EP0053968B1 - Elektrische Verbindungsvorrichtung mit hoher Kontaktdichte - Google Patents
Elektrische Verbindungsvorrichtung mit hoher Kontaktdichte Download PDFInfo
- Publication number
- EP0053968B1 EP0053968B1 EP81401870A EP81401870A EP0053968B1 EP 0053968 B1 EP0053968 B1 EP 0053968B1 EP 81401870 A EP81401870 A EP 81401870A EP 81401870 A EP81401870 A EP 81401870A EP 0053968 B1 EP0053968 B1 EP 0053968B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- elements
- substrate
- pads
- blades
- contact surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 40
- 238000009877 rendering Methods 0.000 claims 1
- 239000011324 bead Substances 0.000 description 10
- 230000008901 benefit Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
Definitions
- the invention relates to an electrical connection device with a high density of contacts.
- substrates A significant example of an electrical connection with high contact density will be given with reference to the plates forming supports for integrated circuit devices, generally called "substrates".
- the face of the substrates which carries the integrated circuit devices includes a network of interconnection conductors of these devices, and peripheral contact pads constituting the input-output terminals of the substrates.
- the substrates are themselves mounted on printed circuit boards intended for their electrical interconnection and consequently provided with studs intended to cooperate with the respective pads of the substrates, by means of electrical connection devices.
- connection of the contact pads on one side of the substrate to the corresponding pads of a printed circuit board is made by means of a device set up from a comb made up of equidistant parallel pins, with the pitch of the pads and the studs.
- the pins form a clamp enclosing the corresponding side of the substrate while making contact, by welding, with the pads arranged on this side; on the card, the other ends of the pins are welded to the studs, the pins being kept equidistant by means of an insulating bar or an insulating binder.
- This connection device had the advantage of being flexible, reliable and removable, qualities which are particularly important for this kind of connection, as will appear later.
- the conductors of the interconnection network and the contact pads that a substrate comprises must likewise be increasingly dense in order to fully benefit from the advantages of large-scale integration. and the resulting miniaturization of integrated circuit devices.
- the substrates currently under study are square plates of approximately 80 mm on a side, comprising 150 contact pads on each side, with a pitch of 0.5 mm and approximately 0.3 mm in width.
- connection device The removability of the connection device is an essential factor, given the high price of a substrate equipped with large-scale integrated circuit devices.
- the replacement of a faulty substrate on a printed circuit board, with a view to its repair and subsequent reuse, must not alter the quality and reliability of the connection to the pads and the pads, both from an electrical point of view. than mechanical.
- the fineness of the contacts and the pads, and their not particularly restricted steps in the case of current substrates, constitute a great difficulty for the desired removability.
- connection device mainly in the context of maintenance, account is taken of the ease of setting up the connection device and of replacing it, if possible without the intervention of expensive or bulky equipment.
- connection device is necessary for the following main reasons.
- the substrates are not always planar; for example, the various firings they undergo for the solidification of the insulating and conductive layers of the interconnection network deposited by screen printing are likely to alter more or less, locally or globally, their initial flatness.
- printed circuit boards of large surface area since they are designed to support up to approximately ten substrates, have a relative flexibility.
- the areas of the substrates and the pads of the cards do not always have a regular thickness. Under these conditions, the connection device must be flexible enough to establish an effective connection despite the flatness defects of the substrates and of the cards entering a predetermined tolerance zone and the slight variations in levels between ranges and between pads.
- connection elements extending along parallel planes in a support sheath, these elements being both conductive and shaped to be elastic so as to absorb all the stresses exerted on these elements during connection.
- the invention relates to an electrical connection device suitable for high contact densities, while satisfying the conditions of removability, flexibility and ease of execution and installation which have just been described.
- An electrical connection device is of the type comprising a plurality of conductive elements electrically isolated from each other, provided with elastic means and extending in parallel planes in a support means with respect to which they each present two contact surfaces, characterized in that said elements are rigid conductive strips extending in said planes and in that said elastic means are beads or strips which hold said strips in said support means by making them elastically movable in rotation in their plan independently of each other.
- the strips can move independently of each other in a perpendicular plane to the direction of the sheath, thus giving the connection device the required flexibility and independence with respect to surface defects of the substrates and of the cards and of the level variations between pads and between ranges.
- the blades being supported together over a large surface, they can be very thin while having sufficiently rigid contact surfaces and which can also be provided with gilding. The compactness of the elements which results therefrom, is added to the fact that the elastic means can be two simple rubber bands contained in a sheath of small bulk.
- FIG 1 there is shown, by a schematic side view, two electrical connection devices with high contact density according to the invention (10) connecting the electrical circuits of a substrate (11) carrier of integrated circuit devices (12) to a printed circuit board (13).
- the card (13) shown is only limited to the part supporting the substrate (11), it being understood that in reality a printed circuit board is capable of receiving up to about ten substrates in the same manner as that illustrated in Figure 1.
- the substrate (11) is assumed to cooperate with the card (13) only by its two opposite sides to which are added in Figure 1 the two respective connection devices (10) , when in reality each of the four sides of a substrate is connected to the card by a connection device such as (10).
- the face of the substrate (11) which carries the integrated circuit devices (12) is provided with a network of interconnection conductors (14) leading to generally aligned contact pads (15) near the edges of the substrate.
- the other side of the substrate usually receives a finned radiator (16) for dissipating the heat produced by the devices (12).
- the printed circuits (17) which it generally presents on one of its faces includes studs (18) arranged to be connected respectively to the pads (15) of a substrate (11).
- the two devices (10) according to the invention are of a type similar to that illustrated for example in Figure 4, that is to say establishing only a simple electrical connection by contacts under the effect of pressure, so that these connection devices must be associated with a mechanical fixing system of the substrate to the card which, preferably, will simultaneously exert the pressure necessary for the electrical connection devices (10 ).
- the two fixing systems (19) relating to the two electrical connection devices (10) are clamping systems consisting essentially of two flanges (20, 21) cooperating respectively with the card (13) and the substrate (11) and enclosing a connection device (10) by means of two fixing members (22) arranged at the two respective ends of the flanges (20, 21).
- the fixing members (22) each consist of a threaded rod (23) passing through the ends of the flanges (20 and 21) through orifices (24) and comprising at each end clamping nuts (25). If the pressure exerted on the contacts of the connection device (10) must be relatively constant over the entire length of a side of the substrate (11), advantage will be taken of the system (19) by ensuring that at least one of the flanges (20, 21) takes, in the rest position, the shape illustrated by the blade 21 in the figure 3B.
- the shape that the flange 21 takes at rest is substantially equivalent to the elastic deformation of an initially rectilinear beam, of uniform section and of the same length as the flange (21), placed on two simple supports spaced apart by this length, namely the length which separates the two threaded rods (23) in the example of FIG. 3A, and uniformly loaded over this length, the clamping force applied to each end of the flange (21) then having to correspond substantially to half of the load uniformly distributed on this beam.
- FIG. 4 shows a first embodiment of an electrical connection device (10) according to the invention, seen in a section in the Oxz plane.
- the device (10) illustrated consists of a sheath (26) of rectangular parallelepiped shape extending along the axis Oy and having two openings (27, 28) formed in the direction Oy in the two walls opposite of the sheath (26) which are intended to come respectively vis-à-vis with the pads (15) of the substrate (11) and the pads (18) of the card (13) of Figure 1.
- each element (29) comprises a conductive strip (30) provided with two tabs (31, 32) ending in two contact surfaces (31a, 32a) emerging at least partially from the sheath (26) through the respective openings (27, 28) in the plane of the corresponding blade (30).
- the contact surfaces (31a, 32a) will include a gilding (33) or a similar coating facilitating electrical contact.
- the blades (30) are separated from each other by electrically insulating elements (34).
- These elements can be insulating sheets or, advantageously, layers respectively disposed on at least one face of the blades (30).
- the elements (34) are insulating layers deposited on only one face of each conductive strip (30), at least with the exception of the surfaces of the strips provided with gilding (33).
- the two faces of each strip comprise at least partially two respective layers of insulation (34a, 34b), so that each insulating element (34) separating two neighboring conducting strips (30) is then composed of two insulating layers (34a and 34b) integral with the two faces opposite the conductive strips (30).
- each element 29 is composed of a strip (30) and the two insulating layers (34a and 34b).
- elastic means are incorporated between the sheath (26) and the stack of elements (29) to urge the contact surfaces (31a, 32a) of the James (30) towards the outside of the sheath through the respective openings (27, 28).
- these elastic means are formed of two strips or beads (35, 36) made of a flexible material such as rubber. These two beads extend parallel to the openings (27, 28) and are held in position, by means of grooves (37) formed in the sheath (26) and corresponding grooves (38) in the side walls of the blades (30 ) and possibly insulating elements (34), as illustrated.
- FIG. 6 represents the connection device (10) illustrated in FIG. 4 when it is tightened, in a manner analogous to FIG. 1, between the pads (15) of a substrate (11) and the studs (18) of a card (13) by means of a clamping system (19) with two flanges (20, 21) similar to that shown in FIGS. 3A and 3B. It appears from FIG. 6 that the conductive blades (30) tilt more or less to establish themselves in fixed contact positions, as illustrated, by exerting reaction forces on the pads (15) and the pads (18) respectively. produced by the elastic beads (35, 36) in opposition to the clamping force exerted by the flanges (20 and 21).
- each blade (30) will tilt more or less. Because the elements (29) are stacked, they tilt independently of each other, by simple friction between them (for example, between an insulating layer (34) of a blade (30) and the following blade (30) in the example of FIG. 5A and between the two adjacent insulating layers (34a, 34b) of two successive strips (30) in the example of FIG. 5B).
- Another advantage of using a device according to the invention resides in the fact that the tilting of the blades has repercussions by a slight stroke of the contact surfaces (31a, 32a) against the pad (15) and the stud ( 18) corresponding, which produces a so-called self-cleaning effect, ensuring a frank connection between the elements in contact.
- the latter can be subjected to a slight twist around the axis Oy to match the shapes of the surfaces of the substrate (11) and of the card (13), without altering the quality of the connection.
- the device (10) can tolerate slight deformations in the Oz direction which, in practice, will not affect the quality of the connection. Furthermore, since the elements (29) stacked in the device (10) can support each other over practically the entire surface of the blades, with the exception of course of the contact surfaces (31 a and 32a) of the blades ( 30), these can be made very fine while giving the contact surfaces the required rigidity, which is moreover generally increased by the contact gilding (33). It follows that a device connection according to the invention can very well be adapted to an electrical connection with high contact density, such as the density given by way of example in the first part of this description (ranges and pads of 0.3 mm, at 0.5 mm pitch).
- the clamping of the flanges (20 and 21) is adjusted to apply a given force, 100 grams for example, on each contact surface (31a and 32a) of a blade (30), in order to ensure a reliable contact of good quality between the blades and the corresponding pads and pads. Thanks to the clamping system illustrated in FIG. 3B, it has been seen that this pressure can be uniformly distributed over all the contacts of the device.
- the pressure received by the contact surfaces (31a and 32a) of each blade (30) is transmitted by the beads (35 and 36) to the corresponding walls of the sheath (26) of the device (10).
- FIG. 7 shows a device in accordance with the invention (10a), in every point similar to that of FIG. 4, except for the arrangement of the beads (35 and 36) on the side walls of the sheath (26).
- the device (10a) can thus be more flattened than the device (10) shown in FIG. 4, but the side walls of the sheath must be thick enough to resist the pressures transmitted by the contact surfaces (31a and 32a) of the blades (30) of the device.
- FIG. 8 illustrates, in a manner similar to FIGS. 4 and 7, an alternative embodiment of a connection device according to the invention.
- the device (10b) has a structure similar to that of FIG. 4, so that its elements are referenced by the same numbers as those indicated in FIG. 4.
- the lateral edges blades (30) are segments of a circle of center 39 and cooperate with the inner lateral faces of the sheath (26), also shaped into segments of concentric circles.
- the blades are substantially rectangular and their contact surfaces (31 and 32) are two vertices of the blades instead of being the ends of the legs as in the device (10).
- the device (10b) can be more compact and more robust than the device (10).
- the blades pivot around the center (39) so that the deformations of the elastic elements (the beads 35 and 36) are practically only made along the axis Oz in the example of FIG. 8, while in the device (10) the deformations are the result of two components along Ox and Oz.
- FIG. 9 illustrates, in a manner analogous to FIG. 6, an alternative embodiment (10d) of a device according to the invention connecting the pads (15) of a substrate (11) to the studs (18) d '' a card (13), the tracks (15) and the studs (18) being side by side and no longer opposite as in the cases corresponding to Figures 1 to 8.
- the device (10d) has a lot of similarity with the device (10) and is mainly distinguished from the latter only by the fact that the contact tabs (31 and 32) are arranged on a same side of the sheath (26).
- the elastic elements consist of three beads (35, 36 and 41).
- the clamp (21) of a clamping system similar to that of FIG. 3B is then directly applied to the wall of the sheath (26) which is opposite to the wall having the contact surfaces (31a a and 32a) .
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8025861A FR2495846A1 (fr) | 1980-12-05 | 1980-12-05 | Dispositif de connexion electrique a haute densite de contacts |
FR8025861 | 1980-12-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0053968A1 EP0053968A1 (de) | 1982-06-16 |
EP0053968B1 true EP0053968B1 (de) | 1985-01-30 |
Family
ID=9248720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP81401870A Expired EP0053968B1 (de) | 1980-12-05 | 1981-11-25 | Elektrische Verbindungsvorrichtung mit hoher Kontaktdichte |
Country Status (5)
Country | Link |
---|---|
US (1) | US4445735A (de) |
EP (1) | EP0053968B1 (de) |
JP (1) | JPS57121176A (de) |
DE (1) | DE3168702D1 (de) |
FR (1) | FR2495846A1 (de) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4534606A (en) * | 1983-08-02 | 1985-08-13 | Amp Incorporated | Connector for printed circuit boards |
US4653823A (en) * | 1985-09-13 | 1987-03-31 | At&T Information Systems, Inc. | Electrical connector apparatus |
JPH0349420Y2 (de) * | 1985-12-28 | 1991-10-22 | ||
US4793814A (en) * | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
US4695258A (en) * | 1986-12-09 | 1987-09-22 | Cherne Industries, Inc. | Connector assembly for electrically connecting flexible and rigid printed circuits |
US4850883A (en) * | 1987-05-21 | 1989-07-25 | Intel Corporation | High density flexible circuit connector |
US5033970A (en) * | 1987-09-24 | 1991-07-23 | Elastomeric Technologies, Inc. | Self-mounted chip carrier |
FR2636491B1 (fr) * | 1988-09-15 | 1995-07-21 | Alcatel Radiotelephone | Contact electrique pour circuits imprimes equipes de composants montes en surface, et circuit imprime comportant au moins un tel contact |
US4952156A (en) * | 1989-02-23 | 1990-08-28 | Amp Incorporated | Connector and a method of manufacturing a plurality of contact terminals mounted on a continuous carrier strip |
US4998886A (en) * | 1989-07-07 | 1991-03-12 | Teledyne Kinetics | High density stacking connector |
US5096426A (en) * | 1989-12-19 | 1992-03-17 | Rogers Corporation | Connector arrangement system and interconnect element |
JPH0424292U (de) * | 1990-06-22 | 1992-02-27 | ||
US5123848A (en) * | 1990-07-20 | 1992-06-23 | Cray Research, Inc. | Computer signal interconnect apparatus |
US5634801A (en) * | 1991-01-09 | 1997-06-03 | Johnstech International Corporation | Electrical interconnect contact system |
US5749738A (en) * | 1991-01-09 | 1998-05-12 | Johnstech International Corporation | Electrical interconnect contact system |
US5207584A (en) * | 1991-01-09 | 1993-05-04 | Johnson David A | Electrical interconnect contact system |
US5388996A (en) * | 1991-01-09 | 1995-02-14 | Johnson; David A. | Electrical interconnect contact system |
US5069629A (en) * | 1991-01-09 | 1991-12-03 | Johnson David A | Electrical interconnect contact system |
DE69216658T2 (de) * | 1991-02-25 | 1997-08-07 | Canon Kk | Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente |
US5309324A (en) * | 1991-11-26 | 1994-05-03 | Herandez Jorge M | Device for interconnecting integrated circuit packages to circuit boards |
US5226823A (en) * | 1992-01-09 | 1993-07-13 | Teledyne Kinectics | Indexing mechanism for precision alignment of electrical contacts |
US5259767A (en) * | 1992-07-10 | 1993-11-09 | Teledyne Kinetics | Connector for a plated or soldered hole |
US20050062492A1 (en) * | 2001-08-03 | 2005-03-24 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US5395249A (en) * | 1993-06-01 | 1995-03-07 | Westinghouse Electric Corporation | Solder-free backplane connector |
US5336094A (en) * | 1993-06-30 | 1994-08-09 | Johnstech International Corporation | Apparatus for interconnecting electrical contacts |
US5484295A (en) * | 1994-04-01 | 1996-01-16 | Teledyne Electronic Technologies | Low profile compression electrical connector |
US5645433A (en) * | 1994-05-09 | 1997-07-08 | Johnstech International Corporation | Contacting system for electrical devices |
US5594355A (en) * | 1994-07-19 | 1997-01-14 | Delta Design, Inc. | Electrical contactor apparatus for testing integrated circuit devices |
DE19618717C1 (de) * | 1996-05-09 | 1998-01-15 | Multitest Elektronische Syst | Elektrische Verbindungseinrichtung |
US5947749A (en) * | 1996-07-02 | 1999-09-07 | Johnstech International Corporation | Electrical interconnect contact system |
US5888075A (en) * | 1997-02-10 | 1999-03-30 | Kabushiki Kaisha Nihon Micronics | Auxiliary apparatus for testing device |
US6019612A (en) * | 1997-02-10 | 2000-02-01 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus for electrically connecting a device to be tested |
WO1998050985A1 (en) * | 1997-05-06 | 1998-11-12 | Gryphics, Inc. | Multi-mode compliant connector and replaceable chip module utilizing the same |
US5938451A (en) * | 1997-05-06 | 1999-08-17 | Gryphics, Inc. | Electrical connector with multiple modes of compliance |
US6409521B1 (en) | 1997-05-06 | 2002-06-25 | Gryphics, Inc. | Multi-mode compliant connector and replaceable chip module utilizing the same |
US5913687A (en) * | 1997-05-06 | 1999-06-22 | Gryphics, Inc. | Replacement chip module |
SG88739A1 (en) * | 1997-05-15 | 2002-05-21 | Nihon Micronics Kk | Auxiliary apparatus for testing device |
US6529025B1 (en) * | 1997-09-18 | 2003-03-04 | Johnstech International Corporation | Electrical continuity enhancement for sockets/contactors |
US6019644A (en) * | 1997-10-14 | 2000-02-01 | Teledyne Industries, Inc. | Electrical step connector assembly and method for manufacture |
JP4298068B2 (ja) * | 1998-08-18 | 2009-07-15 | セイコーエプソン株式会社 | 電気光学装置およびそれらを備えた電子機器並びに電気光学装置の製造方法 |
US6310398B1 (en) | 1998-12-03 | 2001-10-30 | Walter M. Katz | Routable high-density interfaces for integrated circuit devices |
AU2637400A (en) | 1999-02-02 | 2000-08-25 | Gryphics, Inc. | Low or zero insertion force connector for printed circuit boards and electrical devices |
US6830460B1 (en) * | 1999-08-02 | 2004-12-14 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
AU2001232772A1 (en) * | 2000-01-20 | 2001-07-31 | Gryphics, Inc. | Flexible compliant interconnect assembly |
US6957963B2 (en) * | 2000-01-20 | 2005-10-25 | Gryphics, Inc. | Compliant interconnect assembly |
US6299460B1 (en) * | 2000-04-14 | 2001-10-09 | Hewlett Packard Company | Spring-loaded backing plate assembly for use with land grid array-type devices |
US6734688B1 (en) | 2000-05-15 | 2004-05-11 | Teradyne, Inc. | Low compliance tester interface |
US6350153B1 (en) * | 2000-06-16 | 2002-02-26 | Leeno Ind Inc | Electrical connector for connecting an integrated circuit to a printed circuit board |
KR100351676B1 (ko) | 2000-10-12 | 2002-09-05 | 주식회사 우영 | 콘택핀 및 이것을 구비한 집적회로 패키지 테스트용 소켓 |
US6375475B1 (en) * | 2001-03-06 | 2002-04-23 | International Business Machines Corporation | Method and structure for controlled shock and vibration of electrical interconnects |
US6386890B1 (en) * | 2001-03-12 | 2002-05-14 | International Business Machines Corporation | Printed circuit board to module mounting and interconnecting structure and method |
US6485311B2 (en) * | 2001-03-20 | 2002-11-26 | International Business Machines Corporation | Compression connector actuation system |
US6604950B2 (en) | 2001-04-26 | 2003-08-12 | Teledyne Technologies Incorporated | Low pitch, high density connector |
US6585527B2 (en) | 2001-05-31 | 2003-07-01 | Samtec, Inc. | Compliant connector for land grid array |
JP2005524239A (ja) * | 2002-04-29 | 2005-08-11 | シリコン・パイプ・インコーポレーテッド | ダイレクト・コネクト形信号システム |
US7750446B2 (en) | 2002-04-29 | 2010-07-06 | Interconnect Portfolio Llc | IC package structures having separate circuit interconnection structures and assemblies constructed thereof |
US6891272B1 (en) | 2002-07-31 | 2005-05-10 | Silicon Pipe, Inc. | Multi-path via interconnection structures and methods for manufacturing the same |
US7014472B2 (en) * | 2003-01-13 | 2006-03-21 | Siliconpipe, Inc. | System for making high-speed connections to board-mounted modules |
EP1642364A1 (de) * | 2003-07-07 | 2006-04-05 | Gryphics, Inc. | Normal geschlossener nullkraftsteckverbinder |
US7121842B2 (en) * | 2004-01-13 | 2006-10-17 | Kabushiki Kaisha Nihon Micronics | Electrical connector |
WO2006114895A1 (ja) * | 2005-04-21 | 2006-11-02 | Kabushiki Kaisha Nihon Micronics | 電気的接続装置 |
JP4508947B2 (ja) * | 2005-05-30 | 2010-07-21 | Okiセミコンダクタ株式会社 | 半導体装置の自動設計方法および自動設計装置 |
TWI337511B (en) * | 2007-08-02 | 2011-02-11 | Asustek Comp Inc | Electronic device and elastic sheet unit thereof |
JP2009043591A (ja) * | 2007-08-09 | 2009-02-26 | Yamaichi Electronics Co Ltd | Icソケット |
TW201027849A (en) * | 2009-01-13 | 2010-07-16 | Yi-Zhi Yang | Connector |
US8766426B2 (en) * | 2010-09-24 | 2014-07-01 | Stats Chippac Ltd. | Integrated circuit packaging system with warpage control and method of manufacture thereof |
FR2967452B1 (fr) | 2010-11-16 | 2012-11-16 | Vam Drilling France | Dispositif de raccordement electrique entre composants tubulaires de garniture de forage, composant et jonction correspondante |
KR20150065843A (ko) * | 2012-11-07 | 2015-06-15 | 오므론 가부시키가이샤 | 접속 단자 및 이것을 이용한 도통 검사 기구 |
JP6141131B2 (ja) * | 2013-07-17 | 2017-06-07 | 株式会社エンプラス | 電気的接続装置 |
JP6132687B2 (ja) * | 2013-07-17 | 2017-05-24 | 株式会社エンプラス | 電気的接続装置 |
US9343830B1 (en) * | 2015-06-08 | 2016-05-17 | Xcerra Corporation | Integrated circuit chip tester with embedded micro link |
US10128591B2 (en) * | 2015-09-08 | 2018-11-13 | Intel Corporation | Electrical connector |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL293350A (de) * | 1958-09-25 | |||
US3215968A (en) * | 1960-12-21 | 1965-11-02 | Adolf L Herrmann | Printed circuit board connector |
DE2423070A1 (de) * | 1973-07-06 | 1975-01-23 | Siemens Ag | Anordnung eines leistungshalbleiters |
US4008300A (en) * | 1974-10-15 | 1977-02-15 | A & P Products Incorporated | Multi-conductor element and method of making same |
US4008519A (en) * | 1975-02-11 | 1977-02-22 | Amp Incorporated | Elastomeric connector and its method of manufacture |
FR2306547A1 (fr) * | 1975-04-04 | 1976-10-29 | Fovel Michel | Dispositif de connexion pour raccorder electriquement des conducteurs |
DE2638909A1 (de) * | 1976-08-28 | 1978-03-02 | Semikron Gleichrichterbau | Halbleiteranordnung |
CA1102010A (en) * | 1977-08-12 | 1981-05-26 | International Business Machines Corporation | Magnetic heat sink for semiconductor ship |
US4199209A (en) * | 1978-08-18 | 1980-04-22 | Amp Incorporated | Electrical interconnecting device |
US4161346A (en) * | 1978-08-22 | 1979-07-17 | Amp Incorporated | Connecting element for surface to surface connectors |
US4176895A (en) * | 1978-09-27 | 1979-12-04 | Burroughs Corporation | High density double contacting connector assembly for leadless integrated circuit packages |
US4202588A (en) * | 1978-11-29 | 1980-05-13 | Technical Wire Products | Electrical connector and support means therefor |
US4278990A (en) * | 1979-03-19 | 1981-07-14 | General Electric Company | Low thermal resistance, low stress semiconductor package |
US4344662A (en) * | 1979-04-30 | 1982-08-17 | Technical Wire Products, Inc. | Retainer for elastomeric electrical connector |
-
1980
- 1980-12-05 FR FR8025861A patent/FR2495846A1/fr active Granted
-
1981
- 1981-11-25 EP EP81401870A patent/EP0053968B1/de not_active Expired
- 1981-11-25 DE DE8181401870T patent/DE3168702D1/de not_active Expired
- 1981-12-02 US US06/326,530 patent/US4445735A/en not_active Expired - Lifetime
- 1981-12-04 JP JP56194638A patent/JPS57121176A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
EP0053968A1 (de) | 1982-06-16 |
FR2495846B1 (de) | 1984-01-06 |
JPH0250589B2 (de) | 1990-11-02 |
FR2495846A1 (fr) | 1982-06-11 |
JPS57121176A (en) | 1982-07-28 |
US4445735A (en) | 1984-05-01 |
DE3168702D1 (en) | 1985-03-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0053968B1 (de) | Elektrische Verbindungsvorrichtung mit hoher Kontaktdichte | |
EP0055640B1 (de) | Klemmanordnung für aufeinandergelegte Elemente ausgerichteter Gruppen, insbesondere für die elektrische Verbindung leitender Elemente | |
EP0310463A1 (de) | Gehäuse für einen hochintegrierten Schaltkreis | |
FR2722617A1 (fr) | Contacts electriques a ressort plein pour des connecteurs et des sondes electriques | |
EP0145542B1 (de) | Verbinder mit kräftefreier Einfügung für einen rechteckigen Chipträger und Anschliessklemme für einen solchen Verbinder | |
FR2669149A1 (fr) | Connecteur intermediaire entre carte de circuit imprime et substrat a circuits electroniques actifs. | |
FR2759493A1 (fr) | Dispositif de puissance a semiconducteur | |
EP0926935B1 (de) | Vorrichtung und Verfahren zur Verbindung zwischen zwei elektronischen Anordnungen | |
FR2503475A1 (fr) | Barre omnibus de haute capacite | |
FR2568419A1 (fr) | Microconnecteur a haute densite de contacts. | |
FR3039329A1 (fr) | Composant electronique comprenant au moins une patte de connexion | |
EP2123137B1 (de) | Elektronikkarte und flugzeug damit | |
FR2683397A1 (fr) | Douille electrique pour interconnecter des circuits sur une puce et des circuits sur un substrat. | |
EP0083265A1 (de) | Verbindungsträger eines integrierten Schaltungsgehäuses auf einer gedruckten Schaltung, und Verbindungssystem mit solchem Träger | |
EP0023165B1 (de) | Tragplatte für Leitergitter, insbesondere für integriertes Schaltungsgehäuse, und Gehäuse mit solcher Tragplatte | |
EP0239434B1 (de) | Serieller Thermoschreibkopf für einen Drucker | |
EP0637826B1 (de) | Leistungswiderstand mit Vorrichtung zur Aufbringung unter Druck auf einer Wärmesenke | |
FR2816764A1 (fr) | Dispositif de raccordement pour deux cables electriques | |
FR2843654A1 (fr) | Agencement pour le raccordement electrique d'un composant sur la face superieure d'une plaque a circuits imprimes | |
EP1371113B1 (de) | Stromverbinder für eine gedruckte schaltung | |
FR2762145A1 (fr) | Procede et dispositif de mise en contact d'une patte avec un ruban conducteur | |
BE848550A (fr) | Connecteur electrique | |
EP0269522A1 (de) | Vorrichtung zur elektrischen Verbindung, besonders für Flüssigkristall-Sichtanzeige | |
FR2495835A1 (fr) | Dispositif a circuits integres a reseau metallique d'interconnexion, et procede de fabrication de ce dispositif | |
FR2655484A1 (fr) | Ensemble connecteur pour puces a circuits integres et modules de contact pour cet ensemble. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Designated state(s): CH DE FR GB IT LI NL |
|
17P | Request for examination filed |
Effective date: 19820908 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: CII HONEYWELL BULL |
|
ITF | It: translation for a ep patent filed | ||
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Designated state(s): CH DE FR GB IT LI NL |
|
REF | Corresponds to: |
Ref document number: 3168702 Country of ref document: DE Date of ref document: 19850314 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
ITTA | It: last paid annual fee | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20001027 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 20001030 Year of fee payment: 20 Ref country code: DE Payment date: 20001030 Year of fee payment: 20 Ref country code: CH Payment date: 20001030 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20001128 Year of fee payment: 20 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20011124 Ref country code: GB Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20011124 Ref country code: CH Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20011124 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20011125 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: PE20 Effective date: 20011124 |
|
NLV7 | Nl: ceased due to reaching the maximum lifetime of a patent |
Effective date: 20011125 |