zone 11 which surrounds each flap and separates it from the support.

La figure 4 montre une variante selon laquelle les alvéoles de la grille 4 sont obturées par une matière polymérisable, de préférence organique, et pouvant être éliminée au moyen d'une attaque par plasma. A titre d'exemple, cette matière peut être une colle époxy 8, qui est déposée sur un' élément plan 9 à l'aide d'un appareil à sérigraphier. La grille 4 est ensuite pressée contre la surface encollée de l'élément 9 de sorte que la colle 8 est poussée dans les alvéoles de la grille. L'élément plan 9 peut être en Kapton. Si l'on désire réaliser une surface diffusante, la face de l'élément 9, en contact avec la colle époxy 8, peut avoir été préalablement traitée comme décrit précédemment de manière à présenter des irrégularités de surface qui seront reproduites sur la face externe de la colle 8. On effectue ensuite une polymérisation de la colle, puis le Kapton est attaqué sélectivement et l'on obtient une grille présentant d'un côté une surface plane, éventuellement structurée, dont les alvéoles sont partiellement remplies de colle polymérisée.FIG. 4 shows a variant according to which the cells of the grid 4 are closed with a polymerizable material, preferably organic, and which can be eliminated by means of a plasma attack. By way of example, this material can be an epoxy adhesive 8, which is deposited on a 'flat element 9 using a screen-printing device. The grid 4 is then pressed against the glued surface of the element 9 so that the glue 8 is pushed into the cells of the grid. The planar element 9 can be in Kapton. If it is desired to produce a diffusing surface, the face of the element 9, in contact with the epoxy adhesive 8, may have been previously treated as described above so as to present surface irregularities which will be reproduced on the external face of the glue 8. A polymerization of the glue is then carried out, then the Kapton is attacked selectively and a grid is obtained having on one side a flat surface, possibly structured, the cells of which are partially filled with polymerized glue.

Les étapes du procédé précédemment décrites avaient pour objet d'obtenir un support plan, et présentant une surface éventuellement diffusante, à partir d'un élément structuré ou grille. Les étapes suivantes du procédé ont pour objet la réalisation des microvolets sur ledit support plan et enfin leur libération. Ces étapes vont maintenant être décrites en se référant aux figures 5 à 7 qui montrent la réalisation d'un élément d'affichage à deux volets.The steps of the method described above were intended to obtain a flat support, and having a possibly diffusing surface, from a structured element or grid. The following stages of the method relate to the production of the microvolets on said flat support and finally their release. These steps will now be described with reference to Figures 5 to 7 which show the production of a two-part display element.

Dans une première étape, on réalise une grille de rigidification. On procède alors au dépôt d'une couche d'aluminium d'une épaisseur de l'ordre de 1 µm sur toute la surface du film 5. Cette couche est ensuite sélectivement attaquée aux emplacements des volets. Ainsi dans l'exemple d'application envisagé, la couche d'aluminium sera éliminée dans les zones qui seront occupées par des volets à l'exception de nervures 21 disposées sur les volets, comme indiqué sur la figure 6.b. La figure 5 montre, en coupe, la couche d'aluminium 20 et les nervures 2i. Cette couche d'aluminium 20 présente des flancs d'arrêt 25 assez raides et qui peuvent être adoucis en plongeant l'ensemble dans un bain d'attaque de l'aluminium pendant un temps relativement court. Cette dernière opération est connue sous le nom anglo-saxon de "dip". Les opérations de dépôt d'aluminium et d'attaque sélective sont des opérations classiques de la technologie des circuits intégrés et leur description peut être trouvée dans le livre "Handbook of thin film technology" par Maissel et Glang paru aux Editions McGraw-Hill Inc.In a first step, a stiffening grid is produced. An aluminum layer with a thickness of the order of 1 μm is then deposited over the entire surface of the film 5. This layer is then selectively etched at the locations of the flaps. Thus in the application example envisaged, the aluminum layer will be eliminated in the areas which will be occupied by shutters with the exception of ribs 21 disposed on the shutters, as indicated in FIG. 6.b. Figure 5 shows, in section, the aluminum layer 20 and the ribs 2i. This aluminum layer 20 has fairly stiff stop flanks 25 which can be softened by immersing the assembly in an aluminum etching bath for a relatively short time. This last operation is known by the Anglo-Saxon name of "dip". Aluminum deposition and selective attack operations are classic operations of integrated circuit technology and their description can be found in the book "Handbook of thin film technology" by Maissel and Glang published by Editions McGraw-Hill Inc.

Dans l'exemple d'application envisagé, les nervures 21 ont la même épaisseur que la couche d'aluminium 20 entourant les volets. On peut cependant envisager que les épaisseurs des nervures 21 et de la couche 20 soient différentes auquel cas la couche 20, par exemple, peut être réalisée par deux dépôts successifs, le dernier dépôt ayant l'épaisseur voulue pour les nervures. Par ailleurs on comprend que cette grille de rigidification 20 assure une rigidité telle qu'elle permet d'envisager l'utilisation d'une grille de maintien 4 présentant des alvéoles 2 de grandes dimensions. A l'extrême et pour de petits dispositifs d'affichage, la grille de maintien 4 peut ne présenter qu'une seule alvéole 2, la rigidité de l'ensemble étant alors assurée par la grille de rigidification 20.In the application example envisaged, the ribs 21 have the same thickness as the aluminum layer 20 surrounding the flaps. It can however be envisaged that the thicknesses of the ribs 21 and of the layer 20 are different, in which case the layer 20, for example, can be produced by two successive deposits, the last deposit having the desired thickness for the ribs. Furthermore, it is understood that this stiffening grid 20 provides rigidity such that it makes it possible to envisage the use of a retaining grid 4 having cells 2 of large dimensions. In the extreme and for small display devices, the retaining grid 4 may have only one cell 2, the rigidity of the assembly then being ensured by the stiffening grid 20.

La figure 6.a montre comment la grille de rigidification 20 est ensuite recouverte, par évaporation, d'une fine couche d'aluminium 26 d'une épaisseur d'environ 50 nm. Les volets 23 (figures 6.b et 6.c) et leurs attaches 24 (figure 6.b) sont ensuite gravés dans la couche 26 à l'aide de procédés standards. La figure 6.c montre les volets 23 résultant de l'opération de gravure et la figure 6.b montre, vues de dessus, les dispositions respectives de la première grille 4, de la deuxième grille 20, de la couche mince 26, des volets 23 et de leurs attaches 24. La figure 6.b montre encore la disposition des nervures 21 sur les volets 23. Ces nervures ont pour effet de rigidifier la surface des volets sans pour autant augmenter sensiblement leur masse ni leur épaisseur. Il est d'ailleurs à noter que la structuration de la surface destinée à la rendre diffusante, décrite en relation avec les figures 3.a à 3.d, a aussi pour effet de rigidifier les volets et peut donc être envisagée à ce titre même si l'aspect esthétique du dispositif n'est pas de première importance.Figure 6.a shows how the stiffening grid 20 is then covered, by evaporation, with a thin layer of aluminum 26 with a thickness of about 50 nm. The flaps 23 (Figures 6.b and 6.c) and their fasteners 24 (Figure 6.b) are then etched in the layer 26 using standard methods. FIG. 6.c shows the flaps 23 resulting from the etching operation and FIG. 6.b shows, seen from above, the respective arrangements of the first grid 4, of the second grid 20, of the thin layer 26, of the flaps 23 and their fasteners 24. Figure 6.b also shows the arrangement of the ribs 21 on the flaps 23. These ribs have the effect of stiffening the surface of the flaps without significantly increasing their mass or their thickness. It should also be noted that the structuring of the surface intended to make it diffusing, described in relation to FIGS. 3.a to 3.d, also has the effect of stiffening the flaps and can therefore be envisaged as such even if the aesthetic appearance of the device is not of primary importance.

La phase ul-time du procédé consiste à libérer les volets de leur support, c'est-à-dire enlever le film 5 sous les volets 23 à l'intérieur des alvéoles de la grille 4. Le film de Kapton 5 est attaqué par un plasma en phase gazeuse (plasma à oxygène) jusqu'à la libération complète des volets qui ne sont dès lors rattachés au support 20 que par leurs attaches 24 (figure 6.b). La figure 7 montre les volets libérés et comment le film 5 a été éliminé dans les alvéoles définies par la grille 4.The ul-time phase of the process consists in releasing the flaps from their support, that is to say removing the film 5 under the flaps 23 inside the cells of the grid 4. The Kapton film 5 is attacked by a plasma in the gas phase (oxygen plasma) until the flaps are completely released, which are therefore only attached to the support 20 by their fasteners 24 (FIG. 6.b). FIG. 7 shows the flaps released and how the film 5 has been eliminated in the cells defined by the grid 4.

Une application préférentielle du procédé décrit ci-dessus est pour réaliser des dispositifs de modulation de lumière comme celui décrit dans la demande de brevet précitée. Dans ce cas, la grille 4 est fixée, par collage, sur un fond porteur d'électrodes de manière que ces électrodes soient disposées en regard de chaque volet, si chaque volet est individuellement adressable, ou chaque groupe de volets, si plusieurs volets sont simultanément adressables. Le fond peut également comporter un circuit électronique de commande. Si le dispositif de modulation de lumière est prévu pour opérer en transmission, le fond, muni d'électrodes, devra nécessairement être transparent. Par contre, s'il est prévu pour opérer en réflexion, le fond devra présenter une face en matière absorbant la lumière du côté des volets.A preferred application of the method described above is for producing light modulation devices like that described in the aforementioned patent application. In this case, the grid 4 is fixed, by gluing, on a base carrying electrodes so that these electrodes are arranged opposite each flap, if each flap is individually addressable, or each group of flaps, if several flaps are simultaneously addressable. The bottom may also include an electronic control circuit. If the light modulation device is intended to operate in transmission, the background, provided with electrodes, must necessarily be transparent. On the other hand, if it is intended to operate in reflection, the bottom must have a face made of light absorbing material on the side of the shutters.

Le dispositif de modulation de lumière est ensuite fermé à l'aide d'une plaque transparente maintenue à une distance convenable des volets par des espaceurs. La plaque transparente ainsi que le fond peuvent être en verre ou en toute autre matière analogue.The light modulation device is then closed using a transparent plate kept at a suitable distance from the shutters by spacers. The transparent plate as well as the bottom can be made of glass or any other similar material.

Selon une variante de réalisation, les électrodes permettant d'adresser les volets sont disposées sur la plaque transparente.According to an alternative embodiment, the electrodes for addressing the flaps are arranged on the transparent plate.

Bien que la présente invention ait été décrite dans le cadre d'exemples d'application particuliers, il est clair qu'elle n'est cependant pas limitée auxdits exemples et qu'elle est susceptible de modifications ou de variantes sans sortir de son domaine.Although the present invention has been described in the context of specific application examples, it is clear that it is not however limited to said examples and that it is capable of modification or variant without departing from its field.

Claims (28)

1. Procédé de fabrication d'un dispositif comportant un support plan auquel sont fixés, par des attaches élastiques, des volets miniatures susceptibles d'être commandés en rotation, caractérisé en ce qu'il comporte les étapes suivantes: - réalisation d'une première grille rigide et mince présentant au moins une alvéole; - dépôt, sur ladite première grille, d'une couche de matière organique obturant ladite alvéole de manière à réaliser un support plan; - réalisation, sur ladite couche de matière organique, d'une deuxième grille de rigidification ayant une épaisseur sensiblement plus faible que celle de ladite première grille; - dépôt, sur ladite deuxième grille et sur les parties de ladite couche de matière organique laissées libres par cette deuxième grille, d'une fine couche métallique d'une épaisseur sensiblement plus faible que celle de ladite deuxième grille; - gravure des volets et de leurs attaches dans ladite fine couche métallique; - attaque de ladite couche de matière organique dans les alvéoles de ladite première grille de manière à libérer lesdits volets métalliques et leurs attaches. 1. Method for manufacturing a device comprising a flat support to which are fixed, by elastic fasteners, miniature shutters capable of being controlled in rotation, characterized in that it comprises the following steps: - Realization of a first rigid and thin grid having at least one cell; - Deposition, on said first grid, of a layer of organic material sealing off said cell so as to produce a flat support; - Production, on said layer of organic material, of a second stiffening grid having a thickness substantially less than that of said first grid; - Deposition, on said second grid and on the parts of said layer of organic material left free by this second grid, of a thin metal layer with a thickness substantially less than that of said second grid; - etching of the shutters and their fasteners in said thin metal layer; - Attack of said layer of organic material in the cells of said first grid so as to release said metal flaps and their fasteners. 2. Procédé selon la revendication 1, caractérisé en ce que ladite deuxième grille de rigidification entoure les emplacements qui correspondent aux zones actives desdits volets.2. Method according to claim 1, characterized in that said second stiffening grid surrounds the locations which correspond to the active areas of said flaps. 3. Procédé selon la revendication 1, caractérisé en ce que la surface de ladite couche de matière organique est structurée de manière que lesdits volets et leur support présentent une surface diffusante.3. Method according to claim 1, characterized in that the surface of said layer of organic material is structured so that said flaps and their support have a diffusing surface. 4. Procédé selon la revendication 3, caractérisé en ce que la surface de ladite couche de matière organique est structurée en dehors des emplacements correspondant aux attaches des volets et des zones entourant lesdits volets.4. Method according to claim 3, characterized in that the surface of said layer of organic material is structured outside of the locations corresponding to the fasteners of the flaps and of the zones surrounding said flaps. 5. Procédé selon la revendication 3 ou la revendication 4, caractérisé en ce que la surface de ladite couche de matière organique est structurée à l'aide de procédés photolithographiques5. Method according to claim 3 or claim 4, characterized in that the surface of said layer of organic material is structured using photolithographic methods 6. Procédé selon la revendication 1 ou la revendication 2, caractérisé en ce que, sur ladite couche de matière organique et aux emplacements correspondant aux zones actives des volets, des nervures sont réalisées en vue de rigidifier lesdits volets.6. Method according to claim 1 or claim 2, characterized in that, on said layer of organic material and at the locations corresponding to the active areas of the flaps, ribs are produced in order to stiffen said flaps. 7. Procédé selon la revendication 6, caractérisé en ce que lesdites nervures sont réalisées dans la même matière que ladite deuxième grille.7. Method according to claim 6, characterized in that said ribs are made of the same material as said second grid. 8. Procédé selon la revendication 1 ou la revendication 2, caractérisé en ce que ladite deuxième grille et ladite fine couche métallique sont de la même matière.8. Method according to claim 1 or claim 2, characterized in that said second grid and said thin metal layer are of the same material. 9. Procédé selon la revendication 1, caractérisé en ce que ladite couche de matière organique est un film plastique qui est collé sur ladite première grille.9. Method according to claim 1, characterized in that said layer of organic material is a plastic film which is bonded to said first grid. 10. Procédé selon la revendication 1, caractérisé en ce que ladite couche de matière organique est une matière polymérisable qui est pressée sur ladite première grille puis polymérisée de façon à présenter un support plan.10. The method of claim 1, characterized in that said layer of organic material is a polymerizable material which is pressed on said first grid and then polymerized so as to have a flat support. 11. Procédé selon la revendication 1, caractérisé en ce que ladite couche de matière organique est une matière.polymérisable qui est pressée sur ladite première grille puis polymérisée de façon à présenter un support plan et structuré.11. Method according to claim 1, characterized in that said layer of organic material is a polymerizable material which is pressed on said first grid and then polymerized so as to present a flat and structured support. 12. Procédé selon la revendication 1, caractérisé en ce que ladite première grille est métallique.12. Method according to claim 1, characterized in that said first grid is metallic. 13. Procédé selon la revendication 12, caractérisé en ce que ladite première grille est réalisée à l'aide de procédés photolithographiques.13. Method according to claim 12, characterized in that said first grid is produced using photolithographic methods. 14. Procédé selon la revendication 12 ou la revendication 13, caractérisé en ce que ladite première grille est en aluminium.14. Method according to claim 12 or claim 13, characterized in that said first grid is made of aluminum. 15. Procédé selon la revendication 9, caractérisé en ce que ledit film plastique est du Kapton.15. The method of claim 9, characterized in that said plastic film is Kapton. 16. Procédé selon la revendication 1 ou la revendication 2, caractérisé en ce que ladite deuxième grille est réalisée par des procédés photolithographiques.16. Method according to claim 1 or claim 2, characterized in that said second grid is produced by photolithographic methods. 17. Procédé selon la revendication 1 ou la revendication 16, caractérisé en ce que ladite deuxième grille est en aluminium.17. Method according to claim 1 or claim 16, characterized in that said second grid is made of aluminum. 18. Procédé selon l'une des revendications 1, 2 et 16, caractérisé en ce que les arêtes de ladite deuxième grille sont arrondies par un dip dans un bain d'attaque.18. Method according to one of claims 1, 2 and 16, characterized in that the edges of said second grid are rounded by a dip in an attack bath. 19. Procédé selon la revendication 1, caractérisé en ce que ladite fine couche métallique est déposée par évaporation d'un matériau métallique.19. The method of claim 1, characterized in that said thin metallic layer is deposited by evaporation of a metallic material. 20. Procédé selon la revendication 18, caractérisé en ce que ladite fine couche métallique est en aluminium.20. The method of claim 18, characterized in that said thin metal layer is aluminum. 21. Procédé selon la revendication 1, caractérisé en ce que la gravure des volets et de leurs attaches est faite par des procédés photolithographiques.21. The method of claim 1, characterized in that the etching of the flaps and their fasteners is made by photolithographic methods. 22. Procédé selon la revendication 1, caractérisé en ce que l'attaque de la couche de matière organique est faite dans un plasma en phase gazeuse.22. The method of claim 1, characterized in that the attack of the organic material layer is made in a plasma in the gas phase. 23. Procédé selon la revendication 1, caractérisé en ce que ladite première grille a une épaisseur comprise entre 100 et 300 pm.23. The method of claim 1, characterized in that said first grid has a thickness between 100 and 300 pm. 24. Procédé selon la revendication 1 ou la revendication 2, caractérisé en ce que ladite deuxième grille a une épaisseur comprise entre 0,5 et 2,5 µm.24. The method of claim 1 or claim 2, characterized in that said second grid has a thickness between 0.5 and 2.5 microns. 25. Procédé selon la revendication 1, caractérisé en ce que ladite fine couche métallique a une épaisseur comprise entre 20 et 200 nm.25. The method of claim 1, characterized in that said thin metal layer has a thickness between 20 and 200 nm. 26. Application du procédé selon l'une quelconque des revendications 1 à 25 pour la réalisation d'un dispositif de modulation de la lumière, caractérisée en ce que ladite première grille est fixée sur un fond transparent.26. Application of the method according to any one of claims 1 to 25 for the production of a light modulation device, characterized in that said first grid is fixed on a transparent background. 27. Application du procédé selon l'une quelconque des revendications 1 à 25 pour la réalisation d'un dispositif d'affichage, caractérisée en ce que ladite première grille est fixée sur un fond présentant du côté desdits volets une surface absorbant tout out partie de la lumière reçue.27. Application of the method according to any one of claims 1 to 25 for the production of a display device, characterized in that said first grid is fixed on a bottom having on the side of said flaps a surface absorbing all or part of the light received. 28. Application selon la revendication 26 ou la revendication 27, caractérisée en ce que ledit fond sur lequel est fixée la première grille est porteur d'électrodes disposées en regard desdits volets.28. Application according to claim 26 or claim 27, characterized in that said bottom on which is fixed the first grid carries electrodes arranged opposite said flaps.
EP84810556A 1983-11-18 1984-11-15 Method of producing a microvalve device and application of this method for obtaining a light modulator Withdrawn EP0143079A3 (en)

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CH6199/83A CH654686A5 (en) 1983-11-18 1983-11-18 METHOD FOR MANUFACTURING A DEVICE WITH MINIATURE SHUTTERS AND APPLICATION OF SUCH A METHOD FOR OBTAINING A DEVICE FOR MODULATING LIGHT.
CH6199/83 1983-11-18

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US5078479A (en) * 1990-04-20 1992-01-07 Centre Suisse D'electronique Et De Microtechnique Sa Light modulation device with matrix addressing
CH682523A5 (en) * 1990-04-20 1993-09-30 Suisse Electronique Microtech A modulation matrix addressed light.
WO1994010669A1 (en) * 1992-11-05 1994-05-11 Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. High-resolution display
EP0643378A1 (en) * 1993-09-13 1995-03-15 CSEM, Centre Suisse d'Electronique et de Microtechnique S.A. Light-microshutter array
FR2710161A1 (en) * 1993-09-13 1995-03-24 Suisse Electronique Microtech Miniature network of light shutters.
US5579149A (en) * 1993-09-13 1996-11-26 Csem Centre Suisse D'electronique Et De Microtechnique Sa Miniature network of light obturators
CN115019651A (en) * 2022-06-20 2022-09-06 昆山国显光电有限公司 Curled display module and production process thereof
CN115019651B (en) * 2022-06-20 2023-05-23 昆山国显光电有限公司 Crimping display module and production process thereof

Also Published As

Publication number Publication date
CA1256683A (en) 1989-07-04
US4584056A (en) 1986-04-22
CH654686A5 (en) 1986-02-28
EP0143079A3 (en) 1986-07-30
JPS60120389A (en) 1985-06-27

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