EP0109402A4 - Catalyst solutions for activating non-conductive substrates and electroless plating process. - Google Patents

Catalyst solutions for activating non-conductive substrates and electroless plating process.

Info

Publication number
EP0109402A4
EP0109402A4 EP19830901290 EP83901290A EP0109402A4 EP 0109402 A4 EP0109402 A4 EP 0109402A4 EP 19830901290 EP19830901290 EP 19830901290 EP 83901290 A EP83901290 A EP 83901290A EP 0109402 A4 EP0109402 A4 EP 0109402A4
Authority
EP
European Patent Office
Prior art keywords
electroless plating
plating process
conductive substrates
catalyst solutions
activating non
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19830901290
Other languages
German (de)
French (fr)
Other versions
EP0109402A1 (en
EP0109402B1 (en
Inventor
Harold L Rhodenizer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of EP0109402A1 publication Critical patent/EP0109402A1/en
Publication of EP0109402A4 publication Critical patent/EP0109402A4/en
Application granted granted Critical
Publication of EP0109402B1 publication Critical patent/EP0109402B1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
EP19830901290 1982-05-26 1983-03-02 Catalyst solutions for activating non-conductive substrates and electroless plating process Expired EP0109402B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38194382A 1982-05-26 1982-05-26
US381943 1982-05-26

Publications (3)

Publication Number Publication Date
EP0109402A1 EP0109402A1 (en) 1984-05-30
EP0109402A4 true EP0109402A4 (en) 1984-10-29
EP0109402B1 EP0109402B1 (en) 1988-06-01

Family

ID=23506952

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19830901290 Expired EP0109402B1 (en) 1982-05-26 1983-03-02 Catalyst solutions for activating non-conductive substrates and electroless plating process

Country Status (5)

Country Link
EP (1) EP0109402B1 (en)
JP (1) JPS59500870A (en)
CA (1) CA1199754A (en)
DE (1) DE3376852D1 (en)
WO (1) WO1983004268A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3637130C1 (en) * 1986-10-31 1987-09-17 Deutsche Automobilgesellsch Process for the chemical metallization of textile material
EP0564673B1 (en) * 1992-04-06 1995-10-11 International Business Machines Corporation Process for providing catalytically active metal layers of a metal selected from the platinum metals group
JP4069248B2 (en) * 2002-12-09 2008-04-02 大阪市 Catalyst composition for electroless plating
CN104593751B (en) * 2014-12-27 2017-10-17 广东致卓环保科技有限公司 Copper surface chemical nickel plating super low concentration ionic palladium activating solution and technique
JP6698685B2 (en) * 2015-03-20 2020-05-27 アトテック ドイチェランド ゲーエムベーハー How to activate a silicon substrate
KR101681116B1 (en) * 2016-05-26 2016-12-09 (주)오알켐 Method for electroless copper plating through-hole of printed circuit board and method for preparing a catalytic solution used in method thereof
JPWO2023218728A1 (en) * 2022-05-10 2023-11-16

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3682671A (en) * 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
FR2364958A1 (en) * 1976-09-20 1978-04-14 Kollmorgen Tech Corp PRODUCTS FOR THE ACTIVATION OF SURFACES FOR THEIR METALLIZATION

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3532518A (en) * 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
US3562038A (en) * 1968-05-15 1971-02-09 Shipley Co Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited
US3607352A (en) * 1968-11-29 1971-09-21 Enthone Electroless metal plating
US3672938A (en) * 1969-02-20 1972-06-27 Kollmorgen Corp Novel precious metal sensitizing solutions
US3650913A (en) * 1969-09-08 1972-03-21 Macdermid Inc An electroless plating process employing a specially prepared palladium-tin activator solution
US3767583A (en) * 1971-08-13 1973-10-23 Enthone Activator solutions their preparation and use in electroless plating of surfaces
US3874897A (en) * 1971-08-13 1975-04-01 Enthone Activator solutions, their preparation and use in electroless plating of surfaces
US3904792A (en) * 1972-02-09 1975-09-09 Shipley Co Catalyst solution for electroless metal deposition on a substrate
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
DE2418654A1 (en) * 1974-04-18 1975-11-06 Langbein Pfanhauser Werke Ag PROCESS FOR ELECTRONIC SURFACE METALIZATION OF PLASTIC OBJECTS AND A SUITABLE ACTIVATING BATH TO PERFORM THE PROCESS
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse
DE2659680C2 (en) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Procedure for activating surfaces
US4073981A (en) * 1977-03-11 1978-02-14 Western Electric Company, Inc. Method of selectively depositing metal on a surface
US4182784A (en) * 1977-12-16 1980-01-08 Mcgean Chemical Company, Inc. Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid
IT1107840B (en) * 1978-07-25 1985-12-02 Alfachimici Spa CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3682671A (en) * 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
FR2364958A1 (en) * 1976-09-20 1978-04-14 Kollmorgen Tech Corp PRODUCTS FOR THE ACTIVATION OF SURFACES FOR THEIR METALLIZATION

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO8304268A1 *

Also Published As

Publication number Publication date
JPH0239594B2 (en) 1990-09-06
EP0109402A1 (en) 1984-05-30
WO1983004268A1 (en) 1983-12-08
DE3376852D1 (en) 1988-07-07
EP0109402B1 (en) 1988-06-01
CA1199754A (en) 1986-01-28
JPS59500870A (en) 1984-05-17

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