EP0037535A2 - Plating bath for depositing coatings of gold and gold alloys - Google Patents
Plating bath for depositing coatings of gold and gold alloys Download PDFInfo
- Publication number
- EP0037535A2 EP0037535A2 EP81102316A EP81102316A EP0037535A2 EP 0037535 A2 EP0037535 A2 EP 0037535A2 EP 81102316 A EP81102316 A EP 81102316A EP 81102316 A EP81102316 A EP 81102316A EP 0037535 A2 EP0037535 A2 EP 0037535A2
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- EP
- European Patent Office
- Prior art keywords
- gold
- bath
- acid
- potassium
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000000576 coating method Methods 0.000 title claims abstract description 16
- 229910001020 Au alloy Inorganic materials 0.000 title claims abstract description 5
- 239000003353 gold alloy Substances 0.000 title claims abstract description 5
- 239000010931 gold Substances 0.000 title claims description 37
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 33
- 229910052737 gold Inorganic materials 0.000 title claims description 32
- 238000000151 deposition Methods 0.000 title description 7
- 238000007747 plating Methods 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000002253 acid Substances 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- 150000003839 salts Chemical class 0.000 claims abstract description 10
- 150000001412 amines Chemical class 0.000 claims abstract description 9
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims abstract description 8
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052793 cadmium Inorganic materials 0.000 claims abstract description 8
- 229910052738 indium Inorganic materials 0.000 claims abstract description 8
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 8
- 239000011591 potassium Substances 0.000 claims abstract description 8
- 229910052718 tin Inorganic materials 0.000 claims abstract description 8
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 8
- 239000011701 zinc Substances 0.000 claims abstract description 8
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 7
- 239000010941 cobalt Substances 0.000 claims abstract description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 5
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims abstract description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 14
- 229910002065 alloy metal Inorganic materials 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 11
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 10
- 229960003975 potassium Drugs 0.000 claims description 7
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 229910000402 monopotassium phosphate Inorganic materials 0.000 claims description 3
- 150000007513 acids Chemical class 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 235000019796 monopotassium phosphate Nutrition 0.000 claims description 2
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 claims description 2
- CHKVPAROMQMJNQ-UHFFFAOYSA-M potassium bisulfate Chemical compound [K+].OS([O-])(=O)=O CHKVPAROMQMJNQ-UHFFFAOYSA-M 0.000 claims description 2
- 229910000343 potassium bisulfate Inorganic materials 0.000 claims description 2
- 239000001508 potassium citrate Substances 0.000 claims description 2
- 229960002635 potassium citrate Drugs 0.000 claims description 2
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 claims description 2
- 235000011082 potassium citrates Nutrition 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 abstract description 4
- 150000002739 metals Chemical class 0.000 abstract description 3
- 238000005275 alloying Methods 0.000 abstract description 2
- 230000002378 acidificating effect Effects 0.000 description 5
- 239000008139 complexing agent Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000004700 cobalt complex Chemical class 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- -1 tetracyano gold (III) Chemical compound 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 2
- JGLCONSOSSTGDG-UHFFFAOYSA-N gold(3+);tetracyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-].N#[C-] JGLCONSOSSTGDG-UHFFFAOYSA-N 0.000 description 2
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 2
- 150000003009 phosphonic acids Chemical class 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- BDDLHHRCDSJVKV-UHFFFAOYSA-N 7028-40-2 Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O BDDLHHRCDSJVKV-UHFFFAOYSA-N 0.000 description 1
- FCKYPQBAHLOOJQ-UHFFFAOYSA-N Cyclohexane-1,2-diaminetetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)C1CCCCC1N(CC(O)=O)CC(O)=O FCKYPQBAHLOOJQ-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 229910003771 Gold(I) chloride Inorganic materials 0.000 description 1
- 229910003803 Gold(III) chloride Inorganic materials 0.000 description 1
- 239000007836 KH2PO4 Substances 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000337 buffer salt Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 230000029142 excretion Effects 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical group [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 1
- QGIPNVHDSSGMAA-UHFFFAOYSA-N gold(1+);dicyanide Chemical compound [Au+].N#[C-].N#[C-] QGIPNVHDSSGMAA-UHFFFAOYSA-N 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012452 mother liquor Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- GNSKLFRGEWLPPA-UHFFFAOYSA-M potassium dihydrogen phosphate Chemical compound [K+].OP(O)([O-])=O GNSKLFRGEWLPPA-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Definitions
- the invention relates to a gold bath for the electrodeposition of high-gloss and ductile gold alloy coatings based on potassium cyanoaurate (III) and an acid.
- the majority of gold coatings are deposited today from weakly acidic electrolytes, which operate in the pH range of 3.5 - 5. They contain the gold in the form of potassium dicyanoaurate (1), KAu (CN) 2 and as a buffer salts of weak inorganic or organic acids such as phosphates, citrates or phosphonates.
- metal salts especially nickel, cobalt or Indiums, the properties of the deposited layers are strongly influenced.
- the coatings from these baths also have considerable disadvantages.
- Your ductility is low. With slight mechanical deformation, cracks form. They contain a relatively large amount (approx. 1%) of non-metallic impurities, which presumably lead to malfunctions in low-voltage electrical contacts. Presumably also because of these impurities, the contact resistance does not remain constant during thermal loading and affects the function of electrical devices.
- the content of the alloy metal in the coating is strongly dependent on the current density and the pH value, so that the working conditions must be kept within narrow limits in order to obtain coatings of constant quality.
- the average current density is limited to about 1 A / dm 2 , the bath temperature must not be higher than 40 ° C, and in most baths the pH must be kept between 3.5 and 4.
- the layers are often only milky glossy or already matt. It is not possible to work at pH values below 3.5, since the KAu (CN) 2 decays at pH 3 with the excretion of gold cyanide, AuCN. Nevertheless, attempts were made to use such baths at pH values below 3 (for example DE-AS 1 262 723, US Pat. No. 2,978,390), but the results were unsatisfactory.
- US Pat. No. 3,598,706 describes a process for the preparation of tetracyano gold (III) acid and a bath on this basis.
- US Pat. No. 4,168,214 describes a bath for the pre-gilding of stainless steel, the tetracyano gold (III) complex being formed in the bath by reaction of gold (III) chloride with potassium cyanide and a pH between 0.1 and 1.5 is set.
- Baths in which the trivalent gold is present have the disadvantage, compared to baths based on monovalent gold salts, that only a third of the amount of gold is deposited due to the differences in value with the same current densities and times.
- This disadvantage can only be compensated for by using correspondingly high current densities.
- Another major disadvantage is the high chloride content in these baths, which causes an unpleasant chlorine development at the anode. If the baths also contain hydrochloric acid, there are also corrosion problems on the systems.
- the bath contains at least one of the alloy metals cobalt, nickel, indium, tin, zinc or cadmium in the form of water-soluble salts together with an amine, an aminocarboxylic acid or phosphonic acid and has a pH of less than 3.
- a pH range from 0.4 to 2.5 is particularly advantageous.
- Baths containing 1 - 20 g / 1 gold in the form of potassium cyanoaurate (III), 10 - 200 g / 1 sulfuric acid, phosphoric acid and / or citric acid, 0.1 - 20 g / 1 at least one of the alloy metals cobalt, nickel have proven successful , Indium, zinc, tin or cadmium in the form of water-soluble salts and 1 - 100 g / 1 of an amine, an aminocarboxylic acid or a phosphonic acid, which are able to form a complex with the alloy metal.
- salts of the acids used such as, for example, potassium dihydrogen phosphate, potassium hydrogen sulfate or potassium citrate. It is preferable to work at temperatures from 40 to 60 ° C. and current densities of 0.1-20 A / dm2.
- the properties of the deposited layers from the bath according to the invention have particular advantages compared to the coatings from the so-called weakly acidic gold baths.
- the layers are not only hard and wear-resistant, but also very ductile. They can be deposited in a thin layer with little pores.
- the contact resistance is low and remains constant even with heat storage.
- the content of non-metallic impurities is very low.
- the bath according to the invention is advantageously used in the pH range from 0.4 to 2.5. Both significantly lower and significantly higher pH values lead to the decomposition of the gold complex with the separation of insoluble gold (I) cyanide.
- the bath is preferably operated at pH values between 0.6 and 2.0.
- the bath can be used at room temperature, but higher temperatures up to 60 ° C are advantageous for increasing the deposition rate.
- the applicable current density range is extremely wide. Shiny layers are achieved above all with current densities of 0.2 to at least 10 A / dm 2 .
- the gold content is increased to 8 g / 1, the bath is heated to 50 ° C. and the deposition is repeated at a current density of 8 A / dm 2 .
- 3 ⁇ m gold is deposited in 10 min.
- the cover is also light yellow and shiny. Approx. 0.5% cobalt is detected in both layers.
- the copper base of the second sample is dissolved with 3: 1 diluted nitric acid. A ductile gold foil is obtained which does not break even when it is bent.
- the cobalt complex solution used in preparing the bath is prepared as follows: 47.8 g of CoS04.7H20, corresponding to 10 g of Co, are dissolved in about 600 ml of water while heating, 222 ml of 1-hydroxyethane-1, 1- diphosphonic acid 60% added and made up to 1 liter.
- the bath is again made up to 1 liter. 1.73 g of KAu (CN) 4 (1 g of Au) are added and the pH is adjusted to 0.6 with sulfuric acid.
- An adherent gold layer of 0.2 ⁇ m is deposited on a cathode made of 18Cr 8Ni steel in 5 min at a current density of 2 A / dm 2 .
- the pH is adjusted to 2.0 and the bath is heated to 40 ° C. With a current density of 5 A / dm 2 , a 2.5 ⁇ m thick shiny gold layer is deposited on a copper sheet in 10 min. Gold contains 0.4% Ni.
- the pH of the bath is adjusted to 1.8. With a current density of 9 A / dm 2 and 50 ° C bath temperature, a shiny, light yellow gold layer of 2 ⁇ m thickness is deposited on a nickel-plated copper sheet in 10 minutes.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Die Erfindung betrifft ein Goldbad zur galvanischen Abscheidung hochglänzender und duktiler Goldlegierungsüberzüge auf der Basis von Kaliumcyanoaurat(III) und einer Säure. In der Elektrotechnik wird der überwiegende Teil der Goldüberzüge heute aus schwach sauren Elektrolyten abgeschieden, die im pH-Bereich von 3,5 - 5 arbeiten. Sie enthalten das Gold in Form von Kalium- dicyanoaurat(l),KAu (CN)2 und als Puffer Salze von schwachen anorganischen oder organischen Säuren wie Phosphate, Citrate oder Phosphonate. Durch Zusätze von Metallsalzen, vor allem des Nickels, Kobalts oder Indiums, werden die Eigenschaften der abgeschiedenen Schichten stark beeinflußt. Man erhält aus diesen Bädern unter Bedingungen, bei denen 0,2 - 0,5 % Ni oder Co mitabgeschieden werden, Überzüge, die glänzend sind, eine Härte von 150 - 180 HV haben und eine gute Beständigkeit gegen mechanischen Abrieb aufweisen. Ab etwa 5 pm sind diese Überzüge praktisch porenfrei. Sie zeichnen sich durch gute elektrische Leitfähigkeit und niedrigen Kontaktwiderstand aus.The invention relates to a gold bath for the electrodeposition of high-gloss and ductile gold alloy coatings based on potassium cyanoaurate (III) and an acid. In electrical engineering, the majority of gold coatings are deposited today from weakly acidic electrolytes, which operate in the pH range of 3.5 - 5. They contain the gold in the form of potassium dicyanoaurate (1), KAu (CN) 2 and as a buffer salts of weak inorganic or organic acids such as phosphates, citrates or phosphonates. By adding metal salts, especially nickel, cobalt or Indiums, the properties of the deposited layers are strongly influenced. These baths are obtained under conditions in which 0.2-0.5% Ni or Co are also deposited, coatings which are shiny, have a hardness of 150-180 HV and have good resistance to mechanical abrasion. From about 5 pm, these coatings are practically non-porous. They are characterized by good electrical conductivity and low contact resistance.
Die Überzüge aus diesen Bädern weisen allerdings auch erhebliche Nachteile auf. Ihre Duktilität ist gering. Bei leichter mechanischer Verformung bilden sich Risse. Sie enthalten relativ viel (ca. 1 %) nichtmetallische Verunreinigungen, die vermutlich zu Funktionsstörungen bei elektrischen Schwachstromkontakten führen. Vermutlich auch auf Grund dieser Verunreinigungen bleibt bei thermischer Belastung der Kontaktwiderstand nicht konstant und beeinträchtigt die Funktion elektrischer Geräte.However, the coatings from these baths also have considerable disadvantages. Your ductility is low. With slight mechanical deformation, cracks form. They contain a relatively large amount (approx. 1%) of non-metallic impurities, which presumably lead to malfunctions in low-voltage electrical contacts. Presumably also because of these impurities, the contact resistance does not remain constant during thermal loading and affects the function of electrical devices.
Der Gehalt des Legierungsmetalls im Überzug ist stark von der Stromdichte und dem pH-Wert abhängig, so daß die Arbeitsbedingungen in engen Grenzen gehalten werden müssen, um Überzüge mit gleichbleibender Qualität zu erhalten. Die mittlere Stromdichte ist auf etwa 1 A/dm2 begrenzt, die Badtemperatur darf nicht höher als 40° C sein, und bei den meisten Bädern muß der pH-Wert zwischen 3,5 und 4 gehalten werden. Bei pH-4 sind die Schichten oft nur noch milchig-glänzend oder schon matt. Bei pH-Werten unter 3,5 kann nicht gearbeitet werden, da das KAu(CN)2 bei pH 3 unter Ausscheidung von Goldcyanid, AuCN, zerfällt. Trotzdem wurde versucht, solche Bäder bei pH-Werten unter 3 zu benutzen (z. B. DE-AS 1 262 723, US-PS 29 78 390), die Ergebnisse waren jedoch nicht befriedigend.The content of the alloy metal in the coating is strongly dependent on the current density and the pH value, so that the working conditions must be kept within narrow limits in order to obtain coatings of constant quality. The average current density is limited to about 1 A / dm 2 , the bath temperature must not be higher than 40 ° C, and in most baths the pH must be kept between 3.5 and 4. At pH-4, the layers are often only milky glossy or already matt. It is not possible to work at pH values below 3.5, since the KAu (CN) 2 decays at pH 3 with the excretion of gold cyanide, AuCN. Nevertheless, attempts were made to use such baths at pH values below 3 (for example DE-AS 1 262 723, US Pat. No. 2,978,390), but the results were unsatisfactory.
Es wurde auch versucht, mit Bädern im sauren Bereich zu arbeiten, die den Komplex des dreiwertigen Goldes mit Kaliumcyanid, das Kaliumtetracyanoaurat(III), KAu(CN)4 enthalten.Attempts have also been made to work with acidic baths containing the trivalent gold complex with potassium cyanide, the potassium tetracyanoaurate (III), KAu (CN) 4 .
In der US-PS 3 598 706 wird ein Verfahren zur Herstellung der Tetracyanogold(III)-säure und ein Bad auf dieser Basis beschrieben. In der US-PS 4 168 214 wird ein Bad zur Vorvergoldung von Edelstahl beschrieben, wobei der Tetracyanogold(III)-Komplex durch Umsetzung von Gold(III)-chlorid mit Kaliumcyanid im Bad entsteht und ein pH-"ert zwischen 0,1 und 1,5 eingestellt wird.US Pat. No. 3,598,706 describes a process for the preparation of tetracyano gold (III) acid and a bath on this basis. US Pat. No. 4,168,214 describes a bath for the pre-gilding of stainless steel, the tetracyano gold (III) complex being formed in the bath by reaction of gold (III) chloride with potassium cyanide and a pH between 0.1 and 1.5 is set.
Diese bekannten Bäder können auch zusätzlich Legierungsmetalle enthalten. Ein reines Legierungsbad zur Abscheidung von Gold-Zinn-Überzügen auf der Basis von KAu(CN)4 im salzsauren Medium wird in der DE-OS 2 658 003 beansprucht.These known baths can also contain alloy metals. A pure alloy bath for the deposition of gold-tin coatings based on KAu (CN) 4 in the hydrochloric acid medium is claimed in DE-OS 2 658 003.
Bäder, in denen das Gold dreiwertig vorliegt, haben gegenüber den Bädern auf der Basis von einwertigen Goldsalzen den Nachteil, daß auf Grund der Wertigkeitsunterschiede bei gleichen Stromdichten und Zeiten nur ein Drittel der Goldmenge abgeschieden wird. Dieser Nachteil kann nur durch Anwendung entsprechend hoher Stromdichten ausgeglichen werden. Das ist aber bei den bisher bekannten Bädern nicht möglich, da dann die abgeschiedenen Schichten matt und rauh werden, so daß dickere Überzüge wirtschaftlich nicht herstellbar sind. Ein weiterer wesentlicher Nachteil ist der hohe Chloridgehalt in diesen Bädern, wodurch eine unangenehme Chlorentwicklung an der Anode auftritt. Enthalten die Bäder noch zusätzlich Salzsäure, so treten außerdem noch Korrosionsprobleme an den Anlagen auf.Baths in which the trivalent gold is present have the disadvantage, compared to baths based on monovalent gold salts, that only a third of the amount of gold is deposited due to the differences in value with the same current densities and times. This disadvantage can only be compensated for by using correspondingly high current densities. However, this is not possible with the previously known baths, since then the deposited layers become matt and rough, so that thicker coatings cannot be produced economically. Another major disadvantage is the high chloride content in these baths, which causes an unpleasant chlorine development at the anode. If the baths also contain hydrochloric acid, there are also corrosion problems on the systems.
Es war daher Aufgabe der vorliegenden Erfindung, ein Goldbad zur galvanischen Abscheidung von Goldlegierungs- überzügen auf der Basis von Kaliumcyanoaurat(III) und einer Säure zu finden, die hochglänzend und duktil auch bei hohen Stromdichten sind und bei denen keine Chlorentwicklung auftritt.It was therefore an object of the present invention to find a gold bath for the electrodeposition of gold alloy coatings based on potassium cyanoaurate (III) and an acid which are high-gloss and ductile even at high current densities and in which no chlorine development occurs.
Diese Aufgabe wurde erfindungsgemäß dadurch gelöst, daß das Bad mindestens eines der Legierungsmetalle Kobalt, Nickel, Indium, Zinn,Zink oder Cadmium in Form wasserlöslicher Salze zusammen mit einem Amin, einer Aminocarbonsäure oder Phosphonsäure enthält und einen pH-Wert von weniger als 3 aufweist. Besonders vorteilhaft ist ein pH-Bereich von 0,4 bis 2,5.This object was achieved in that the bath contains at least one of the alloy metals cobalt, nickel, indium, tin, zinc or cadmium in the form of water-soluble salts together with an amine, an aminocarboxylic acid or phosphonic acid and has a pH of less than 3. A pH range from 0.4 to 2.5 is particularly advantageous.
Bewährt haben sich Bäder, die 1 - 20 g/1 Gold in Form von Kaliumcyanoaurat(III), 10 - 200 g/1 Schwefelsäure, Phosphorsäure und/oder Citronensäure, 0,1 - 20 g/1 mindestens eines der Legierungsmetalle Kobalt, Nickel, Indium, Zink, Zinn oder Cadmium in Form wasserlöslicher Salze und 1 - 100 g/1 eines Amins, einer Aminocarbonsäure oder einer Phosphonsäure enthalten, die mit dem Legierungsmetall einen Komplex zu bilden vermögen. Vorteilhaft ist außerdem die Zugabe von Salzen der verwendeten Säurenwie beispielsweise Kaliumdihydrogenphosphat, Kaliumhydrogensulfat oder Kaliumcitrat. Vorzugsweise arbeitet man bei Temperaturen von 40 bis 60° C und Stromdichten von 0,1 - 20 A/dm2.Baths containing 1 - 20 g / 1 gold in the form of potassium cyanoaurate (III), 10 - 200 g / 1 sulfuric acid, phosphoric acid and / or citric acid, 0.1 - 20 g / 1 at least one of the alloy metals cobalt, nickel have proven successful , Indium, zinc, tin or cadmium in the form of water-soluble salts and 1 - 100 g / 1 of an amine, an aminocarboxylic acid or a phosphonic acid, which are able to form a complex with the alloy metal. It is also advantageous to add salts of the acids used, such as, for example, potassium dihydrogen phosphate, potassium hydrogen sulfate or potassium citrate. It is preferable to work at temperatures from 40 to 60 ° C. and current densities of 0.1-20 A / dm2.
Es wurde überraschenderweise gefunden, daß aus sauren Elektrolyten auf der Basis des Tetracyanoaurat(III)-Komplexes glänzende Goldschichten über einen weiten Stromdichtebereich abgeschieden werden können, wenn die Bäder Legierungsmetalle und gleichzeitig geeignete Komplexbildner enthalten. Legierungsmetalle können Co, Ni, In, Sn, Zn oder Cd sein. Geeignete Komplexbildner sind Amine, Aminocarbonsäuren oder Phosphonsäuren. Werden die Legierungsmetalle nur in Form einfacher Salze, wie in den bisher bekannten Bädern, zugegeben, so ist die Metallverteilung im Überzug ungleichmäßig, da im allgemeinen die Menge des mitabgeschiedenen Legierungsmetalls stark von der Stromdichte abhängt. Überraschend zeigte sich nun, daß bei Verwendung der genannten Komplexbildner die Mitabscheidung praktisch unabhängig von der Stromdichte wird, so daß bei optimaler Wahl von Goldgehalt, pH-Wert und Badtemperatur die Überzüge einen konstanten Legierungsmetallgehalt aufweisen. In anderen bekannten Bädern ist diese Unabhängigkeit im allgemeinen nicht gegeben.It has surprisingly been found that shiny gold layers can be deposited over a wide current density range from acidic electrolytes based on the tetracyanoaurate (III) complex if the baths contain alloy metals and at the same time suitable complexing agents. Alloy metals can be Co, N i, In, Sn, Zn or Cd. Suitable complexing agents are amines, aminocarboxylic acids or phosphonic acids. If the alloying metals are added only in the form of simple salts, such as in the previously known baths, s o the metal distribution in the coating is uneven, since in general the amount of co-deposited metal alloy strongly depends on the current density. Surprisingly, it has now been found that when the complexing agents mentioned are used, the co-deposition becomes practically independent of the current density, so that when the gold content, pH value and bath temperature are optimally selected, the coatings have a constant alloy metal content. This independence is generally not given in other known baths.
Dadurch wird die Anwendung hoher Stromdichten möglich und somit können Abscheidungsraten erreicht werden, wie sie bei den bekannten schwach sauren Goldbädern im pH-Bereich zwischen 3,5 und 5 üblich sind.This makes it possible to use high current densities and thus deposition rates can be achieved, as are customary in the known weakly acidic gold baths in the pH range between 3.5 and 5.
Die Verwendung der genannten Komplexbildner in galvanischen Bädern ist an sich bekannt, jedoch war nicht zu erwarten, daß diese Substanzen unter den gegebenen Bedingungen die Mitabscheidung der Legierungsmetalle so stark steuern, da die Stabilität der Komplexe mit den genannten Metallen bei pH-Werten unter 3 normalerweise gering ist.The use of the complexing agents mentioned in galvanic baths is known per se, but it was not to be expected that under the given conditions these substances would control the co-deposition of the alloy metals to such an extent that the stability of the complexes with the metals mentioned would normally be at pH values below 3 is low.
Besondere Vorteile weisen die Eigenschaften der abgeschiedenen Schichten aus dem erfindungsgemäßen Bad im Vergleich zu den Überzügen aus den sogenannten schwach sauren Goldbädern auf. Die Schichten sind nicht nur hart und verschleißfest, sondern auch sehr duktil. Sie können bereits in dünner Schicht porenarm abgeschieden werden. Der Kontaktwiderstand ist niedrig und bleibt auch bei Wärmelagerung konstant. Der Gehalt an nichtmetallischen Verunreinigungen ist sehr gering.The properties of the deposited layers from the bath according to the invention have particular advantages compared to the coatings from the so-called weakly acidic gold baths. The layers are not only hard and wear-resistant, but also very ductile. They can be deposited in a thin layer with little pores. The contact resistance is low and remains constant even with heat storage. The content of non-metallic impurities is very low.
Bäder gemäß der Erfindung enthalten:
- 1 - 20 g/1 Gold als KAu(CN)4
- 10 - 200 g/1 Phosphorsäure, Schwefelsäure oder Gemische davon, Citronensäure, Phosphate, Sulfate
- 0,1 - 20 g/1 eines Legierungsmetalls, das Co, Ni, In, Sn, Zn, Cd sein kann
- 1 - 100 g/1 eines Amins, einer Aminocarbon- oder Phosphonsäure.
- 1 - 20 g / 1 gold as KAu (CN) 4
- 10 - 200 g / 1 phosphoric acid, sulfuric acid or mixtures thereof, citric acid, phosphates, sulfates
- 0.1 - 20 g / 1 of an alloy metal, which can be Co, Ni, In, Sn, Zn, Cd
- 1 - 100 g / 1 of an amine, an aminocarbon or phosphonic acid.
Das KAu(CN)4 wird auf bekannte Weise durch Umsetzung von AuCl3 mit K CN hergestellt und aus der.Mutterlauge kristallisiert. Dabei erhält man ein Salz, das nur noch wenig Chlorid enthält. Die Menge der im Bad enthaltenen Säure ist nicht kritisch. Bei höheren Gehalten wird eine bessere Leitfähigkeit erreicht. Ein Teil der Phosphorsäure kann auch als KH2P04 zugegeben werden, wenn durch die Säure allein zu niedrige pH-Werte erreicht würden. Für die Gruppen der geeigneten Komplexbildner werden nachfolgend beispielhaft eine Reihe von Verbindungen genannt:
- Amine:
- Äthylendiamin
- Tetraäthylenpentamin
- Triäthylamin
- Diäthylentriamin
- Triäthylentetramin
- Aminocarbonsäuren:
- Nitrilotriessigsäure
- Äthylendiamintetraessigsäure
- 1,2-Diaminocyclohexan-tetraessigsäure
- Bis-2-Aminoäthyläthertetraessigsäure
- Diäthylentriaminpentaessigsäure
- Phosphonsäuren:
- 1-Hydroxyäthan-1,1-diphosphonsäure
- Aminotrimethylenphosphonsäure
- Äthylendiamintetramethylphosphonsäure
- Amines:
- Ethylenediamine
- Tetraethylene pentamine
- Triethylamine
- Diethylene triamine
- Triethylene tetramine
- Aminocarboxylic acids:
- Nitrilotriacetic acid
- Ethylenediaminetetraacetic acid
- 1,2-diaminocyclohexane tetraacetic acid
- Bis-2-aminoethyl ether tetraacetic acid
- Diethylenetriaminepentaacetic acid
- Phosphonic acids:
- 1-hydroxyethane-1,1-diphosphonic acid
- Aminotrimethylenephosphonic acid
- Ethylenediaminetetramethylphosphonic acid
Das erfindungsgemäße Bad wird vorteilhafterweise im pH-Bereich von 0,4 - 2,5 angewendet. Sowohl wesentlich niedrigere als auch wesentlich höhere pH-Werte führen zur Zersetzung des Goldkomplexes unter Abscheidung von unlöslichem Gold(I)-cyanid. Vorzugsweise wird das Bad bei pH-Werten zwischen 0,6 und 2,0 betrieben. Das Bad kann bei Raumtemperatur benutzt werden, doch sind höhere Temperaturen bis 60° C zur Erhöhung der Abscheidungsrate vorteilhaft. Der anwendbare Stromdichtebereich ist außerordentlich breit. Es werden glänzende Schichten vor allem bei Stromdichten von 0,2 bis mindestens 10 A/dm2 erzielt.The bath according to the invention is advantageously used in the pH range from 0.4 to 2.5. Both significantly lower and significantly higher pH values lead to the decomposition of the gold complex with the separation of insoluble gold (I) cyanide. The bath is preferably operated at pH values between 0.6 and 2.0. The bath can be used at room temperature, but higher temperatures up to 60 ° C are advantageous for increasing the deposition rate. The applicable current density range is extremely wide. Shiny layers are achieved above all with current densities of 0.2 to at least 10 A / dm 2 .
Die Erfindung soll anhand der folgenden Beispiele näher erläutert werden.The invention is illustrated by the following examples.
Ein Bad wird durch Auflösen folgender Bestandteile hergestellt:
- 75 g Phosphorsäure 85 %ig werden in 500 ml destilliertem Wasser verdünnt. Dann werden 50 ml einer Kobalt-Komplex-Lösung und 3,5 g KAu(CN)4, gelöst in Wasser, zugegeben. Das Bad wird mit Wasser auf ca. 900 ml aufgefüllt, der pH-Wert mit Kalilauge auf 1,5 eingestellt und zum Schluß wird mit Wasser auf 1 Liter ergänzt. Das Bad wird auf 250 C erwärmt. Auf einer Kathode aus Kupferblech wird bei einer Stromdichte von 2 A/dm2 in 20 min eine hellgelbe, glänzende Goldschicht von 1,2 µm Dicke abgeschieden.
- 75 g of 85% phosphoric acid are diluted in 500 ml of distilled water. Then 50 ml of a cobalt complex solution and 3.5 g of KAu (CN) 4 , dissolved in water, are added. The bath is made up to approx. 900 ml with water, the pH is adjusted to 1.5 with potassium hydroxide solution and, finally, water is added to 1 liter. The bath is heated to 25 0 C. A light yellow, shiny gold layer of 1.2 µm thickness is deposited on a cathode made of copper sheet at a current density of 2 A / dm 2 in 20 min.
Nun wird der Goldgehalt auf 8 g/1 erhöht, das Bad auf 50° C erwärmt und die Abscheidung bei einer Stromdichte von 8 A/dm2 wiederholt. Es werden nun in 10 min 3 µm Gold abgeschieden. Der Überzug ist ebenfalls hellgelb und glänzend. In beiden Schichten wird ca. 0,5 % Kobalt nachgewiesen. Von der zweiten Probe wird die Kupferunterlage mit 3 : 1 verdünnter Salpetersäure aufgelöst. Es wird eine duktile Goldfolie erhalten, die auch beim Knicken nicht bricht. Die beim Ansatz des Bades verwendete Kobalt-Komplex-Lösung wird wie folgt hergestellt: 47,8 g CoS04.7H20, entsprechend 10 g Co, werden unter Erwärmen in ca. 600 ml Wasser gelöst, 222 ml 1-Hydroxyäthan-1, 1-diphosphonsäure 60 % zugesetzt und auf 1 Liter aufgefüllt.Now the gold content is increased to 8 g / 1, the bath is heated to 50 ° C. and the deposition is repeated at a current density of 8 A / dm 2 . Now 3 µm gold is deposited in 10 min. The cover is also light yellow and shiny. Approx. 0.5% cobalt is detected in both layers. The copper base of the second sample is dissolved with 3: 1 diluted nitric acid. A ductile gold foil is obtained which does not break even when it is bent. The cobalt complex solution used in preparing the bath is prepared as follows: 47.8 g of CoS04.7H20, corresponding to 10 g of Co, are dissolved in about 600 ml of water while heating, 222 ml of 1-hydroxyethane-1, 1- diphosphonic acid 60% added and made up to 1 liter.
Entsprechend Beispiel 1 wird ein Bad aus folgenden Bestandteilen hergestellt:
- 26,3 ml H3P04 85 %
- 13,6 ml H2SO4 96 %
- 50 ml Kobalt-Komplex-Lösung (wie im Beispiel 1)
- 26.3 ml H 3 P0 4 8 5%
- 13.6 ml H 2 SO 4 96%
- 50 ml cobalt complex solution (as in example 1)
Das Bad wird wiederum auf 1 Liter aufgefüllt. Es werden 1,73 g KAu(CN)4 (1 g Au) zugesetzt und der pH-Wert wird mit Schwefelsäure auf 0,6 eingestellt.The bath is again made up to 1 liter. 1.73 g of KAu (CN) 4 (1 g of Au) are added and the pH is adjusted to 0.6 with sulfuric acid.
Auf einer Kathode aus 18Cr 8Ni-Stahl wird in 5 min bei einer Stromdichte von 2 A/dm2 eine haftfeste Goldschicht von 0,2 µm abgeschieden.An adherent gold layer of 0.2 µm is deposited on a cathode made of 18Cr 8Ni steel in 5 min at a current density of 2 A / dm 2 .
Ein Liter Bad wird durch Auflösen folgender Bestandteile in Wasser hergestellt:
- 25 g KH2PO4
- 60 g H3PO4 85 %
- 4,2 g NiSO4.7H2O
- 13,8 g KAu(CN)4 (8 g/1 Au)
- 10 g Äthylendiamin
- 25 g KH 2 PO 4
- 60 g H 3 PO 4 8 5%
- 4.2 g NiSO 4 .7H 2 O
- 13.8 g KAu (CN) 4 (8 g / 1 Au)
- 10 g ethylenediamine
Der pH-Wert wird auf 2,0 eingestellt und das Bad auf 40° C erwärmt. Bei einer Stromdichte von 5 A/dm2 wird in 10 min eine 2,5 um dicke glänzende Goldschicht auf einem Kupferblech abgeschieden. Im Gold sind 0,4 % Ni enthalten.The pH is adjusted to 2.0 and the bath is heated to 40 ° C. With a current density of 5 A / dm 2 , a 2.5 µm thick shiny gold layer is deposited on a copper sheet in 10 min. Gold contains 0.4% Ni.
Es werden Abscheidungen aus einem Bad vorgenommen, das folgende Bestandteile enthält:
- 90 g/l H3PO4 85 %
- 10 g/l H2SO4 96 %
- 6 g/l In2(SO4)3.5H2O
- 8,6 g/l KAu(CN)4 (5 g/l Au)
- 9 g/1 Äthylendiamintetraessigsäure
- 90 g / l H 3 PO 4 85%
- 10 g / l H 2 SO 4 96%
- 6 g / l In 2 (SO 4) 3 .5H 2 O
- 8.6 g / l KAu (CN) 4 (5 g / l Au)
- 9 g / 1 ethylenediaminetetraacetic acid
Der pH-Wert des Bades wird auf 1,8 eingestellt. Bei einer Stromdichte von 9 A/dm2 und 50° C Badtemperatur wird in 10 min auf einem vernickelten Kupferblech eine glänzende, hellgelbe Goldschicht von 2 µm Dicke abgeschieden.The pH of the bath is adjusted to 1.8. With a current density of 9 A / dm 2 and 50 ° C bath temperature, a shiny, light yellow gold layer of 2 µm thickness is deposited on a nickel-plated copper sheet in 10 minutes.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT81102316T ATE6527T1 (en) | 1980-04-03 | 1981-03-27 | GALVANIC BATH FOR DEPOSITION OF GOLD AND GOLD ALLOY COATINGS. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3012999 | 1980-04-03 | ||
DE3012999A DE3012999C2 (en) | 1980-04-03 | 1980-04-03 | Bath and process for the galvanic deposition of high-gloss and ductile gold alloy coatings |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0037535A2 true EP0037535A2 (en) | 1981-10-14 |
EP0037535A3 EP0037535A3 (en) | 1981-11-04 |
EP0037535B1 EP0037535B1 (en) | 1984-03-07 |
Family
ID=6099206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP81102316A Expired EP0037535B1 (en) | 1980-04-03 | 1981-03-27 | Plating bath for depositing coatings of gold and gold alloys |
Country Status (6)
Country | Link |
---|---|
US (1) | US4391679A (en) |
EP (1) | EP0037535B1 (en) |
JP (1) | JPS56152989A (en) |
AT (1) | ATE6527T1 (en) |
DE (1) | DE3012999C2 (en) |
HK (1) | HK30986A (en) |
Cited By (5)
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FR2538816A1 (en) * | 1983-01-04 | 1984-07-06 | Omi Int Corp | Aq. gold alloy electroplating baths |
EP0149830A2 (en) * | 1983-12-29 | 1985-07-31 | H. E. Finishing SA | Electrolytic bath for the deposition of thin layers of pure gold |
EP0198998A1 (en) * | 1985-02-16 | 1986-10-29 | Degussa Aktiengesellschaft | Bath for the galvanic deposition of a coating of a gold-indium alloy |
US8357285B2 (en) | 2007-06-06 | 2013-01-22 | Rohm And Haas Electronic Materials Llc | Acidic gold alloy plating solution |
DE102011114931A1 (en) | 2011-10-06 | 2013-04-11 | Umicore Galvanotechnik Gmbh | Selective hard gold deposition |
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Publication number | Priority date | Publication date | Assignee | Title |
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US4470886A (en) * | 1983-01-04 | 1984-09-11 | Omi International Corporation | Gold alloy electroplating bath and process |
US4559121A (en) * | 1983-09-12 | 1985-12-17 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization for permeable targets |
US4559125A (en) * | 1983-09-12 | 1985-12-17 | Vac-Tec Systems, Inc. | Apparatus for evaporation arc stabilization during the initial clean-up of an arc target |
US4448659A (en) * | 1983-09-12 | 1984-05-15 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization including initial target cleaning |
DE3509367C1 (en) * | 1985-03-15 | 1986-08-14 | Degussa Ag, 6000 Frankfurt | Bath and process for electrodeposition of gold / tin alloy coatings |
CH680370A5 (en) * | 1989-12-19 | 1992-08-14 | H E Finishing Sa | |
CA2365749A1 (en) * | 2001-12-20 | 2003-06-20 | The Governors Of The University Of Alberta | An electrodeposition process and a layered composite material produced thereby |
US7431817B2 (en) * | 2004-05-11 | 2008-10-07 | Technic, Inc. | Electroplating solution for gold-tin eutectic alloy |
JP4945193B2 (en) * | 2006-08-21 | 2012-06-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Hard gold alloy plating solution |
US20090114345A1 (en) * | 2007-11-07 | 2009-05-07 | Sumitomo Metal Mining Co., Ltd. | Method for manufacturing a substrate for mounting a semiconductor element |
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US4013523A (en) * | 1975-12-24 | 1977-03-22 | Oxy Metal Industries Corporation | Tin-gold electroplating bath and process |
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- 1980-04-03 DE DE3012999A patent/DE3012999C2/en not_active Expired
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- 1981-03-27 EP EP81102316A patent/EP0037535B1/en not_active Expired
- 1981-03-27 AT AT81102316T patent/ATE6527T1/en not_active IP Right Cessation
- 1981-04-02 US US06/250,142 patent/US4391679A/en not_active Expired - Lifetime
- 1981-04-03 JP JP4950781A patent/JPS56152989A/en active Granted
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1986
- 1986-05-01 HK HK309/86A patent/HK30986A/en not_active IP Right Cessation
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JPS5224132A (en) * | 1975-08-05 | 1977-02-23 | Dowa Mining Co | Rigid alloy plating method |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2538816A1 (en) * | 1983-01-04 | 1984-07-06 | Omi Int Corp | Aq. gold alloy electroplating baths |
EP0149830A2 (en) * | 1983-12-29 | 1985-07-31 | H. E. Finishing SA | Electrolytic bath for the deposition of thin layers of pure gold |
EP0149830A3 (en) * | 1983-12-29 | 1986-10-15 | H. E. Finishing Sa | Electrolytic bath for the deposition of thin layers of pure gold |
EP0198998A1 (en) * | 1985-02-16 | 1986-10-29 | Degussa Aktiengesellschaft | Bath for the galvanic deposition of a coating of a gold-indium alloy |
US8357285B2 (en) | 2007-06-06 | 2013-01-22 | Rohm And Haas Electronic Materials Llc | Acidic gold alloy plating solution |
EP2014801A3 (en) * | 2007-06-06 | 2013-04-24 | Rohm and Haas Electronic Materials LLC | An acidic gold alloy plating solution |
US9297087B2 (en) | 2007-06-06 | 2016-03-29 | Rohm And Haas Electronic Materials Llc | Acidic gold alloy plating solution |
US9303326B2 (en) | 2007-06-06 | 2016-04-05 | Rohm And Haas Electronic Materials Llc | Acidic gold alloy plating solution |
DE102011114931A1 (en) | 2011-10-06 | 2013-04-11 | Umicore Galvanotechnik Gmbh | Selective hard gold deposition |
WO2013050258A2 (en) | 2011-10-06 | 2013-04-11 | Umicore Galvanotechnik Gmbh | Selective hard gold deposition |
DE102011114931B4 (en) * | 2011-10-06 | 2013-09-05 | Umicore Galvanotechnik Gmbh | Process for more selective electrolytic deposition of gold or a gold alloy |
Also Published As
Publication number | Publication date |
---|---|
EP0037535A3 (en) | 1981-11-04 |
JPH0146597B2 (en) | 1989-10-09 |
US4391679A (en) | 1983-07-05 |
ATE6527T1 (en) | 1984-03-15 |
JPS56152989A (en) | 1981-11-26 |
DE3012999A1 (en) | 1981-10-15 |
HK30986A (en) | 1986-05-09 |
EP0037535B1 (en) | 1984-03-07 |
DE3012999C2 (en) | 1984-02-16 |
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