EP0066656A1 - Procédé pour la préparation d'une couche de nickel - Google Patents
Procédé pour la préparation d'une couche de nickel Download PDFInfo
- Publication number
- EP0066656A1 EP0066656A1 EP19810302442 EP81302442A EP0066656A1 EP 0066656 A1 EP0066656 A1 EP 0066656A1 EP 19810302442 EP19810302442 EP 19810302442 EP 81302442 A EP81302442 A EP 81302442A EP 0066656 A1 EP0066656 A1 EP 0066656A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- nickel
- glass plate
- nickel salt
- nickel layer
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 78
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 150000002815 nickel Chemical class 0.000 claims abstract description 38
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 25
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000006722 reduction reaction Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 20
- 239000000243 solution Substances 0.000 description 18
- 238000007747 plating Methods 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 239000007864 aqueous solution Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 12
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 4
- 230000003213 activating effect Effects 0.000 description 3
- 239000002738 chelating agent Substances 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- 239000006179 pH buffering agent Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 230000001235 sensitizing effect Effects 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910002666 PdCl2 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000001119 stannous chloride Substances 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JBANFLSTOJPTFW-UHFFFAOYSA-N azane;boron Chemical compound [B].N JBANFLSTOJPTFW-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- -1 diethyl borazane Chemical compound 0.000 description 1
- GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- ZGCHATBSUIJLRL-UHFFFAOYSA-N hydrazine sulfate Chemical compound NN.OS(O)(=O)=O ZGCHATBSUIJLRL-UHFFFAOYSA-N 0.000 description 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- UQPSGBZICXWIAG-UHFFFAOYSA-L nickel(2+);dibromide;trihydrate Chemical compound O.O.O.Br[Ni]Br UQPSGBZICXWIAG-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- BFSQJYRFLQUZKX-UHFFFAOYSA-L nickel(ii) iodide Chemical compound I[Ni]I BFSQJYRFLQUZKX-UHFFFAOYSA-L 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000000176 sodium gluconate Substances 0.000 description 1
- 229940005574 sodium gluconate Drugs 0.000 description 1
- 235000012207 sodium gluconate Nutrition 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Definitions
- the present invention relates to a process for preparing a nickel layer by a chemical plating.
- Glass plates having each thin transparent or translucent metal layer made of silver, nickel or aluminum which reflect or intercept heat radiation of solar or radiant heat have been known as heat radiation reflecting glass plates and have been used as a single glass plate, a double layer glass plate or a laminated glass plate in buildings, vehicles and various apparatuses and instruments.
- the glass plate having a nickel layer has superior heat radiation reflectivity and superior durability to the glass plates having the other metal layer and has a transparent neutral grey color and accordingly, it is one of excellent heat radiation reflecting glass.
- the nickel layer of said glass plate is usually formed by a vacuum evaporation process, a sputtering process, or a chemical plating process.
- the chemical plating process for applying a nickel salt and a reducing agent on a glass plate and reducing said nickel salt by a chemical reaction to form a nickel layer on the glass plate has various advantages that the nickel layer can be formed at an ambient temperature, and it can be formed for a short time in high productivity and it can be easily formed without using an expensive apparatus as required in the vacuum evaporation process or the sputtering process.
- the chemical plating process however, has disadvantages that a rate of deposition is not easily controlled and a nickel layer having a desired thickness or uniform thickness is not easily formed and color unevenness is caused, and pinholes are caused and a uniform dense layer is not easily formed.
- a substrate made of glass, plastic or ceramic etc. is usually treated by a sensitizing treatment or an activating treatment before the chemical plating process of the present invention.
- the typical treatment is a treatment for contacting the substrate with an aqueous solution of a stannous salt after water washing and further contacting it with an aqueous solution of a palladium salt.
- the typical process for preparing a nickel layer on the substrate is a process for spraying or coating a chemical nickel plating solution comprising a nickel salt and a reducing agent and if necessary, the other additive such as a chelating agent, a pH buffering agent, a pH modifier, a stabilizer etc. on the substrate and forming the nickel layer on the substrate by a chemical reduction or a process for spraying both of a nickel plating solution comprising a nickel salt and if necessary the other additive such as a chelating agent, pH buffering agent, a pH modifier etc. and a solution comprising a reducing agent and a stabilizer on a glass surface and forming a nickel layer on the substrate by a chemical reduction.
- the other additive such as a chelating agent, a pH buffering agent, a pH modifier etc.
- the nickel salts used in the process of the present invention can be inorganic or organic water soluble nickel salts such as nickel chloride, nickel sulfate, nickel acetate, nickel bromide, nickel iodide or a mixture of at least two nickel salts.
- the nickel salt is usually used in a form of an aqueous solution. It is also possible to use the nickel salt in a form of an organic solvent solution or a solution of an organic solvent with water.
- a nickel salt it is possible to incorporate a pH modifier which results in an alkaline condition and a chelating agent such as Rochelle salt, EDTA, sodium citrate and sodium gluconate, and a pH buffering agent such as malic acid and/or boric acid so as to easily perform the chemical reduction.
- a pH modifier which results in an alkaline condition and a chelating agent such as Rochelle salt, EDTA, sodium citrate and sodium gluconate, and a pH buffering agent such as malic acid and/or boric acid so as to easily perform the chemical reduction.
- the typical reducing agents can be sodium borohydride, potassium borohydride, formaldehyde, sodium hypophosphite, hydrazine, hydrazinium sulfate, glyoxal, dimethylamine borazane, hydrosulfite, diethyl borazane or a mixture of at least two reducing agents with a stabilizer.
- a concentration of a nickel salt in an aqueous solution of a nickel salt used in the process of the present invention is preferably in a range of about 0.1 to 10%.
- diethylenetriamine, imidazole. or a mixture thereof is incorporated in the chemical reduction of the nickel salt.
- diethylenetriamine, and/or imidazole is incorporated as an additive in a solution of a nickel salt a solution of a reducing agent or a nickel plating solution containing both of a nickel salt and a reducing agent or diethylenetriamine, and/or imidazole is applied in a chemical reduction.
- Diethylenetriamine, and/or imidazole can be present in the chemical reduction of the nickel salt to deposit the nickel layer. Therefore, the other methods of incor p orating the additive can be employed.
- a concentration of diethylenetriamine, and/or imidazole is preferably in a range of 1 to 1,000 ppm based on a solution of a nickel salt when the additive is mixed with the nickel salt.
- An amount of diethylenetriamine, and/or imidazole is in a range of 0.02 to 20 wt. based on the nickel salt.
- a time for plating in the deposition of the nickel layer by the chemical plating process is usually in a range of 30 sec. to 10 min. preferably about 1 min. to 5 min.
- a temperature of the solution of a nickel salt, the solution of a reducing agent or the solution of a nickel salt and a reducing salt in the deposition of the nickel layer by the chemical plating process is usually in a range of 10°C to 60°C especially about 30°C.
- the rate of nickel deposition is varied depending upon the temperature in the chemical plating whereby it is important to maintain the termper- ature in the chemical plating in constant such as in a range of ⁇ 3°C so as to prevent unevenness of color.
- a temperature of the substrate in he chemical plating is usually in a range of 10 to 60°C preferably about room temperature.
- a thickness of the nickel layer formed in the process of the present invention can be selected to be transparent or translucent and to give desired optical characteristics such as desired heat radiation reflectivity and transmissivity etc. and is preferably in a range of 0 100 to 1000 A .
- a composition a flow rate of the plating solution, a plating time and a temperature are selected so as to give a desired thickness of the nickel layer.
- the nickel layer of the present invention it is possible to form a composite layer of nickel and the other metal by incorporating a salt of the other metal such as copper, cobalt, iron, silver, gold and platinum together with the nickel salt.
- a salt of the other metal such as copper, cobalt, iron, silver, gold and platinum
- a glass plate (300 mm x 300 mm x 5 mm) was polished with ceria and rinsed with water.
- An aqueous solution of stannous chloride (SnCl 2 ⁇ 2H 2 O : 1 g/1 liter of water) was sprayed on the surface of the glass plate to perform a sensitizing treatment for 30 seconds and then, the glass plate was rinsed with water and an aqueous solution of palladium chloride (PdCl2 ⁇ nH 2 O : 0.05 g/1 liter of water; 1.0 ml of 35% HCl/1 liter of water) was sprayed on the surface of the glass plate to perform an activating treatment for 30 seconds and then, the glass was rinsed with deionized water.
- PdCl2 ⁇ nH 2 O 0.05 g/1 liter of water
- 1.0 ml of 35% HCl/1 liter of water was sprayed on the surface of the glass plate to perform an activating treatment for 30 seconds and then, the glass was rinse
- aqueous solution of the nickel salt and the solution of the reducing agent (30°C) were respectively sprayed on the treated surface of the glass plate at 30°C by each spray-gun at each rate of 0.64 liter/min. and they were kept for 2 minutes to deposit a nickel layer on the glass plate.
- the resulting nickel layer formed on the glass plate had a thickness of 500 A and was a dense uniform layer without any pinhole and had uniform color distribution shown by the curve (a) in Figure 1 as visible transmissivity T V in the longitudinal direction of the glass plate having nickel layer.
- the optical characteristics of the glass plate are shown in Table 1.
- a glass plate (300 mm x 300 mm x 5 mm) was polished with ceria and rinsed with water.
- An aqueous solution of stannous chloride (SnCl 2 ⁇ 2H 2 O : 1 g./1 liter of water) was sprayed on the surface of the glass plate to perform a sensitizing treatment for 30 seconds and then, the glass plate was rinsed with water and an aqueous solution of palladium chloride (PdCl 2 ⁇ nH 2 O : 0.05 g./1 liter of water; 1.0 mQ of 35% HCl/1 liter of water) was sprayed on the surface of the glass plate to perform an activating treatment for 30 seconds and then, the glass plate was rinsed with deionized water.
- PdCl 2 ⁇ nH 2 O 0.05 g./1 liter of water
- 1.0 mQ of 35% HCl/1 liter of water was sprayed on the surface of the glass plate to perform an activating treatment for 30 seconds and
- aqueous solution of the nickel salt and the solution of the reducing agent (30°C) were respectively sprayed on the treated surface of the glass plate at 30°C by each spray-gun at each rate of 0.64 liter/min. and they were kept for 2 minutes to deposit a nickel layer on the glass plate.
- the resulting nickel layer formed on the glass plate had a thickness of 500 A and was a dense uniform layer without any pinhole and had uniform color distribution shown by the curve (b) in Figure 1.
- the optical characteristics of the glass plate are shown in Table 1.
- Example 2 In accordance with the process of Example 1 except that diethylenetriamine was eliminated from the aqueous solution of the nickel salt, a nickel layer was formed on the surface of the glass plate.
- the resulting nickel layer formed on the glass plate had a thickness of 700 A and had color distribution shown by the curve (c) in Figure 1.
- the optical characteristics were respectively measured under the light incidence from each nickel layer of each sample of glass plate having a thickness of 5 mm.
- the nickel layer having the uniform color distribution and less pinhole can be obtained in accordance with the process of the present invention.
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8181302442T DE3172414D1 (en) | 1981-06-02 | 1981-06-02 | Process for preparing nickel layer |
EP19810302442 EP0066656B1 (fr) | 1981-06-02 | 1981-06-02 | Procédé pour la préparation d'une couche de nickel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19810302442 EP0066656B1 (fr) | 1981-06-02 | 1981-06-02 | Procédé pour la préparation d'une couche de nickel |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0066656A1 true EP0066656A1 (fr) | 1982-12-15 |
EP0066656B1 EP0066656B1 (fr) | 1985-09-25 |
Family
ID=8188317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19810302442 Expired EP0066656B1 (fr) | 1981-06-02 | 1981-06-02 | Procédé pour la préparation d'une couche de nickel |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0066656B1 (fr) |
DE (1) | DE3172414D1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0067257B1 (fr) * | 1981-06-15 | 1986-02-05 | Asahi Glass Company Ltd. | Verre réfléchissant la radiation de chaleur et procédé pour sa fabrication |
EP0102874B1 (fr) * | 1982-07-30 | 1986-12-03 | Office National d'Etudes et de Recherches Aérospatiales (O.N.E.R.A.) | Bain pour le dépôt chimique de nickel et/ou de cobalt utilisant un réducteur à base de bore ou de phosphore |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD125143A1 (fr) * | 1975-12-31 | 1977-04-06 | ||
US4204013A (en) * | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
-
1981
- 1981-06-02 EP EP19810302442 patent/EP0066656B1/fr not_active Expired
- 1981-06-02 DE DE8181302442T patent/DE3172414D1/de not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD125143A1 (fr) * | 1975-12-31 | 1977-04-06 | ||
US4204013A (en) * | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0067257B1 (fr) * | 1981-06-15 | 1986-02-05 | Asahi Glass Company Ltd. | Verre réfléchissant la radiation de chaleur et procédé pour sa fabrication |
EP0102874B1 (fr) * | 1982-07-30 | 1986-12-03 | Office National d'Etudes et de Recherches Aérospatiales (O.N.E.R.A.) | Bain pour le dépôt chimique de nickel et/ou de cobalt utilisant un réducteur à base de bore ou de phosphore |
Also Published As
Publication number | Publication date |
---|---|
DE3172414D1 (en) | 1985-10-31 |
EP0066656B1 (fr) | 1985-09-25 |
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