EA201790666A1 - Толстопленочный элемент с защитным слоем, имеющим высокую теплопроводность - Google Patents

Толстопленочный элемент с защитным слоем, имеющим высокую теплопроводность

Info

Publication number
EA201790666A1
EA201790666A1 EA201790666A EA201790666A EA201790666A1 EA 201790666 A1 EA201790666 A1 EA 201790666A1 EA 201790666 A EA201790666 A EA 201790666A EA 201790666 A EA201790666 A EA 201790666A EA 201790666 A1 EA201790666 A1 EA 201790666A1
Authority
EA
Eurasian Patent Office
Prior art keywords
protective layer
thick
heating
thermal conductivity
high thermal
Prior art date
Application number
EA201790666A
Other languages
English (en)
Other versions
EA039226B1 (ru
Inventor
Веикон Хан
Original Assignee
Гюангдонг Флексварм Адвансед Материалс Енд Технологи Ко., Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Гюангдонг Флексварм Адвансед Материалс Енд Технологи Ко., Лтд. filed Critical Гюангдонг Флексварм Адвансед Материалс Енд Технологи Ко., Лтд.
Publication of EA201790666A1 publication Critical patent/EA201790666A1/ru
Publication of EA039226B1 publication Critical patent/EA039226B1/ru

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/009—Heaters using conductive material in contact with opposing surfaces of the resistive element or resistive layer
    • H05B2203/01—Heaters comprising a particular structure with multiple layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)

Abstract

В настоящем изобретении раскрыт толстопленочный элемент с защитным слоем, имеющим высокую теплопроводность, который включает носитель, толстопленочное покрытие, нанесенное на носитель, и защитный слой, нанесенный на покрытие; толстопленочное покрытие представляет собой нагревательные материалы, и нагрев осуществляется путем электрического нагрева, причем защитный слой, толстопленочное покрытие и носитель выбирают из материалов, удовлетворяющих следующим неравенствам:где 200≤a≤10, 0<b≤1000, 0<c≤5×10; защитный слой толстопленочного элемента по настоящему изобретению обладает высокой теплопроводностью, что делает его пригодным для продуктов с нагревом защитного слоя, тем самым улучшая эффективность теплопередачи и снижая потери тепла без нагрева с одной стороны; и толстопленочный элемент может быть использован в продуктах, в которых только защитный слой должен иметь высокую теплопроводность.
EA201790666A 2016-02-03 2016-03-26 Толстопленочный элемент с защитным слоем, имеющим высокую теплопроводность EA039226B1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610076006.6A CN106686771B (zh) 2016-02-03 2016-02-03 一种覆盖层具有高导热能力的厚膜元件
PCT/CN2016/077441 WO2017133069A1 (zh) 2016-02-03 2016-03-26 一种覆盖层具有高导热能力的厚膜元件

Publications (2)

Publication Number Publication Date
EA201790666A1 true EA201790666A1 (ru) 2019-05-31
EA039226B1 EA039226B1 (ru) 2021-12-20

Family

ID=58839163

Family Applications (1)

Application Number Title Priority Date Filing Date
EA201790666A EA039226B1 (ru) 2016-02-03 2016-03-26 Толстопленочный элемент с защитным слоем, имеющим высокую теплопроводность

Country Status (10)

Country Link
US (1) US10455643B2 (ru)
EP (1) EP3253175B1 (ru)
JP (1) JP6315642B2 (ru)
CN (1) CN106686771B (ru)
DK (1) DK3253175T3 (ru)
EA (1) EA039226B1 (ru)
ES (1) ES2757326T3 (ru)
PL (1) PL3253175T3 (ru)
PT (1) PT3253175T (ru)
WO (1) WO2017133069A1 (ru)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016224069A1 (de) * 2016-12-02 2018-06-07 E.G.O. Elektro-Gerätebau GmbH Kochgerät mit einer Kochplatte und einer Heizeinrichtung darunter
US10851458B2 (en) * 2018-03-27 2020-12-01 Lam Research Corporation Connector for substrate support with embedded temperature sensors
EP4102933B1 (en) 2021-06-07 2023-12-13 Calefact Limited Flexible heating device and methods of manufacture and use of same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU5824394A (en) * 1993-12-14 1995-07-03 Nikolai Evgenievich Peskov Heating element for a hot pad
CN1127976A (zh) * 1994-12-27 1996-07-31 深圳桑普节能技术有限公司 一种中温陶瓷电热膜
GB2322273B (en) 1997-02-17 2001-05-30 Strix Ltd Electric heaters
GB2351894B (en) * 1999-05-04 2003-10-15 Otter Controls Ltd Improvements relating to heating elements
CN1697572A (zh) * 2004-05-12 2005-11-16 环隆电气股份有限公司 电子加热元件
US7459104B2 (en) * 2005-07-18 2008-12-02 Datec Coating Corporation Low temperature fired, lead-free thick film heating element
JP2007265647A (ja) * 2006-03-27 2007-10-11 Harison Toshiba Lighting Corp ヒータ、加熱装置、画像形成装置
DE102009010437A1 (de) * 2009-02-26 2010-09-02 Tesa Se Beheiztes Flächenelement
GB2481217B (en) 2010-06-15 2017-06-07 Otter Controls Ltd Thick film heaters
LU92007B1 (en) * 2012-05-23 2013-11-25 Iee Sarl Polymer thick film device
CN103744276B (zh) 2014-02-12 2016-05-25 东莞市东思电子技术有限公司 一种激光打印机用厚膜加热元器件的制作方法

Also Published As

Publication number Publication date
DK3253175T3 (da) 2019-11-25
EA039226B1 (ru) 2021-12-20
ES2757326T3 (es) 2020-04-28
JP6315642B2 (ja) 2018-04-25
CN106686771A (zh) 2017-05-17
US20180352609A1 (en) 2018-12-06
EP3253175A4 (en) 2018-06-13
WO2017133069A1 (zh) 2017-08-10
EP3253175B1 (en) 2019-08-28
PL3253175T3 (pl) 2020-01-31
US10455643B2 (en) 2019-10-22
JP2018508924A (ja) 2018-03-29
PT3253175T (pt) 2019-11-20
EP3253175A1 (en) 2017-12-06
CN106686771B (zh) 2019-09-06

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