EP0051311B1 - Compositions durcissable pormant une seule phase - Google Patents
Compositions durcissable pormant une seule phase Download PDFInfo
- Publication number
- EP0051311B1 EP0051311B1 EP81109480A EP81109480A EP0051311B1 EP 0051311 B1 EP0051311 B1 EP 0051311B1 EP 81109480 A EP81109480 A EP 81109480A EP 81109480 A EP81109480 A EP 81109480A EP 0051311 B1 EP0051311 B1 EP 0051311B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- composition
- epoxy
- formula
- carbon atoms
- epoxycyclohexylmethyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 39
- 229920005862 polyol Polymers 0.000 claims abstract description 19
- 150000003077 polyols Chemical class 0.000 claims abstract description 19
- 150000002924 oxiranes Chemical class 0.000 claims description 27
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 239000004848 polyfunctional curative Substances 0.000 claims description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- 125000003700 epoxy group Chemical group 0.000 claims description 9
- 150000008064 anhydrides Chemical class 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 150000007519 polyprotic acids Polymers 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical group C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 4
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000001424 substituent group Chemical group 0.000 claims description 2
- 230000000704 physical effect Effects 0.000 abstract description 2
- 239000002253 acid Substances 0.000 description 10
- -1 vinyl halide Chemical class 0.000 description 10
- 150000007513 acids Chemical class 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 5
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 5
- 229960001231 choline Drugs 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- ARXKVVRQIIOZGF-UHFFFAOYSA-N 1,2,4-butanetriol Chemical compound OCCC(O)CO ARXKVVRQIIOZGF-UHFFFAOYSA-N 0.000 description 2
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- GGNQRNBDZQJCCN-UHFFFAOYSA-N benzene-1,2,4-triol Chemical compound OC1=CC=C(O)C(O)=C1 GGNQRNBDZQJCCN-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 150000003022 phthalic acids Chemical class 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 239000004632 polycaprolactone Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- KQTIIICEAUMSDG-UHFFFAOYSA-N tricarballylic acid Chemical compound OC(=O)CC(C(O)=O)CC(O)=O KQTIIICEAUMSDG-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- CFQZKFWQLAHGSL-FNTYJUCDSA-N (3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e)-octadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoic acid Chemical compound OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C CFQZKFWQLAHGSL-FNTYJUCDSA-N 0.000 description 1
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- YADZSMVDNYXOOB-UHFFFAOYSA-N 2,4,6-tribromobenzene-1,3-diol Chemical compound OC1=C(Br)C=C(Br)C(O)=C1Br YADZSMVDNYXOOB-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 1
- FOPYFVOOHJFJHD-UHFFFAOYSA-N 3-methyl-2,2-bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-3-yl)methyl]-7-oxabicyclo[4.1.0]heptane-3-carboxylic acid Chemical compound C1CC2OC2CC1(C)CC1(C(CCC2OC21)(C)C(O)=O)CC1(C)CC2OC2CC1 FOPYFVOOHJFJHD-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- IUPVBNDTWKQQRC-UHFFFAOYSA-N 5-methyl-7-oxabicyclo[4.1.0]heptane-3-carboxylic acid Chemical compound CC1CC(C(O)=O)CC2OC12 IUPVBNDTWKQQRC-UHFFFAOYSA-N 0.000 description 1
- CYZXJGWRCHEHPR-UHFFFAOYSA-N 6-methyl-7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1C(C(O)=O)CCC2OC21C CYZXJGWRCHEHPR-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 229930188104 Alkylresorcinol Natural products 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- WAQJWJHUIZCDFA-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) heptanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCCC(=O)OCC1CC2OC2CC1 WAQJWJHUIZCDFA-UHFFFAOYSA-N 0.000 description 1
- LHQZPSHKKVHDTB-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) oxalate Chemical compound C1CC2OC2CC1COC(=O)C(=O)OCC1CC2OC2CC1 LHQZPSHKKVHDTB-UHFFFAOYSA-N 0.000 description 1
- LMMDJMWIHPEQSJ-UHFFFAOYSA-N bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl] hexanedioate Chemical compound C1C2OC2CC(C)C1COC(=O)CCCCC(=O)OCC1CC2OC2CC1C LMMDJMWIHPEQSJ-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical class OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- JQZRVMZHTADUSY-UHFFFAOYSA-L di(octanoyloxy)tin Chemical compound [Sn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O JQZRVMZHTADUSY-UHFFFAOYSA-L 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 description 1
- HBCFOQHLVLDSHM-UHFFFAOYSA-N hexane-1,1,1-triol;2-methyloxirane Chemical compound CC1CO1.CCCCCC(O)(O)O HBCFOQHLVLDSHM-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- SOOZEQGBHHIHEF-UHFFFAOYSA-N methyltetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21C SOOZEQGBHHIHEF-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
Definitions
- This invention is directed to a curable composition of a cycloaliphatic epoxide and a compatible amount of propylene oxide adducts of polyhydroxyalkanes.
- Cycloaliphatic epoxide resins have inherently good electrical properties. Unmodified cycloaliphatic epoxide resins when cured, however, produce inherently brittle materials. Thus, modifications must be made in the cycloaliphatic epoxide resin systems to decrease their brittleness as well as provide tough systems in order to provide the necessary thermal shock resistance (TSR). Also, resin systems with good electrical properties at elevated temperatures are required in many applications.
- TSR thermal shock resistance
- the US-A-31 69 954 describes the use of polycaprolactone polyols as plasticizers for vinyl halide resins.
- Polycaprolactone polyols are not crosslinkable with vinyl halide resins.
- DE-B-20 35 620 merely indicates that it is known to employ polyols in order to improve the flexibility of epoxy compositions.
- Said prior art discloses curable compositions on the basis of polyepoxides in the form of a mixture with a polycarboxylic acid anhydride as curing agent and a linear polymer of a cylic ester with terminal hydroxyl groups, which may contain in the chain, apart from an ether bond, also a sulfo bond or an optionally substituted amino group.
- curable compositions can moreover contain a curing catalyst, an inorganic filler and a silane coupling agent.
- curable compositions according to the invention when cast into articles, are characterized by an excellent balance of physical properties, high TSR, high heat distortion temperature and good electrical properties.
- compositions of this invention are useful in making electrical components such as, for example, outdoor insulation applications and coil and transformer encapsulation.
- the curable one-phase composition of this invention comprises a cycloaliphatic epoxide having an average of more than 1 vicinal epoxy group per molecule and a polyol being a propylene oxide adduct of polyhydroxyalkanes of the formula wherein R io is an alkyl group of 3 to 10 carbon atoms and n is an integer of from 4 to 25 and having a molecular weight of 1000 to 4000 in amount of 10 to 25 weight percent - based on the total weight of the composition, i.e. compositions which does not form a two phase system with the epoxide.
- the epoxy groups can be terminal epoxy groups or internal epoxy groups as exemplified by the cycloaliphatic epoxides which are subsequently described.
- Particularly desirable cycloaliphatic epoxides are the cyclohexane diepoxides, that is epoxides having at least one cyclohexane ring to which is attached at least one vicinal epoxy group.
- Suitable cycloaliphatic epoxides are the following:
- R 1 through Rg which can be the same or different are hydrogen or alkyl radicals containing 1 to 9 carbon atoms and preferably containing 1 to 3 carbon atoms as for example methyl, ethyl, n-propyl, n-butyl, n-hexyl, 2-ethylhexyl, n-octyl, and n-nonyl;
- R is a valence bond or a divalent hydrocarbon radical containing 1 to 9 carbon atoms and preferably containing 4 to 6 carbon atoms as for example, alkylene radicals, such as trimethylene, tetramethylene, pentamethylene, hexamethylene, 2-ethylhexamethylene, octamethylene, nonamethylene; cycloaliphatic radicals, such as 1,4-cyclohexane, 1,3-cyclohexane, and 1,2-cyclohexane.
- alkylene radicals such as trimethylene, tetramethylene, pentamethylene, hexamethylene, 2-ethylhexamethylene, octamethylene, nonamethylene
- cycloaliphatic radicals such as 1,4-cyclohexane, 1,3-cyclohexane, and 1,2-cyclohexane.
- Particularly desirable epoxides falling within the scope of Formula I, are those wherein R 1 through Rg are hydrogen and R is alkylene containing 4 to 6 carbon atoms.
- R single and double primes which can be the same or different, are monovalent substituents such as hydrogen, halogen, i.e. chlorine, bromine, iodine or fluorine, or monovalent hydrocarbon radicals, or radicals as further defined in US-A-3,318,822.
- Particularly desirable compounds are those wherein all the R's are hydrogen.
- Suitable cycloalphatic epoxides are the following:
- the preferred cycloalphatic epoxides are the following:
- Epoxides with 6 membered ring structures may also be used, such as diglycidyl esters of phthalic acid, partially hydrogenated phthalic acid or fully hydrogenated phthalic acid. Diglycidyl esters of hexahydrophthalic acids being preferred.
- Illustrative alkylene oxide adducts of polyhydroxyalkanes include the propylene oxide adducts of glycerol, 1,2,4-trihydroxybutane, 1,2,6-trihydroxyhexane, 1,1,1-trimethylolpropane.
- the preferred alkylene oxide adducts of polyhydroxyalkanes are of the following formula: wherein R 10 is alkyl, 3 carbon atoms, and n is an integer of from 4 to 25.
- the adduct constitutes preferably from 10 to 20 weight percent.
- hardeners are the following:
- phenolic hardeners are the following polyhydric phenols: catechol, hydroquinone, hydroxyhydroquinone, phloroglucinol, resorcinol and pyrogallol; the di and polynuclear phenols such as the bisphenol is described in US-A-2,506,486 and polyphenylols such as novolac condensates of a phenol and a saturated or unsaturated aldehyde containing an average of from 3 to 20 or more phenylol groups per molecule (cf. T. S. Carswell "Phenoplasts", published in 1947 by Interscience Publishers of New York).
- polyphenylols derived from a phenol and an unsaturated aldehyde such as acrolein are the triphenylols, pentaphenylols and heptaphenylols described in US-A-2,885,385.
- the phenols may contain alkyl or aryl ring substituents or halogens, as exemplified by the alkyl resorcinols, the tribromo resorcinol and the diphenols containing alkyl and halogen substituents on the aromatic ring (US ⁇ A ⁇ 2,506,486).
- the polyhydric phenols can consist of two or more phenols connected by such groups as methylene, alkylene ether, ketone, or sulfone.
- the connecting groups are further exemplified by the following compounds: bis(p-hydroxyphenyl)ether, bis(p-hydroxyphenyl)ketone, bis(p-hydroxyphenyl)methane, bis(p-hydroxyphenyl)dimethyl methane and bis(p-hydroxyphenyl)sulfone.
- one phenolic hydroxyl group is deemed to react with one epoxy group.
- polycarboxylic acids of the formula:
- Suitable acids are phthalic acid, isophthalic acid and terephthalic acid.
- suitable polybasic acids having at least two carboxylic groups per molecule, can be noted the following: tricarballylic acid and timellitic acid.
- suitable polybasic acids including polyesters thereof, are described in US-A-2,921,925.
- Suitable anhydrides are the anhydrides of the acids listed above.
- one carboxylic group is deemed to react with one epoxy group; with respect to anhydrides, one anhydride group is deemed to react with one epoxy group.
- Preferred hardeners include methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride and methylhexahydrophthalic anhydride.
- the hardener such as the anhydride may be reacted with the adduct and this reacted product added to the epoxide.
- additives can be added to the compositions of this invention as is well known in the epoxy art.
- additives include the following: catalysts or accelerators, such as amines including (2-hydroxy ethyl)trimethyl ammonium hydroxide (45 percent concentration in methanol, known as choline base, benzyl dimethyl amine, 2-methyl imidazole, metallic compounds, such as stannous octanoate, peroxides or ethylene glycol; modifiers such as dimer acid (made from unsaturated C 18 fatty acids and is a mixture of 3 percent mono basic acids, 75 percent dimer acid and 22 percent trimer acid and sold under the name of Empol 1022 8 by Emery Industries), a carboxyl terminated butadiene acrylonitrile (80-20) random copolymer having a molecular weight of about 3300; fillers such as clay, silica or aluminum trihydride which may be coated with, for example, silanes, which fillers may be added in amounts of up to about
- compositions of this invention are prepared by simply mixing the epoxide, adduct, hardener and other ingredients at room or higher temperatures in a suitable container.
- the epoxide and adduct may be mixed in one container and the hardener, catalyst and/or accelerator in another container and these two mixed. This blend is then heated in order to effect its cure.
- the temperature to which the composition of this invention are heated to effect cure will, of course, vary and depend, in part upon the exact formulations of the composition. Generally, temperatures in the range of 100°C to 200°C are used for a period of time ranging from 1 to 6 h.
- Choline base (2-hydroxy ethyl)trimethyl ammonium hydroxide, 45 percent concentration in methanol.
- R propyl having a molecular weight of 6000.
- the type and amount of epoxide (grams) and type and amount of polyol (grams) as shown in Table I were mixed in a container at about 25°C.
- the amount (grams) of hexahydrophthalic anhydride and the amount (grams) of choline base as shown in Table I were mixed at about 55°C.
- the contents of the 2 containers were combined and poured into appropriate molds. The contents of the molds were then heated for 2 hours at 100°C and then for 4 hours at 160°C.
- the cured composition was then cut into test samples and tested for heat distortion temperature, TSR, tensile strength, elongation, tensile modulus, dielectric constant and dissipation factor. The appearance of the cured composition was noted. An appearance of opacity indicates that a second phase has been formed.
- the type and amount of epoxide (grams) and type and amount of polyol (grams) as shown in Table II were mixed in a container at about 25°C.
- the amount (grams) of hexahydrophthalic anhydride and the amount (grams) of choline base as shown in Table II were mixed at about 55°C.
- the contents of the two containers were combined and poured into appropriate molds. The contents of the molds were then heated for 2 hours at 100°C and then for four hours at 160°C.
- the cured composition was then cut into test samples and tested for heat distortion temperature, TSR, tensile strength, elongation, tensile modulus, dielectric constant and dissipation factor. The appearance of the cured composition was noted.
- the cured composition was then cut into test samples and tested for heat distortion temperature, TSR, tensile strength, elongation, tensile modulus, dielectric constant and dissipation factor. The appearance of the cured composition was noted.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT81109480T ATE28205T1 (de) | 1980-11-03 | 1981-11-02 | Haertbare einphasige zusammensetzung. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20344080A | 1980-11-03 | 1980-11-03 | |
US203440 | 1980-11-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0051311A1 EP0051311A1 (fr) | 1982-05-12 |
EP0051311B1 true EP0051311B1 (fr) | 1987-07-08 |
Family
ID=22754031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP81109480A Expired EP0051311B1 (fr) | 1980-11-03 | 1981-11-02 | Compositions durcissable pormant une seule phase |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0051311B1 (fr) |
JP (1) | JPS608246B2 (fr) |
AT (1) | ATE28205T1 (fr) |
DE (1) | DE3176297D1 (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO169450C (no) * | 1982-09-30 | 1992-06-24 | Union Carbide Corp | Stoepepreparat paa basis av et cykloalifatisk epoksyd |
CA1243147A (fr) * | 1983-02-07 | 1988-10-11 | Union Carbide Corporation | Compositions photocopolymerisables a base de substances organiques epoxydes et hydroxyles, et de derives de substitution de mono-epoxyde cycloaliphatique comme diluants reactifs |
CA1240439A (fr) * | 1983-02-07 | 1988-08-09 | Union Carbide Corporation | Compositions photocopolymerisables a base d'epoxyde et d'un produit organique hydroxyle renfermant des groupements hydroxy primaires |
US4567216A (en) * | 1983-12-22 | 1986-01-28 | Union Carbide Corporation | Thermoplastic modified epoxy compositions |
DE3433851C2 (de) * | 1984-09-14 | 1987-01-08 | Gurit-Essex Ag, Freienbach | Chemisch härtbare Harze aus 1-Oxa-3-aza-tetralin-Gruppen enthaltenden Verbindungen und cycloaliphatischen Epoxid-harzen, Verfahren zu deren Herstellung sowie Verwendung solcher Harze |
DE3675063D1 (de) * | 1985-04-17 | 1990-11-29 | Union Carbide Corp | Mischungen von polycaprolactonpolyolen und polyepoxyden. |
JPS6254925U (fr) * | 1985-09-24 | 1987-04-06 | ||
EP0221559A3 (fr) * | 1985-11-07 | 1988-09-14 | Union Carbide Corporation | Compositions photocopolymérisables à base de résines époxydes et produits organiques contenant des groupes hydroxyles |
JPS6356103U (fr) * | 1986-10-01 | 1988-04-14 | ||
JPH0739464B2 (ja) * | 1987-04-22 | 1995-05-01 | ダイセル化学工業株式会社 | 成形用樹脂型剤 |
JPH01176050U (fr) * | 1988-05-27 | 1989-12-14 | ||
EP0348193A3 (fr) * | 1988-06-24 | 1990-09-12 | Somar Corporation | Composition de résine époxyde |
JP2923229B2 (ja) * | 1995-04-24 | 1999-07-26 | 株式会社北川鉄工所 | 生コンクリートの製造用可変速ミキサおよびその製造方法 |
CN1875045A (zh) * | 2003-11-03 | 2006-12-06 | 联合碳化化学及塑料技术公司 | 更韧的脂环族环氧树脂 |
JP5660778B2 (ja) * | 2009-12-22 | 2015-01-28 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ化合物、及び該組成物 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3169945A (en) * | 1956-04-13 | 1965-02-16 | Union Carbide Corp | Lactone polyesters |
CH454455A (de) * | 1965-04-07 | 1968-04-15 | Ciba Geigy | Verfahren zur Herstellung mechanisch beanspruchter Konstruktionselemente aus glasfaserverstärkten härtbaren Epoxydharzmassen |
DE2035620B2 (de) * | 1969-07-17 | 1976-06-10 | Union Carbide Corp., New York, N.Y. (V.StA.) | Haertbare zusammensetzung auf basis von polyepoxid und einem linearen polymerisat eines esters mit endstaendigen hydroxylgruppen |
-
1981
- 1981-10-30 JP JP56173118A patent/JPS608246B2/ja not_active Expired
- 1981-11-02 AT AT81109480T patent/ATE28205T1/de not_active IP Right Cessation
- 1981-11-02 DE DE8181109480T patent/DE3176297D1/de not_active Expired
- 1981-11-02 EP EP81109480A patent/EP0051311B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE3176297D1 (en) | 1987-08-13 |
JPS608246B2 (ja) | 1985-03-01 |
JPS57105420A (en) | 1982-06-30 |
ATE28205T1 (de) | 1987-07-15 |
EP0051311A1 (fr) | 1982-05-12 |
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