EP0095172A3 - Chemical etching method - Google Patents

Chemical etching method Download PDF

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Publication number
EP0095172A3
EP0095172A3 EP83105052A EP83105052A EP0095172A3 EP 0095172 A3 EP0095172 A3 EP 0095172A3 EP 83105052 A EP83105052 A EP 83105052A EP 83105052 A EP83105052 A EP 83105052A EP 0095172 A3 EP0095172 A3 EP 0095172A3
Authority
EP
European Patent Office
Prior art keywords
etching method
chemical etching
chemical
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP83105052A
Other versions
EP0095172B1 (en
EP0095172A2 (en
Inventor
Michio Sudo
Hitoshi Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kangyo Denkikiki KK
Original Assignee
Kangyo Denkikiki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kangyo Denkikiki KK filed Critical Kangyo Denkikiki KK
Publication of EP0095172A2 publication Critical patent/EP0095172A2/en
Publication of EP0095172A3 publication Critical patent/EP0095172A3/en
Application granted granted Critical
Publication of EP0095172B1 publication Critical patent/EP0095172B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
EP83105052A 1982-05-24 1983-05-21 Chemical etching method Expired EP0095172B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP87705/82 1982-05-24
JP57087705A JPS58204176A (en) 1982-05-24 1982-05-24 Chemical etching method

Publications (3)

Publication Number Publication Date
EP0095172A2 EP0095172A2 (en) 1983-11-30
EP0095172A3 true EP0095172A3 (en) 1985-06-19
EP0095172B1 EP0095172B1 (en) 1988-02-10

Family

ID=13922326

Family Applications (1)

Application Number Title Priority Date Filing Date
EP83105052A Expired EP0095172B1 (en) 1982-05-24 1983-05-21 Chemical etching method

Country Status (4)

Country Link
US (1) US4470872A (en)
EP (1) EP0095172B1 (en)
JP (1) JPS58204176A (en)
DE (1) DE3375672D1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS616817A (en) * 1984-06-20 1986-01-13 Canon Inc Manufacture of sheet coil
DE3430075A1 (en) * 1984-08-16 1986-02-27 Robert Bosch Gmbh, 7000 Stuttgart METHOD FOR PRODUCING A MEASURING PROBE FOR USE IN MEASURING THE TEMPERATURE OR MASS OF A FLOWING MEDIUM
US4733079A (en) * 1985-12-13 1988-03-22 Lockheed Corporation Method of and apparatus for thermographic identification of parts
US4690833A (en) * 1986-03-28 1987-09-01 International Business Machines Corporation Providing circuit lines on a substrate
DE69111002T2 (en) * 1990-09-20 1995-11-02 Dainippon Screen Mfg Process for making small through holes in thin metal plates.
US5312456A (en) * 1991-01-31 1994-05-17 Carnegie Mellon University Micromechanical barb and method for making the same
US5294520A (en) * 1992-08-25 1994-03-15 International Business Machines Corporation Zero undercut etch process
ES2140310B1 (en) * 1997-07-30 2000-10-16 Mecanismos Aux Es Ind S A IMPROVEMENTS IN THE DESIGNS OF INTERLAYS IN THE PRINTED CIRCUITS OF POWER.
US6280555B1 (en) * 1999-03-30 2001-08-28 Robert L. Wilbur Method of forming a printed circuit board
US7018418B2 (en) * 2001-01-25 2006-03-28 Tecomet, Inc. Textured surface having undercut micro recesses in a surface
US6599322B1 (en) * 2001-01-25 2003-07-29 Tecomet, Inc. Method for producing undercut micro recesses in a surface, a surgical implant made thereby, and method for fixing an implant to bone
US6620332B2 (en) 2001-01-25 2003-09-16 Tecomet, Inc. Method for making a mesh-and-plate surgical implant
CN111526666B (en) * 2020-04-30 2021-07-02 生益电子股份有限公司 PCB manufacturing method
CN114686884B (en) * 2020-12-29 2023-07-07 苏州运宏电子有限公司 Etching area control method for precisely preventing side etching
CN114203544A (en) * 2021-10-31 2022-03-18 苏州焜原光电有限公司 Etching method capable of reducing lateral corrosion degree of wafer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3695955A (en) * 1969-03-14 1972-10-03 Pieter Johannes Wilhelmus Joch Method of manufacturing an electric device e.g. a semiconductor device
US3736197A (en) * 1972-03-29 1973-05-29 Mona Industries Inc Powderless etching bath compositions and additives
JPS5377848A (en) * 1976-12-21 1978-07-10 Showa Denko Kk Etching method that prevent side etch

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3006796A (en) * 1958-04-18 1961-10-31 Jones Graphic Products Of Ohio Etching method
US3544401A (en) * 1967-05-16 1970-12-01 Texas Instruments Inc High depth-to-width ratio etching process
JPS556833A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Cirucit board and method of manufacturing same
JPS5570835A (en) * 1978-11-22 1980-05-28 Hitachi Ltd Photoresist material and etching method
JPS56114319A (en) * 1980-02-14 1981-09-08 Fujitsu Ltd Method for forming contact hole
JPS56131929A (en) * 1980-03-19 1981-10-15 Fujitsu Ltd Selective etching method of laminar structure
JPS5815537B2 (en) * 1980-07-02 1983-03-26 勧業電気機器株式会社 chemical etching method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3695955A (en) * 1969-03-14 1972-10-03 Pieter Johannes Wilhelmus Joch Method of manufacturing an electric device e.g. a semiconductor device
US3736197A (en) * 1972-03-29 1973-05-29 Mona Industries Inc Powderless etching bath compositions and additives
JPS5377848A (en) * 1976-12-21 1978-07-10 Showa Denko Kk Etching method that prevent side etch

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN, Vol.14, No.9, February 1972, page 2607, NEW YORK. (US). L.M. ELIJAH et al.: "Etching technique for minimum undercutting". *
PATENTS ABSTRACTS OF JAPAN, Vol.6, No.9, (E-90)(887) January 20, 1982; & JP-A-56 131 929 (FUJITSU K. K.) 15-10-1981 *

Also Published As

Publication number Publication date
EP0095172B1 (en) 1988-02-10
JPS58204176A (en) 1983-11-28
US4470872A (en) 1984-09-11
DE3375672D1 (en) 1988-03-17
EP0095172A2 (en) 1983-11-30
JPS6237713B2 (en) 1987-08-13

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