EA201390271A1 - Распылительная головка - Google Patents
Распылительная головкаInfo
- Publication number
- EA201390271A1 EA201390271A1 EA201390271A EA201390271A EA201390271A1 EA 201390271 A1 EA201390271 A1 EA 201390271A1 EA 201390271 A EA201390271 A EA 201390271A EA 201390271 A EA201390271 A EA 201390271A EA 201390271 A1 EA201390271 A1 EA 201390271A1
- Authority
- EA
- Eurasian Patent Office
- Prior art keywords
- spray head
- precursor
- purge gas
- channel
- precursors
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
- C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Coating Apparatus (AREA)
Abstract
Настоящее изобретение относится к распылительной головке (2) для подвергания поверхности (4) подложки (6) последовательным поверхностным реакциям, по меньшей мере, первого прекурсора (А) и второго прекурсора (В). Распылительная головка (2) содержит два или более вытянутых сопла (8, 10) прекурсора для подачи на поверхность (4) подложки (6) первого и второго прекурсоров (А, В). В соответствии с настоящим изобретением распылительная головка (2) содержит на выходной стороне (5) сопла (8, 10) подачи прекурсора, каналы (12) продувочного газа и выпускные каналы (42, 46) в следующей, факультативно повторяющейся множество раз последовательности: по меньшей мере, первое сопло (8) подачи прекурсора, первый выпускной канал (42), канал (12) продувочного газа, второе сопло (10) подачи прекурсора, второй выпускной канал (46) и канал (12) продувочного газа.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20105909A FI20105909A0 (fi) | 2010-08-30 | 2010-08-30 | Suutinpää |
PCT/FI2011/050750 WO2012028782A1 (en) | 2010-08-30 | 2011-08-29 | Nozzle head |
Publications (2)
Publication Number | Publication Date |
---|---|
EA201390271A1 true EA201390271A1 (ru) | 2013-08-30 |
EA022825B1 EA022825B1 (ru) | 2016-03-31 |
Family
ID=42669413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EA201390271A EA022825B1 (ru) | 2010-08-30 | 2011-08-29 | Распылительная головка |
Country Status (6)
Country | Link |
---|---|
CN (1) | CN103080372B (ru) |
DE (1) | DE112011102859T5 (ru) |
EA (1) | EA022825B1 (ru) |
FI (1) | FI20105909A0 (ru) |
TW (1) | TWI542412B (ru) |
WO (1) | WO2012028782A1 (ru) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5432396B1 (ja) * | 2013-02-28 | 2014-03-05 | 三井造船株式会社 | 成膜装置及びインジェクタ |
FI126315B (en) * | 2014-07-07 | 2016-09-30 | Beneq Oy | A nozzle head, apparatus and method for subjecting a substrate surface to successive surface reactions |
FI129730B (en) | 2017-10-18 | 2022-08-15 | Beneq Oy | Nozzle and nozzle head |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7537662B2 (en) * | 2003-04-29 | 2009-05-26 | Asm International N.V. | Method and apparatus for depositing thin films on a surface |
US7789961B2 (en) * | 2007-01-08 | 2010-09-07 | Eastman Kodak Company | Delivery device comprising gas diffuser for thin film deposition |
US8207063B2 (en) * | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
US8043432B2 (en) * | 2007-02-12 | 2011-10-25 | Tokyo Electron Limited | Atomic layer deposition systems and methods |
US8287647B2 (en) * | 2007-04-17 | 2012-10-16 | Lam Research Corporation | Apparatus and method for atomic layer deposition |
US8182608B2 (en) * | 2007-09-26 | 2012-05-22 | Eastman Kodak Company | Deposition system for thin film formation |
US8758512B2 (en) * | 2009-06-08 | 2014-06-24 | Veeco Ald Inc. | Vapor deposition reactor and method for forming thin film |
US20110076421A1 (en) * | 2009-09-30 | 2011-03-31 | Synos Technology, Inc. | Vapor deposition reactor for forming thin film on curved surface |
-
2010
- 2010-08-30 FI FI20105909A patent/FI20105909A0/fi not_active Application Discontinuation
-
2011
- 2011-08-29 CN CN201180041750.8A patent/CN103080372B/zh active Active
- 2011-08-29 EA EA201390271A patent/EA022825B1/ru not_active IP Right Cessation
- 2011-08-29 DE DE112011102859T patent/DE112011102859T5/de active Pending
- 2011-08-29 WO PCT/FI2011/050750 patent/WO2012028782A1/en active Application Filing
- 2011-08-30 TW TW100131025A patent/TWI542412B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN103080372B (zh) | 2015-05-27 |
EA022825B1 (ru) | 2016-03-31 |
WO2012028782A1 (en) | 2012-03-08 |
FI20105909A0 (fi) | 2010-08-30 |
TWI542412B (zh) | 2016-07-21 |
CN103080372A (zh) | 2013-05-01 |
TW201217061A (en) | 2012-05-01 |
DE112011102859T5 (de) | 2013-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EA201491521A1 (ru) | Форсунка и форсуночная головка | |
CL2009001300A1 (es) | Proceso para gasificar urea para reducir los oxidos de nitrogeno en gases de combustion; con la etapa de proporcionar una placa de distribucion de gas con arreglo y espaciamiento de agujeros; y aparato para llevar a cabo dicho proceso. | |
EP2617495A3 (de) | Farbspritzpistole mit einem Grundkörper und einer auswechselbaren Farbleiteinrichtung | |
MY158463A (en) | Print carriage | |
MX2017012667A (es) | Filtros catalizados con revestimiento final para escape de motores pobre. | |
EP2620224A3 (en) | Spray head | |
MY156940A (en) | System and methods for distributing gas in a chemical vapor deposition reactor | |
EA201390271A1 (ru) | Распылительная головка | |
MX2009005566A (es) | Aparato y sistema de plasma. | |
WO2009029942A3 (en) | Mechanically integrated and closely coupled print head and mist source | |
MX346939B (es) | Anillo de aire conformador y proceso de recubrimiento correspondiente. | |
SG133543A1 (en) | Apparatus and system for cleaning a substrate | |
WO2011035046A3 (en) | Stackable multi-port gas nozzles | |
MX359187B (es) | Pistola de termoaspersión con punta de boquilla removible y método de elaboración y uso de la misma. | |
EP2318555A4 (en) | Improved quench zone design using spray nozzles | |
WO2011116273A3 (en) | System and method for polycrystalline silicon deposition | |
WO2012134070A3 (ko) | 가스 주입 장치, 원자층 증착장치 및 이 장치를 이용한 원자층 증착방법 | |
DE602007009682D1 (de) | Einspritzsystem mit querstromdüse für verbesserten druckerdgasstrahlspray | |
EP3061845A3 (en) | Metal organic chemical vapor deposition apparatus for solar cell | |
TW200514622A (en) | Fluid injection nozzle | |
EA201391680A1 (ru) | Канал для отходящего газа | |
EP2158088A4 (en) | FLUID COLLECTOR FOR FLUID EJECTION DEVICE | |
WO2013064737A3 (en) | Apparatus and method for processing substrate | |
BRPI0520472A2 (pt) | cabeçote de ejeção de gotìculas de lìquido; instrumento de escrita compreendendo tal cabeçote e método para ejeção de gotìculas de lìquido a partir do mesmo | |
RU2012135387A (ru) | Способ микроволновой конверсии метан-водяной смеси в синтез-газ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s) |
Designated state(s): AM AZ BY KZ KG MD TJ TM |