EP0012673A1 - Offset printing plate to be used as monometallic plate comprising a printing surface and offset printing method using this plate - Google Patents

Offset printing plate to be used as monometallic plate comprising a printing surface and offset printing method using this plate Download PDF

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Publication number
EP0012673A1
EP0012673A1 EP79400974A EP79400974A EP0012673A1 EP 0012673 A1 EP0012673 A1 EP 0012673A1 EP 79400974 A EP79400974 A EP 79400974A EP 79400974 A EP79400974 A EP 79400974A EP 0012673 A1 EP0012673 A1 EP 0012673A1
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EP
European Patent Office
Prior art keywords
plate
veil
layer
printing
copper
Prior art date
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EP79400974A
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German (de)
French (fr)
Inventor
Jean-Marie Nouel
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Individual
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Individual
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Publication date
Priority claimed from FR7834955A external-priority patent/FR2443935A1/en
Priority claimed from FR7917152A external-priority patent/FR2460210B2/en
Application filed by Individual filed Critical Individual
Publication of EP0012673A1 publication Critical patent/EP0012673A1/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/04—Printing plates or foils; Materials therefor metallic
    • B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/04—Printing plates or foils; Materials therefor metallic
    • B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
    • B41N1/10—Printing plates or foils; Materials therefor metallic for lithographic printing multiple

Definitions

  • the present invention relates to a new offset plate, using a single metal plate, comprising a printer layer.
  • monometallic plates i.e. plates in which a monometallic surface
  • a monometallic surface the term monometallic being used here to cover simultaneously the use of metals or alloys, plays the role of aquaphile surface.
  • a surface is for example made of stainless steel, chromium, tin, nickel tin, aluminum, aluminum alloy or hydrophilic zinc.
  • This surface is the surface of a support which is made of the same metal or alloy or which is made of a different metal.
  • plates with a copper-steel support and with a chromium surface are known.
  • a photosensitive printer layer On said monometallic surface is deposited a photosensitive printer layer, positive or negative.
  • This non-hydrophilic derivative may be a metal, a metal alloy, a varnish or a resin or a combination of these products.
  • this derivative must be able to be fixed firmly by known means on the surface.
  • the non-hydrophilic derivative veil deposited between the aquaphile surface and the printing layer, has a particular color and / or structure. So for example when said veil is constituted by a deposit of copper or tin or zinc ... it is advantageous, before depositing the printing layer, to attack this metallic veil using known commercial substances in order to give birth to porous and possibly blackened or colored surfaces.
  • the embodiment of the veil must be chosen as a function of the metal or alloy to be deposited on the one hand and on the other hand as a function of the aquaphile monometallic surface which it is desired to cover the main known processes for depositing this veil are the chemical displacement of a metal contained in a bath or electrolysis.
  • said veil must be made of a material such as a varnish or a resin, known techniques will be used for this type of material.
  • An aluminum plate 25/100 thick is used, the surface of which has been degreased, brushed but not anodized.
  • a veil of 0.02 micron thick of zinc was deposited with the "zincate process" consisting in dipping the aluminum plate for approximately 30 seconds in a bath containing in particular zinc salts.
  • Such a process is for example described in CANNING HANDBOOK ON ELECTROPLATING (22nd edition) Canning Lt page 350.
  • a layer of approximately 1 to 2 microns of photosensitive layer was deposited, for example a negative photosensitive layer.
  • the photosensitive layer After exposure of said layer, the photosensitive layer is treated with a developing solution which dissolves the parts of the layer which are not hardened; then the whole is treated with a 15% nitric acid solution which removes the zinc veil in places where the surface of the zinc is no longer covered with a printing layer. After washing, a directly usable plate is obtained in which the aluminum surface acts as an aquaphile surface.
  • a brushed stainless steel plate is used. This plate is soaked in an acid copper plating bath by electrolysis and this electrolysis is carried out until a copper deposit of the order of 0.2 microns is obtained. On this copper surface is deposited a negative photosensitive layer about 1.5 microns thick.
  • the photosensitive layer is treated with a developing solution and then the exposed parts of the copper veil are removed using a solution of nitric acid (copper bite) so as to expose the corresponding parts.
  • a solution of nitric acid copper bite
  • the pH of the bath being 8.5, the current density of A / dm2 and the temperature of 55 ° C.
  • the plate is removed from the bath when a 0.08 micron layer of copper has settled.
  • the aluminum turns red indicating the formation of a layer of copper.
  • remove the excess solution with a squeegee then pour in isopropyl alcohol which is quickly removed with cellulose wadding to dry the surface. Then it is coated with a photosensitive layer as indicated above.
  • the uncured parts After exposure the uncured parts are removed with a developing solution and then with a special bite solution to destroy the copper on aluminum (Bi-metal Polychrome bite) copper can be removed in less than 30 "in the developed areas. After rinsing and scrub the plate is ready to go in the machine.
  • a stainless steel plate is used which is covered, as in Example 2, with copper, the thickness of the copper deposit is 0 micron 7.
  • said plate After rinsing, said plate is soaked in a bath of a product sold by the company IMASA under the name of Ebonol C and which is sold for carrying out the blackening of copper surfaces.
  • the copper becomes matt black and porous and the thickness is reduced to around 0 micron 1.
  • the plate is then coated with 1 micron 8 of a positive photosensitive layer printer, after exposure and development.
  • the black copper is destroyed by a biting solution as in Example 2.
  • the printing parts are very dark and contrast sharply with the aquaphile surface. Control is thus much easier.
  • the coated plate After drying, the coated plate is baked at 220 ° for a few seconds causing this resin to harden. Then the surface is covered with 1 micron 8 of photosensitive printer layer.
  • the plate After insolation and development, the plate is attacked with a known solution used in offset technique for the bite of copper or tin; said solution is sufficient to remove on the one hand, the thin layer of ALNOVOL resin and on the other hand, the veil of copper or tin.
  • the aquaphile surface is thus exposed.

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  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)

Abstract

The present invention relates to a new offset plate for use as a monometallic plate comprising a printing layer, characterised in that between the hydrophilic surface of the plate and the printing layer is interposed a film of enchrophilic material of a thickness between 0.005 and 0.5 microns.

Description

La présente invention concerne une nouvelle plaque offset, à utilisation de plaque monométallique, comportant une couche imprimante.The present invention relates to a new offset plate, using a single metal plate, comprising a printer layer.

Dans l'imprimerie offset on utilise souvent des plaques dites à utilisation de plaque monométallique c'est-à-dire des plaques dans lesquelles une surface monométallique, le terme monométallique étant utilisé ici pour couvrir simultanément l'usage de métaux ou d'alliages, joue le rôle de surface aquaphile. Une telle surface est par exemple réalisée en acier inoxydable, en chrome, en étain en étain nickel, en aluminium, en alliage d'aluminium ou en zinc hydrophile. Cette surface est la surface d'un support qui est en même métal ou alliage ou qui est en un métal différent on connait par exemple des plaques à support acier- cuivré et à surface de chrome.In offset printing, we often use so-called monometallic plates, i.e. plates in which a monometallic surface, the term monometallic being used here to cover simultaneously the use of metals or alloys, plays the role of aquaphile surface. Such a surface is for example made of stainless steel, chromium, tin, nickel tin, aluminum, aluminum alloy or hydrophilic zinc. This surface is the surface of a support which is made of the same metal or alloy or which is made of a different metal. For example, plates with a copper-steel support and with a chromium surface are known.

Sur ladite surface monométallique on dépose une couche imprimante photosensible, positive ou négative.On said monometallic surface is deposited a photosensitive printer layer, positive or negative.

Le développement, après insolation, consiste à enlever les parties solubles de la couche imprimante et à faire apparaitre la surface monométallique aquaphile sous jacente.Development, after insolation, consists in removing the soluble parts of the printing layer and in revealing the underlying aquaphile monometallic surface.

Il a été trouvé, et c'est là l'objet de la présente invention, que dans les plaques offset à utilisation de plaque à surface monométallique aquaphile telles que décrites ci-dessus, il était souhaitable, d'intercaler entre la surface aquaphile et la couche imprimante, un voile d'épaisseur comprise entre 0,005 et 0,5 micron d'un dérivé non hydrophile.It has been found, and this is the object of the present invention, that in offset plates using a plate with an aquaphile monometallic surface as described above, it was desirable to interpose between the aquaphile surface and the printing layer, a veil of thickness between 0.005 and 0.5 micron of a non-hydrophilic derivative.

Ce dérivé non hydrophile pourra être un métal, un alliage métallique, un vernis ou une résine ou une combinaison de ces produits.This non-hydrophilic derivative may be a metal, a metal alloy, a varnish or a resin or a combination of these products.

Ce dérivé devra d'une part, pouvoir se fixer solidement par des moyens connus sur la surface aquaphile utilisée et d'autre part, pouvoir être aisément enlevé, après développement de la couche imprimante, au moyen d'une solution de morsure qui enlèvera la totalité dudit dérivé sans attaquer notablement ni les parties restantes de la couche imprimante ni la surface mo nométallique aquaphile sur laquelle ledit dérivé a été déposé.On the one hand, this derivative must be able to be fixed firmly by known means on the surface. aquaphile used and on the other hand, being able to be easily removed, after development of the printing layer, by means of a biting solution which will remove all of said derivative without appreciably attacking either the remaining parts of the printing layer or the metallic surface aquaphile on which said derivative has been deposited.

On pourra notamment et de préférence utiliser selon l'invention un métal ou un alliage métallique encrophile ou que l'on a rendu encrophile grâce à un traitement approprié. Comme métal ou alliage pouvant être déposé à l'état de voile sur une surface monométallique aquaDhile on peut par exempler citer :

  • - le cuivre, le bronze, le laiton, le zinc encrophile, le zinc-nickel, l'étain, le fer, l'antimoine, le cadmium, le manganèse, le chrome encrophile ou divers alliages de ces métaux,lesdits métaux ou alliages étant naturellement encrophilés ou ayant été rendus encrophiles.
In particular and preferably it is possible to use, according to the invention, a metal or a metal alloy which is encrophilic or which has been rendered encrophilic by means of an appropriate treatment. As a metal or an alloy which can be deposited in the state of a veil on an aqua D hile monometallic surface, it is possible, for example, to cite:
  • - copper, bronze, brass, encrophilic zinc, zinc-nickel, tin, iron, antimony, cadmium, manganese, encrophilic chromium or various alloys of these metals, said metals or alloys being naturally encrophilic or having been made encrophilic.

Il est parfois souhaitable de faire en sorte que, dans le cadre de la présente invention, le voile de dérivé non hydrophile, déposé entre la surface aquaphile et la couche imprimante, ait une couleur et/ou une structure particulière. Ainsi par exemple lorsque ledit voile estconstitué par un dépôt de cuivre ou d'étain ou de zinc... il est avanLageux, avant de déposer la couche imprimante , d'attaquer ce voile métallique à l'aide de substances commerciales connues afin de donner naissance à des surfaces poreuses et éventuellement noircies ou colorées.It is sometimes desirable to ensure that, in the context of the present invention, the non-hydrophilic derivative veil, deposited between the aquaphile surface and the printing layer, has a particular color and / or structure. So for example when said veil is constituted by a deposit of copper or tin or zinc ... it is advantageous, before depositing the printing layer, to attack this metallic veil using known commercial substances in order to give birth to porous and possibly blackened or colored surfaces.

Le mode de réalisation du voile doit être choisi en fonction d'une part du métal ou alliage à déposer et d'autre part en fonction de la surface monométallique aquaphile que l'on veut recouvriri les principaux procédés connus pour réaliser le dépôt de ce voile sont le déplacement chimique d'un métal contenu dans un bain ou l'électrolyse. Lorsque ledit voile devra être réalisé en un matériau tel qu'un verni ou une résine, on emploiera des techniques connues pour ce type de matériaux.The embodiment of the veil must be chosen as a function of the metal or alloy to be deposited on the one hand and on the other hand as a function of the aquaphile monometallic surface which it is desired to cover the main known processes for depositing this veil are the chemical displacement of a metal contained in a bath or electrolysis. When said veil must be made of a material such as a varnish or a resin, known techniques will be used for this type of material.

Les exemples non limitatifs ci-après illustrent l'invention.The nonlimiting examples below illustrate the invention.

Exemple 1Example 1

On utilise une plaque en aluminium de 25/100 d'épaisseur dont la surface a été dégraissée, brossée mais non anodisée. Sur la surface de cette plaque on a déposé un voile de 0,02 micron d'épaisseur de zinc avec le"procédé au zincate" consistant à tremper la plaque d'aluminium pendant environ 30 secondes dans un bain contenant notamment des sels de zinc. Un tel procédé est par exemple décrit dans le CANNING HANDBOOK ON ELECTROPLATING (22e édition) Canning Lt page 350.An aluminum plate 25/100 thick is used, the surface of which has been degreased, brushed but not anodized. On the surface of this plate, a veil of 0.02 micron thick of zinc was deposited with the "zincate process" consisting in dipping the aluminum plate for approximately 30 seconds in a bath containing in particular zinc salts. Such a process is for example described in CANNING HANDBOOK ON ELECTROPLATING (22nd edition) Canning Lt page 350.

Sur le voile de zinc ainsi réalisé on a déposé une couche d'environ 1 à 2 microns de couche photosensible par exemple d'une couche photosensible négative.On the zinc veil thus produced, a layer of approximately 1 to 2 microns of photosensitive layer was deposited, for example a negative photosensitive layer.

Après insolation de ladite couche on traite la couche photosensible avec une solution de développement qui dissout les parties de la couche non durcies ; puis on traite l'ensemble à l'aide d'une solution d'acide nitrique à15 % qui enlève le voile de zinc aux endroits où la surface du zinc n'est plus recouverte de couche imprimante. Après lavage on obtient une plaque directement utilisable dans laquelle la surface d'aluminium joue le rôle de surface aquaphile.After exposure of said layer, the photosensitive layer is treated with a developing solution which dissolves the parts of the layer which are not hardened; then the whole is treated with a 15% nitric acid solution which removes the zinc veil in places where the surface of the zinc is no longer covered with a printing layer. After washing, a directly usable plate is obtained in which the aluminum surface acts as an aquaphile surface.

Exemple 2Example 2

On utilise une plaque brossée en acier inoxydable. Cette plaque est trempée dans un bain de cuivrage acide par électrolyse et cette électrolyse est conduite jusqu'à ce que l'on obtienne un dépôt de cuivre de l'ordre de 0,2 micron. Sur cette surface de cuivre on dépose une couche photosensible négative d'environ 1,5 microns d'épaisseur.A brushed stainless steel plate is used. This plate is soaked in an acid copper plating bath by electrolysis and this electrolysis is carried out until a copper deposit of the order of 0.2 microns is obtained. On this copper surface is deposited a negative photosensitive layer about 1.5 microns thick.

Après insolation on traite la couche photosensible avec une solution de développement puis on enlève les parties du voile de cuivre mises à nu à l'aide d'une solution d'acide nitrique(morsure du cuivre )de façon à mettre à nu les parties correspondantes sous jacentes d'acier inoxydable.After exposure, the photosensitive layer is treated with a developing solution and then the exposed parts of the copper veil are removed using a solution of nitric acid (copper bite) so as to expose the corresponding parts. underlying stainless steel.

Exemple 3Example 3

Après avoir dégraissé et décapé une plaque en aluminium (qualité offset) en provenance de la St. CEGEDUR, on brosse sa surface avec de l'eau et de la poncefine puis on la rince. La plaque est alors traitée tout d'abord dans un bain à base d'acide phosphorique de manière à oxyder anodiquement sa surface. Après rinçage la plaque est immergée dans un bain de cuivrage au pyrophosphate ayant la composition suivante :

Figure imgb0001
After degreasing and pickling an aluminum plate (offset quality) from St. CEGEDUR, we brush its surface with water and poncefine and then rinse. The plate is then first treated in a bath based on phosphoric acid so as to anodically oxidize its surface. After rinsing, the plate is immersed in a pyrophosphate copper-plating bath having the following composition:
Figure imgb0001

Le pH du bain étant de 8,5 la densité de courant de lA/dm2 et la température de 55°C. La plaque est retirée du bain lorsqu'une couche de 0,08 micron de cuivre s'est déposée.The pH of the bath being 8.5, the current density of A / dm2 and the temperature of 55 ° C. The plate is removed from the bath when a 0.08 micron layer of copper has settled.

Après rinçage et séchage la surface du cuivre est recouverte d'une couche photosensible imprimante connue de l'homme de métier.After rinsing and drying the copper surface is covered with a photosensitive printer layer known to those skilled in the art.

Exemple 4Example 4

Après avoir dégraissé, brossé et décapé une plaque en aluminium à 25/100 d'épaisseur en provenance de la St. CEGEDUR (qualité offset) on répand sur la surface totalement sèche de la plaque une solution formée par 1000 cc d'alcool isopropylique (99%) par 31 grammes de Cu2Cl2 (chlorure de cuivre)et 32 cc de Hcl (37. 38,5).After degreasing, brushing and pickling an aluminum plate 25/100 thick from St. CEGEDUR (offset quality), a solution formed by 1000 cc of isopropyl alcohol is spread over the completely dry surface of the plate ( 99%) with 31 grams of Cu 2 Cl 2 (copper chloride) and 32 cc of Hcl (37. 38.5).

L'aluminium se colore en rouge indiquant la formation d'une couche de cuivre. Lorsque la couleur est uniforme, on chasse l'excès de solution avec une raclette, puis on verse de l'alcool isopropylique que l'on enlève rapidement avec de la ouate de cellulose pour sécher la surface. Ensuite celle-ci est enduite avec une couche photosensible comme indiqué précédemment.The aluminum turns red indicating the formation of a layer of copper. When the color is uniform, remove the excess solution with a squeegee, then pour in isopropyl alcohol which is quickly removed with cellulose wadding to dry the surface. Then it is coated with a photosensitive layer as indicated above.

Après insolation les parties non durcies sont enlevées avec une solution de développement puis avec une solution de morsure spéciale pour détruire le cuivre sur aluminium (morsure bi-métal Polychrome) le cuivre peut être enlevé en moins de 30" dans les endroits développés. Après rinçage et gommage la plaque est prête pour aller en machine.After exposure the uncured parts are removed with a developing solution and then with a special bite solution to destroy the copper on aluminum (Bi-metal Polychrome bite) copper can be removed in less than 30 "in the developed areas. After rinsing and scrub the plate is ready to go in the machine.

Exemple 5Example 5

On utilise une plaque en acier inoxydable que l'on recouvre, comme dans l'exemple 2, de cuivre, l'épaisseur du dépôt de cuivre est de 0 micron 7.A stainless steel plate is used which is covered, as in Example 2, with copper, the thickness of the copper deposit is 0 micron 7.

Après rinçage on trempe ladite plaque dans un bain d'un produit commercialisé par la Société IMASA sous le nom d'Ebonol C et qui est vendu pour , réaliser le noircissage des surfaces de cuivre.After rinsing, said plate is soaked in a bath of a product sold by the company IMASA under the name of Ebonol C and which is sold for carrying out the blackening of copper surfaces.

Le cuivre devient noir mat et poreux ét l'épaisseur est ramenée aux environs de 0 micron 1.The copper becomes matt black and porous and the thickness is reduced to around 0 micron 1.

La plaque est ensuite revêtue de 1 micron 8 de couche photosensible positive imprimante, après insolation et développement.The plate is then coated with 1 micron 8 of a positive photosensitive layer printer, after exposure and development.

Le cuivre noir est détruit par une solution de morsure comme dans l'exemple 2.The black copper is destroyed by a biting solution as in Example 2.

Les parties imprimantes sont très foncées et contrastent fortement avec la surface aquaphile. Le contrôle est ainsi beaucoup facilité.The printing parts are very dark and contrast sharply with the aquaphile surface. Control is thus much easier.

Exemple 6Example 6

On prend une plaque en acier USINOR que l'on recouvre de 3 microns d'étain nickel (65-35), puis de 0 micron 08 de cuivre ou d'étain, puis de 0 micron 08 d'une résine ALNOVOL. (résine formophénolique commer- calisée par la Société HOECHST.)Take a USINOR steel plate which is covered with 3 microns of nickel tin (65-35), then 0 micron 08 of copper or tin, then 0 micron 08 of an ALNOVOL resin. (formophenolic resin sold by HOECHST.)

Après séchage, la plaque revêtue est cuite à 220° pendant quelques secondes provoquant un durcissement de cette résine. Puis on recouvre la'surface de 1 micron 8 de couche photosensible imprimante.After drying, the coated plate is baked at 220 ° for a few seconds causing this resin to harden. Then the surface is covered with 1 micron 8 of photosensitive printer layer.

Après insolation et développement on attaque la plaque avec une solution connue et utilisée en technique offset pour la morsure du cuivre ou de l'étain ; ladite solution est suffisante pour enlever d'une part, la mince couche de résine ALNOVOL et d'autre part, le voile de cuivre ou d'étain. La surface aquaphile est ainsi mise à nu.After insolation and development, the plate is attacked with a known solution used in offset technique for the bite of copper or tin; said solution is sufficient to remove on the one hand, the thin layer of ALNOVOL resin and on the other hand, the veil of copper or tin. The aquaphile surface is thus exposed.

Les plaques selon l'invention présentent des qualités très intéressantes liées aux deux phénomènes suivants :

  • - d'une part, la couche imprimante adhère très bien à la surface du voile du métal d'alliage encrophile ou de résine ainsi réalisée,
  • - d'autre part, la couche hydrophile apparaissant en fin d'opération s'est révélée toujours particulièrement propre, c'est-à- dire ne prenant pas l'encre.
The plates according to the invention have very interesting qualities linked to the following two phenomena:
  • on the one hand, the printer layer adheres very well to the surface of the veil of the metal of encrophilic alloy or of resin thus produced,
  • - on the other hand, the hydrophilic layer appearing at the end of the operation has always proved to be particularly clean, that is to say that does not take up the ink.

Claims (6)

1. Nouvelle plaque offset à utilisation de plaque monométallique comportant une couche imprimante caractérisée en ce qu'entre la surface aquaphile de la plaque et la couche imprimante on intercale un voile d'épaisseur compris entre 0,005 et 0,5 micron d'un matériau non hydrophile.1. New offset plate using a single-metal plate comprising a printing layer characterized in that between the aquaphile surface of the plate and the printing layer is interposed a veil of thickness between 0.005 and 0.5 micron of a non-material hydrophilic. 2. Nouvelle plaque selon la revendication 1, caractérisée en ce que ledit matériau non hydrophile est choisi parmi les métaux ou alliages métalliques encrophiles ou pouvant être rendus encrophiles.2. New plate according to claim 1, characterized in that said non-hydrophilic material is chosen from metals or metal alloys which are encrophilic or which can be made encrophilic. 3. Nouvelle plaque selon l'une des revendications 1 et 2, caractérisée en ce que ledit voile en matériau non hydrophile a été, avant d'être recouvert par ladite couche imprimante, traité selon le procédé connu de façon à rendre sa surface poreuse et/ou noircie ou colorée.3. New plate according to one of claims 1 and 2, characterized in that said veil of non-hydrophilic material has been, before being covered by said printing layer, treated according to the known method so as to make its surface porous and / or blackened or colored. 4. Nouvelle plaque selon l'une des revendications 1 à 3, caractérisée en ce que ledit voile en matériau non hydrophile a été, avant d'être recouverte par ladite couche imprimante, recouverte d'une mince résine encrophile.4. New plate according to one of claims 1 to 3, characterized in that said veil of non-hydrophilic material has been, before being covered by said printing layer, covered with a thin ink-absorbing resin. 5. Nouvelle plaque selon l'une des revendications 1 à 4, caractérisée en ce que la surface aquaphile est une surface métallique choisie parmi les surfaces en acier, acier inoxydable, chrome, étain, étain-nickel, aluminium ou zinc hydrophile.5. New plate according to one of claims 1 to 4, characterized in that the aquaphile surface is a metal surface chosen from steel, stainless steel, chromium, tin, tin-nickel, aluminum or hydrophilic zinc surfaces. 6, Procédé d'impression offset utilisant une nouvelle plaque offset selon l'une des revendications 1 à 5, caractérisé en ce que après avoir insolé la couche imprimante et enlevé les parties solubles de ladite couche, on enlève, par exemple, au moyen d'une solution de morsure, ledit voile dudit matériau encrophile mis à nu.6, A method of offset printing using a new offset plate according to one of claims 1 to 5 , characterized in that after having insulated the printer layer and removed the soluble parts of said layer, it is removed, for example, by means of a bite solution, said veil of said encrophilic material exposed.
EP79400974A 1978-12-12 1979-12-06 Offset printing plate to be used as monometallic plate comprising a printing surface and offset printing method using this plate Withdrawn EP0012673A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
FR7834955 1978-12-12
FR7834955A FR2443935A1 (en) 1978-12-12 1978-12-12 Offset printing plate with intermediate non-hydrophilic layer - between metal surface and printing layer
FR7917152A FR2460210B2 (en) 1979-07-02 1979-07-02 IMPROVED PROCESS FOR THE PREPARATION OF OFFSET PLATES AND PLATES OBTAINED
FR7917152 1979-07-02

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EP0012673A1 true EP0012673A1 (en) 1980-06-25

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998055310A1 (en) * 1997-06-03 1998-12-10 Agfa-Gevaert Naamloze Vennootschap Heat sensitive plate precursor
WO1998055311A1 (en) * 1997-06-03 1998-12-10 Agfa-Gevaert Naamloze Vennootschap Heat sensitive printing plate precursors
WO1998055332A1 (en) * 1997-06-03 1998-12-10 Agfa-Gevaert Naamloze Vennootschap Method of making lithographic printing plates

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL77123C (en) * 1900-01-01
DE556711C (en) * 1930-03-05 1932-08-13 Johannes May Metal pressure plate with a cadmium coating
FR1253949A (en) * 1960-01-07 1961-02-17 Nobel Bozel Polymetallic plates for offset printing
FR1511174A (en) * 1965-12-22 1968-01-26 Podniky Polygrafickeho Priemys Process for the manufacture of multi-layer offset printing plates as well as plates conforming to those thus obtained
FR2069924A1 (en) * 1969-12-05 1971-09-10 Hasek Josef Photolithographic plate - with reactive anticorrosion layer
FR2232195A5 (en) * 1973-05-30 1974-12-27 Schafler Armando Planographic printing plate for use with negative transparency - having long life, capable of accurate dot structure that produces high fidelity printing with good reprodn

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL77123C (en) * 1900-01-01
DE556711C (en) * 1930-03-05 1932-08-13 Johannes May Metal pressure plate with a cadmium coating
FR1253949A (en) * 1960-01-07 1961-02-17 Nobel Bozel Polymetallic plates for offset printing
FR1511174A (en) * 1965-12-22 1968-01-26 Podniky Polygrafickeho Priemys Process for the manufacture of multi-layer offset printing plates as well as plates conforming to those thus obtained
FR2069924A1 (en) * 1969-12-05 1971-09-10 Hasek Josef Photolithographic plate - with reactive anticorrosion layer
FR2232195A5 (en) * 1973-05-30 1974-12-27 Schafler Armando Planographic printing plate for use with negative transparency - having long life, capable of accurate dot structure that produces high fidelity printing with good reprodn

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998055310A1 (en) * 1997-06-03 1998-12-10 Agfa-Gevaert Naamloze Vennootschap Heat sensitive plate precursor
WO1998055311A1 (en) * 1997-06-03 1998-12-10 Agfa-Gevaert Naamloze Vennootschap Heat sensitive printing plate precursors
WO1998055332A1 (en) * 1997-06-03 1998-12-10 Agfa-Gevaert Naamloze Vennootschap Method of making lithographic printing plates
US6268110B1 (en) * 1997-06-03 2001-07-31 Agfa-Gevaert Heat sensitive plate precursor

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BR7908088A (en) 1980-07-22

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