EP0012862A3 - Process for the electroless plating of an insulating substrate - Google Patents

Process for the electroless plating of an insulating substrate Download PDF

Info

Publication number
EP0012862A3
EP0012862A3 EP19790104723 EP79104723A EP0012862A3 EP 0012862 A3 EP0012862 A3 EP 0012862A3 EP 19790104723 EP19790104723 EP 19790104723 EP 79104723 A EP79104723 A EP 79104723A EP 0012862 A3 EP0012862 A3 EP 0012862A3
Authority
EP
European Patent Office
Prior art keywords
adhesive layer
adhesive
electroless plating
curing
uncured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19790104723
Other languages
German (de)
French (fr)
Other versions
EP0012862A2 (en
Inventor
Mario Adam Acitelli
James John Woods
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0012862A2 publication Critical patent/EP0012862A2/en
Publication of EP0012862A3 publication Critical patent/EP0012862A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/2033—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31699—Ester, halide or nitrile of addition polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur stromlosen Metal­ lisierung einer isolierenden Unterlage. The invention relates to a method for electroless metal Isolation of an insulating pad.

In dem erfindungsgemäßen Verfahren wird auf ein mit einem ungehärteten Epoxidharz imprägnierten Laminat aus Glasfasergewebe eine Klebstoffschicht aufgetragen. Die Klebstoffschicht, die im wesentlichen aus einem ungerhärte­ ten Nitrilkautschuk/Phenolkunstharzkleber besteht, wird zuerst auf einem Übertragungsblatt angeordnet. Die Oberflä­ che der Klebstoffschicht wird mit der isolierenden Unterlage in Kontakt gebracht und durch Anwendung von Hitze und Druck ausgehärtet. Nach dem Aushärten wird das Übertra­ gungsblatt abgeschält und auf der Kunstharzklebeschicht in an sich bekannter Weise durch stromloses Plattieren eine Metallschicht abgeschieden. In the method according to the invention, a an uncured epoxy resin impregnated laminate Glass fiber fabric applied an adhesive layer. The Adhesive layer consisting essentially of an uncured There is nitrile rubber / phenolic resin adhesive first arranged on a transfer sheet. The surface surface of the adhesive layer with the insulating base contacted and by application of heat and Pressure hardened. After curing, the transfer peeled and on the synthetic resin adhesive layer in in a manner known per se by electroless plating Metal layer deposited.

Durch die gemeinsame Härtung des Epoxidharzes, mit dem die Unterlage imprägniert ist und des Kunstharzklebers wird die Klebeschicht mit der Unterlage integral verbunden. Trotz der niedrigen Schichtdicke der Klebeschicht werder außerordentlich hohe Bindefestigkeiten erhalten. By curing the epoxy resin together with the the pad is impregnated and the synthetic resin adhesive the adhesive layer is integrally connected to the base. In spite of the low layer thickness of the adhesive layer obtain extraordinarily high bond strengths.

EP19790104723 1978-12-20 1979-11-27 Process for the electroless plating of an insulating substrate Withdrawn EP0012862A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US971125 1978-12-20
US05/971,125 US4254186A (en) 1978-12-20 1978-12-20 Process for preparing epoxy laminates for additive plating

Publications (2)

Publication Number Publication Date
EP0012862A2 EP0012862A2 (en) 1980-07-09
EP0012862A3 true EP0012862A3 (en) 1981-03-18

Family

ID=25517961

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19790104723 Withdrawn EP0012862A3 (en) 1978-12-20 1979-11-27 Process for the electroless plating of an insulating substrate

Country Status (5)

Country Link
US (1) US4254186A (en)
EP (1) EP0012862A3 (en)
JP (1) JPS5587497A (en)
CA (1) CA1129760A (en)
IT (1) IT1165394B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3167873D1 (en) * 1980-10-27 1985-01-31 Hitachi Chemical Co Ltd Laminates
CA1186608A (en) * 1981-02-13 1985-05-07 Makoto Ohe Process for preparation of laminate polymer articles and polymer article surface-protecting acrylic film for use in carrying out said process
JPS60206086A (en) * 1984-03-29 1985-10-17 住友ベークライト株式会社 Method of producing aditive plating laminated board
US4959008A (en) * 1984-04-30 1990-09-25 National Starch And Chemical Investment Holding Corporation Pre-patterned circuit board device-attach adhesive transfer system
US4707394A (en) * 1986-09-19 1987-11-17 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4804575A (en) * 1987-01-14 1989-02-14 Kollmorgen Corporation Multilayer printed wiring boards
US5618606A (en) * 1989-09-18 1997-04-08 Rockwell International Corporation Process for bonding staged composites with a cobonded staged adhesive and article
US5519425A (en) * 1993-11-15 1996-05-21 Xerox Corporation Ink supply cartridge for an ink jet printer
CH686422A5 (en) * 1994-05-06 1996-03-29 Ernst Muller A method for connecting a mass of unlosbaren ausgehortetem epoxy resin with a mass of ABS copolymer, and by this process metallurgy article.
US6632343B1 (en) * 2000-08-30 2003-10-14 Micron Technology, Inc. Method and apparatus for electrolytic plating of surface metals
US6500529B1 (en) * 2001-09-14 2002-12-31 Tonoga, Ltd. Low signal loss bonding ply for multilayer circuit boards
US8897023B2 (en) * 2009-05-15 2014-11-25 Hamilton Sundstrand Corporation Motor controller assembly with capacitor thermal isolation
US20110290540A1 (en) * 2010-05-25 2011-12-01 Samsung Electro-Mechanics Co., Ltd. Embedded printed circuit board and method of manufacturing the same
US9504148B1 (en) 2015-12-02 2016-11-22 Honeywell Federal Manufacturing & Technologies, Llc Rapid PCB prototyping by selective adhesion

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1355331A (en) * 1970-02-18 1974-06-05 Formica Int Process for preparing insulating substrates
GB1355332A (en) * 1970-02-18 1974-06-05 Formica Int Process for preparing metallised insulating substrates
US3956041A (en) * 1972-07-11 1976-05-11 Kollmorgen Corporation Transfer coating process for manufacture of printing circuits

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948701A (en) * 1971-07-20 1976-04-06 Aeg-Isolier-Und Kunststoff Gmbh Process for manufacturing base material for printed circuits
US3925138A (en) * 1973-11-27 1975-12-09 Formica Int Process for preparing an insulating substrate for use in printed circuits
US4001466A (en) * 1973-11-27 1977-01-04 Formica International Limited Process for preparing printed circuits
US3989573A (en) * 1973-12-11 1976-11-02 Westinghouse Electric Corporation Glass-epoxy laminates for high temperature use
US3990932A (en) * 1974-05-13 1976-11-09 Dupire Pierre J Transfer method of application of solid coating composition
US3955024A (en) * 1974-07-17 1976-05-04 Western Electric Company, Inc. Printed circuit board
US4029845A (en) * 1974-08-15 1977-06-14 Sumitomo Bakelite Company, Limited Printed circuit base board and method for manufacturing same
JPS5127463A (en) * 1974-08-29 1976-03-08 Hirotoshi Nomura Purintokairoyokiban no seizoho
US4100312A (en) * 1975-11-07 1978-07-11 Macdermid Incorporated Method of making metal-plastic laminates

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1355331A (en) * 1970-02-18 1974-06-05 Formica Int Process for preparing insulating substrates
GB1355332A (en) * 1970-02-18 1974-06-05 Formica Int Process for preparing metallised insulating substrates
US3956041A (en) * 1972-07-11 1976-05-11 Kollmorgen Corporation Transfer coating process for manufacture of printing circuits

Also Published As

Publication number Publication date
US4254186A (en) 1981-03-03
IT1165394B (en) 1987-04-22
EP0012862A2 (en) 1980-07-09
JPS5587497A (en) 1980-07-02
IT7927811A0 (en) 1979-12-04
CA1129760A (en) 1982-08-17

Similar Documents

Publication Publication Date Title
EP0012862A3 (en) Process for the electroless plating of an insulating substrate
EP2259311B1 (en) Method for embedding at least one component into a circuit board element
US4853277A (en) Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
EP0440928A2 (en) Process for manufacturing a printed circuit board comprising rigid and flexible parts
EP0440929A2 (en) Process for manufacturing a printed circuit board comprising rigid and flexible parts
DE3108183C2 (en) Process for the production of a one-piece keyboard component with switch keys
EP0181627A3 (en) Sound-insulating composite panel and its production method
DE3334921A1 (en) Process for producing an embossed multi-layer material
IE820112L (en) Metal resin composite
DE1231775B (en) Repeatedly usable die for making printed circuits
US5116446A (en) Method of making a paper overlaid structure
DE3505115A1 (en) Electrically conductive adhesive connection
JPS5739510A (en) Manufacture of electromagnetic steel plate
JPS5711026A (en) Manufacture of laminate
EP1093909B1 (en) Composite film
JP2620470B2 (en) Method for manufacturing thermosetting resin sandwich type composite steel sheet
JPH0243037A (en) Manufacture of laminated cement board
DE2624709A1 (en) Adhesion promoter for printed circuits - comprises an aminoplast-modified rubber and simplifies metallisation by obviating a surface treating stage
JPS5747619A (en) Stamping method
DE2653366A1 (en) Semiconductor chip assembly using automatic process - has substrate disc absorbing water cut by diamond blade saw and using thermoplastic lacquer
DE2140979A1 (en) Rubber based adhesive layer - for a printed circuit substrate
AT371491B (en) METHOD FOR PRODUCING A PARTICULAR PLATE-SHAPED BODY WITH A SURFACE WITH IMPROVED ADHESIVITY
DE1490231C (en) Process for the production of printed circuits
DE3231183A1 (en) Process for the production of a metallic coating on glass or glass-like substrate surfaces
DE593372C (en) Process for the production of waterproof embossed print

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Designated state(s): DE FR GB

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Designated state(s): DE FR GB

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 19820222

RIN1 Information on inventor provided before grant (corrected)

Inventor name: WOODS, JAMES JOHN

Inventor name: ACITELLI, MARIO ADAM