EA035003B1 - Vacuum assembly for applying thin-film coatings and method for applying optical coatings to same - Google Patents

Abstract

The invention relates to a vacuum process assembly and to a method for applying thin-film coatings having given optical characteristics to same. Said vacuum assembly includes an airlock chamber which is affixed to a transport system and which is capable of moving with a vertically-disposed drum-type substrate-holder inside same or without same, and of docking with a process chamber by means of a horizontal high-vacuum shutter located under the process chamber. The application of thin-film optical coatings is carried out in working zones of the process chamber by means of chemical deposition in high-density plasma, wherein, the application of coatings involves a plasma generation system in which sources of induction discharge are disposed along a vertical axis, and the working space is divided into working zones by means of high-vacuum pumping means and protective screens. The invention allows for the compact disposition of equipment and for a high-performance and economical method of applying thin-film optical coatings, having high consumer properties, onto flexible and solid substrates of various types and dimensions.

Description

The group of inventions relates to the field of technological equipment for coating, namely, vacuum technological equipment intended for applying thin-film coatings with specified optical, electrical and other characteristics.

The prior art various methods for applying thin-film coatings on the workpiece and devices for implementing the methods.

In particular, an analogue of both the claimed installation and the method of applying thin-film coatings is known [1]. This source describes the installation of periodic action, including a holder of substrates in the form of a drum, along the generatrix of which install and fix substrates, isolated from each other of the loading and unloading chamber located on the sides of the vertical technological chamber, which contains magnetrons for applying thin films and plasma generators for their oxidation, located around the perimeter of the process chamber around the substrate holder. In this case, the processing zones of the substrates in the technological chamber are separated by shield walls, and between the substrate holder with the substrates located in the center of the technological chamber and plasma generators in the processing zones are placed grids holding charged particles from the gas plasma, such as electrons and ions.

The method of applying thin-film coatings according to the aforementioned patent consists in vacuum applying thin-film coatings to substrates placed on a rotating drum and in their oxidation. In this case, the substrates are moved several times through each treatment zone.

The disadvantages of this installation and method are the low productivity of the vacuum installation and the significant cost of products;

the presence of complex mechanisms for transferring and loading drum-type substrate holders into the lock chambers and the process chamber, since the entrance and exit lock chambers are necessary;

the ability to use a limited number of technological devices, as horizontal loading of drum-type substrate holders into the process chamber requires space for inlet and outlet lock chambers;

the high cost of the substrate holder due to the presence of transmission, loading and docking devices with a drive mechanism;

the service life of the vacuum process plant is reduced due to the presence of mechanics and drive mechanisms inside the plant, and the quality of the obtained thin-film coatings deteriorates.

The closest analogue of both the claimed installation and the method of applying thin-film coatings [2] describes a vacuum processing line for applying thin-film coatings to workpieces, including sequentially located entrance lock chamber, input buffer chamber, technological chamber with technological devices installed in it, an output buffer chamber, an exit lock chamber, high vacuum pumps, as well as a substrate holder made in the form of a rotating drum mounted in bearings on a carriage, which has the ability to move along the chambers along the guides of the transport system. At the same time, detachable magnetic clutch elements are installed at the ends of the substrate holder shaft for transmitting rotation, and an electric drive is used to rotate the substrate holder located on the carriage frame. Technological devices are installed along the movement of the substrate holder on the carriage and the working processing zone is defined as the area along the movement.

The method according to the aforementioned patent includes applying thin-film coatings, in which the substrates are placed on a drum substrate holder, which is successively moved with the substrates through the processing chambers parallel to the axis of rotation of the drum and rotated with the same constant linear and angular velocity. At the same time, coating is applied in the technological chamber by means of technological devices located in the processing zones. When carrying out the technological process, the substrate holder with the substrates passes through the lock chambers, technological chambers, buffer chambers and technological corridors. When thin layers are applied, followed by oxidation, each point of the processed substrate repeatedly passes sequentially past devices for applying ultrathin layers of material.

The disadvantages of this technological line and method are the need to use large production areas for linear equipment and its high material consumption, especially in the case of complex and precision coatings, since this requires an increase in the number of process chambers and the use of complex control and adjustment systems;

uneconomical when using lengthy processes of applying multilayer coatings, since if you need to sequentially apply multiple layers, the long time intervals of stay of products in the processing zones force either to reduce the speed of the rotating conveyor and moving devices or to bring the size of the devices used in accordance with the time of the process, which requires the use of large and expensive mechanisms;

the presence of a complex device for mounting and moving substrates with rotation devices

- 1 035003 inside the vacuum chamber and, consequently, the low quality of the obtained thin-film coatings due to the presence of mechanics inside the vacuum installation.

The present invention is the creation of a compact industrial vacuum installation for applying thin-film coatings on substrates of various sizes, which is applicable for complex and lengthy technological processes with the possibility of using a wide range of technologies and technological devices and a high-performance and economical method of applying thin-film optical coatings on this installation, which will allow improve consumer properties of thin-film coatings.

The task in a vacuum installation for applying thin-film coatings comprising at least one process chamber containing technological devices and means of high-vacuum pumping, at least one lock chamber, a high-vacuum shutter connecting the process chamber to the lock chamber, a drum type substrate holder made for rotation around its axis, and the transport system for moving the drum type substrate holder, it is decided that the lock chamber is mounted on the transport system and configured to move along the transport system or with its use with a vertically located drum type holder with or without it and docking with the process chamber through a horizontal high-vacuum shutter located under the technological chamber, and the working space in the technological chamber is divided into working zones through the use of high-vacuum pumping means and protective x screens.

The problem is also solved by the fact that the device for moving and rotating the substrate holder of the drum type are located outside the airlock and technological chambers. The drum type substrate holder has at least six interchangeable receiving devices for mounting substrates of various sizes or a removable cylindrical surface for mounting flexible substrates.

The problem is also solved by the fact that one lock chamber can be fixed on the transport system, which performs reciprocating movements along linear guides or at least two lock chambers, then the transport system is a carousel.

In the most preferred embodiment of the implementation of the vacuum installation, at least one technological device installed in the technological chamber is a high density plasma generation system comprising at least two sources of induction discharge, on the axis of each of which there are permanent electromagnets.

The task in the claimed method for applying thin-film optical coatings, characterized in that the substrates mounted on a drum type substrate holder are rotated at a constant angular speed, and thin-film coatings are applied in a technological chamber into which the drum type substrate holder is transferred using a transport system from the lock chamber, It is decided that the transportation of a vertically located drum holder of the drum type is carried out in a lock chamber fixed to the transport system, which is joined to the process chamber from below through a horizontal high-vacuum shutter. In this case, the application of thin-film optical coatings is carried out in the working areas of the process chamber by chemical deposition in high-density plasma. At least one plasma generation system is used for coating, in which the sources of induction discharge are located on the inner side surface of the process chamber one after another along a vertical axis parallel to the axis of rotation of the drum holder, or staggered in relation to this axis. The division of the working space into working areas is carried out by means of high-vacuum pumping facilities and protective screens. After coating and removing the drum holder from the process chamber, it is cleaned.

In the most preferred embodiment of the method, before applying the optical coating, the surface of the rotating substrates is cleaned and activated in oxygen and hydrogen plasma.

When applying a thin-film optical coating, the power density transmitted to the plasma by induction discharge sources exceeds 0.1 W / cm ³ .

The working gas is ionized in the plasma formation working zone due to an external constant magnetic field with an induction of 0.1-3 mT, while the magnetic field is formed by permanent electromagnets located outside the process chamber on the axis of the sources of the induction discharge.

One of the options for implementing the method is the use of at least two generation systems, the coating being carried out by means of one plasma generation system, and the oxidation by another. In this case, oxidation is understood not only as actual oxidation, but also nitriding, fluorination, etc.

The invention is illustrated by the following drawings:

in FIG. 1 is a side view of a process chamber mounted on a chassis;

in FIG. 2 is a top view of a process chamber on a frame;

- 2 035003 in FIG. 3 - transport system, which is a carousel with two lock chambers;

in FIG. 4 is a general view of a drum type substrate holder;

in FIG. 5 is a general view of a four-seater carousel transport system;

in FIG. 6 is a top view of a vacuum processing unit with three process chambers, a four-seater carousel transport system and a lock chamber with a drum-type substrate holder inside at one of the positions of the transport system;

in FIG. 7 is a diagram of the arrangement of devices in a vacuum process chamber for implementing the patented method for applying optical coatings;

in FIG. Figure 8 shows a graph of the reflection coefficient of the surface of a glass substrate with an antireflection coating on the wavelength of incident light.

The vacuum installation for applying thin-film coatings (Fig. 1-3) includes a process chamber 1 mounted on a frame 2, on the side surface of which technological devices 3, high-vacuum pumps 4 are located to provide and maintain a vacuum during technological operations and to ensure gas separation of the worker space on the working areas, a rotating drum holder 5, while a rotation drive 6 of the substrate holder 5 is mounted on the lid of the process chamber 1 with a high-vacuum rotation input (not shown) inside the process chamber. The transport system 7 with at least one lock chamber 8 fixed on it serves to move the lock chamber with a vertically located substrate holder 5 inside from the loading / unloading zone to the working position under the technological chamber 1. On the lower side, the technological chamber 1 is equipped with a horizontal high-vacuum shutter 9, through which is the movement of the substrate holder 5 from the lock chamber 8 to the processing chamber 1 and vice versa. To move the substrate holder 5 outside, under the lock chamber 8, a substrate holder supply device 10 is installed with a high-vacuum motion input (not shown in the figures) inside the lock chamber.

During technological operations, the drum-type substrate holder 5 is located inside the technological chamber 1, and the technological devices 3 are located along the perimeter of the technological chamber 1 around the vertical axis of rotation of the substrate holder 5. The rotation drive 6 of the substrate holder 5 drives the substrate holder 5 after loading it inside the technological chamber 1.

The drive 6 of the rotation of the substrate holder 5 and the device 10 for feeding it into the technological chamber 1 are located outside the technological and lock chambers, respectively, which avoids contamination of the working space inside the chambers, which, in turn, ensures the purity of the technological process, and hence the increased quality of the applied coatings .

The substrate holder 5 of the drum type (Fig. 4) has either at least six interchangeable receiving devices (faces) 12 for different sizes of substrates 13 or a cylindrical surface for mounting flexible substrates. In the loading / unloading position on the substrate holder 5, substrates 13 can be replaced, the faces 12 can be replaced together with the substrates, or the substrate holder 5 itself can be replaced. This universal loading option makes it possible to process substrates both flexible (foil, glass, metal) and vacuum solid flat (lithium niobate, lithium tantalate, glass, silicon, sapphire, glass, etc.) of various sizes.

The vacuum installation can be equipped with two types of transport systems 7: reciprocating - for one lock chamber or carousel (revolver) type - for two or more lock chambers. One lock chamber 8 in the vacuum installation, making reciprocating movements along linear guides from the processing chamber 1 to the loading / unloading position, simplifies the design of the vacuum installation as a whole and reduces the material consumption of the equipment. If it is necessary to perform complex technological processes of applying thin-film coatings, the transport system 7 can be made in the form of a multi-seat carousel (Fig. 5), with which it is possible to carry out in several technological chambers 1 either technological operations of applying thin-film coatings, or control, cleaning, washing and other

In FIG. 6 is a top view of a vacuum unit with three process chambers 1, between which a four-seater carousel transport system 7 moves the lock chambers 8 with substrate holders 5 along the entire process chain until a finished product is obtained. In this case, the transport system 7 with lock chambers 8, and / or the loading / unloading zone, can be located in clean zone A, where both manually and automatically it is possible to load substrates 13 onto the substrate holder 5 and unload the finished products.

The clean area is the part of the room in which the concentration of aerosol particles is controlled and which is built and used to minimize the intake, generation and accumulation of particles inside the room, and in which, if necessary, other parameters are controlled, for example, temperature, humidity and pressure .

To ensure high quality products obtained by applying thin-film coatings in a vacuum, when placing technological equipment in a line, there is a need to place clean zones at the beginning and at the end of the technological chain at the loading positions of the substrates and

- 3 035003 unloading of finished products. When equipping the installation with technological chambers arranged in a circle (Fig. 6), with the substrate holders being loaded in a vertical position below the technological chamber, it is possible to organize only one clean zone A, since loading and unloading positions can be combined.

High-vacuum pumping means 4 (Fig. 7) and protective shields 18 located along the perimeter of the technological chamber divide the working space in the technological chamber 1 into several working zones, thereby creating conditions for the stable operation of technological devices of various types. The location of technological devices in one vacuum chamber using different working areas allows you to save production space occupied by equipment during complex multi-stage technological processes, for which the standard for linear type plants is to perform each operation in a separate technological chamber.

A patented method for applying thin-film optical coatings on a patented installation is as follows. The substrates 13 are fixed on the substrate holder 5 outside the lock chamber 8, after which the feeder 10 in the vertical position is automatically lowered into the lock chamber 8, mounted on the transport system 7. The lock chamber 8 with the drum holder 5 is moved to the processing chamber 1 using the transport system 7. After the lock chamber 8 occupies its working position under the process chamber 1, the movement is stopped and the lock chamber is lifted and pressed against the horizontal high-vacuum shutter 9. The lock chamber is pumped out with a low-vacuum pump 11 to a pressure of 2Pa, after which the high-vacuum shutter 9 and open feed device 10, the holder of the substrates 5 is lifted into the processing chamber 1 until docking with the rotation drive 6.

The technological chamber 1 with the substrate holder inside the high vacuum pumps 4 is pumped out to high vacuum to a pressure of less than 0.003 Pa, after which the rotation of the substrate holder 5 is started and accelerated to the speed necessary for the coating process.

Before the process of applying an optical coating, plasma cleaning and activation of the surface of the substrates by induction discharge plasma is carried out to remove molecular particles, adsorbed gases, polymer fragments, water vapor, as well as to atomically activate surface bonds on the surface of the substrate, in order to improve the adhesion of the applied layer. In this case, purification in oxygen plasma removes residues of organic contaminants, and purification in hydrogen plasma hydrogines the surface, passivating surface bonds. For the cleaning and activation process, oxygen is supplied to the vacuum process chamber 1 through the multi-zone gas supply system 14 (Fig. 7), the pressure is regulated, and the high-density plasma generation system 15 is turned on. The substrates are processed in accordance with a predetermined time interval. Then, hydrogen is supplied to the working chamber 1 through the gas supply system 14, and the oxygen supply is stopped, the pressure is regulated, and cleaning continues. Turn off the plasma generation system 15 and stop the supply of hydrogen after cleaning.

After the cleaning and activation process, a thin-film optical coating is applied to the prepared substrate surfaces by chemical vapor deposition in a high-density plasma.

Chemical vapor deposition in high-density plasma provides the formation of coatings with fewer defects, better and widely controlled by stoichiometry and low mechanical stresses. Low mechanical stresses in the film are due to the structure of the films obtained by chemical deposition methods and the fact that the difference between the deposition temperature and the operating temperature of the product is minimal and does not exceed 100 °. At the same time, controlled stoichiometry makes it possible to improve the properties of coatings with fewer applied layers.

In addition, the process of creating high-quality films becomes more profitable, since gas purification is cheaper than cleaning solid targets of magnetron sputtering systems, which are used in the method of reactive magnetron sputtering [1], which is currently a direct competitor to the method of chemical vapor deposition, since it has a comparable deposition rate and a fairly high quality coating.

Optical coatings are applied depending on the given optical characteristics of the coating using one or two plasma generation systems 15. In this case, high-vacuum pumping means 4 and protective shields 18, dividing the working space in the technological chamber 1 into several working zones, create conditions for the stable operation of technological devices.

The high-density plasma generation system 15 includes at least two sources of induction discharge 16 (RIR) operating at an industrial frequency of 13.56 MHz and located one after another along a vertical axis parallel to the axis of rotation of the substrate holder, or with a staggered offset relative to this axis . The use of a plasma generation system with the indicated arrangement of induction discharge sources makes it possible to achieve uniformity of coatings over the entire height of the substrate holder.

An increase in the degree of ionization of the working gas in the working zone of plasma formation 17 is achieved after

- 4 035003 due to an external constant magnetic field with induction of 0.1-3 mT. The magnetic field is formed by permanent electromagnets 19 located outside the process chamber 1 on the axis of the sources of the induction discharge.

The deposition of oxides, nitrides or other materials can be carried out by a single plasma generation system. In this case, the working gases are supplied through a multi-zone gas supply system 14 to the plasma formation zone 17, where they are activated, move to the substrate and form a coating.

If the deposition of the layers is carried out by two plasma generation systems 15, a thin layer of a semiconductor or metal is deposited in one plasma formation zone 17 of the plasma generation system 15. During rotation, the substrate falls into the region of operation of another plasma generation system 15, where oxide, nitride, fluoride, etc. are formed. Separation of the processes of deposition and oxidation (in this case, oxidation is understood as real oxidation, as well as nitriding, fluorination, etc. ) improves the uniformity of the formed coating, simplifies the adjustment of the uniformity of deposition and allows more flexible control of the stoichiometry of the layer.

After coating with the desired optical properties, the rotation of the substrate holder 5 is stopped, the feed device of the substrate holder 10 moves the substrate holder into the lock chamber 8, the high-vacuum shutter 9 is closed and air is let into the lock chamber, the pressure is balanced with atmospheric pressure, after which the lock chamber 8 is disconnected from the substrate holder 5 from the technological chamber 1 and the transport system 7 are moved to the loading / unloading zone, where the substrates are replaced.

After unloading the finished products, the technological chamber 1 is subjected to plasma-chemical cleaning to partially remove the deposited material from the in-chamber equipment. Cleaning the process chamber is as follows. After unloading the substrate carrier 5 of the drum type, the working gas NF _{3 is} supplied to the process chamber 1 and the high-density plasma generation system 15 is turned on. Cleaning continues for a predetermined period of time. Turn off the high-density plasma generation system, turn off the supply of working gases, and the installation is ready for the next cycle of the technological process. Cleaning the process chamber after the completion of each coating cycle reduces the number of defects in the coating, which in turn ensures high quality coatings and increases the intervals between service maintenance of equipment.

Currently existing plasma-chemical deposition plants in high-density plasma [3, 4] allow applying dielectric coatings on substrates with uniformity of 1.5–2%. These installations are focused on piece processing of samples and are not intended for mass production of optical products. The claimed technological vacuum system allows to achieve uniformity of no worse than 0.5% when applying optical coatings in mass production with a deposition rate of 0.5-1 nm / s with a processing area of 1 m ² and a continuous cycle of 90%. Such indicators are achievable due to the placement of substrates on a rotating drum-type substrate holder, the use of a system of induction discharge sources with separate electromagnets for each IRS and a multi-zone gas supply system.

The rotation of the substrate holder allows you to reduce the number of degrees of freedom to adjust uniformity to one along the vertical axis of the substrate holder. Using a system of induction discharge sources allows increasing the uniformity of plasma generation along the vertical axis and increasing the power density deposited in the discharge, concentrating it in a small volume - the plasma formation working zone, which increases the degree of working gas dissociation and improves the optical parameters of the coating. Permanent electromagnets placed on the axis of the sources of the induction discharge also serve to increase the plasma concentration.

Low mechanical stresses in the film are due to the structure of the coatings obtained by plasma-chemical deposition in high-density plasma at low temperature. In such coatings, mechanical stresses are caused mainly by the difference in thermal expansion coefficients of the film and substrate materials. Since in the inventive method the deposition temperature is less than 100 ° C, the mechanical stresses are much lower than in films obtained by plasma-chemical deposition in a capacitive discharge plasma [3, 4], where the deposition temperature must be more than 300 ° C. In contrast to physical deposition methods [1, 2], films obtained by the claimed method do not have structural stresses, which reduces the general mechanical stresses in the film. And low mechanical stresses, in turn, improve the resistance of thin-film coatings to mechanical stress and make it possible to apply films to thin substrates, which can be bent due to tension in the coatings.

An example embodiment of the invention is as follows.

In the clean zone, transparent plates 13 of tempered glass 220x280 mm in size are fixed on fifteen interchangeable faces 12 of the substrate holder 5 with a special double-sided tape. Then, at the loading / unloading position, faces 12 filled with substrates are installed in the substrate holder 5, after which the substrate holder is automatically lowered in a vertical position into the lock chamber 8, mounted on the transport system 7. The lock chamber 8 with the drum type substrate holder 5 inside is moved to the processing chamber 1 by transport system 7. After

- 5 035003 as the lock chamber 8 falls into its working position under the technological chamber 1, the movement is stopped and the lock chamber 8 is automatically lifted and pressed against the horizontal high-vacuum shutter 9. The lock chamber 8 is pumped out with a low-vacuum pump to a pressure of 20 Pa, after which the high-vacuum shutter is opened 9 and the feeder 10, the substrate holder 5 is lifted into the process chamber 1, before docking with the rotation drive 6.

The technological chamber 1 with the substrate holder 5 inside is pumped out to a pressure of less than 0.003 Pa with high-vacuum pumps 4, after which the rotation of the substrate holder 5 is started and accelerated to a speed of 150 rpm.

To clean and activate the substrates, oxygen is supplied through the multi-zone gas supply system 14 to the vacuum process chamber 1, the pressure is adjusted to 0.7-3 Pa, the high-density plasma generation system 15 is turned on. The substrates are cleaned for at least 1 min. Then hydrogen is supplied to the working chamber, and the oxygen supply is stopped, the pressure is maintained in the same range. Processing of the substrates is continued for another 1 min.

Then, a transparent coating consisting of periodically repeating layers is successively applied to the transparent tempered glass substrates 13, where a layer with a high H refractive index is followed by a layer with a low L refractive index. The number of layers of both types is eight. The sequence of layers, their thickness and refractive indices are presented in the table.

The deposition of each layer of antireflection coating is carried out by a single plasma generation system. Working gases are fed through a multi-zone gas supply system 14 to the plasma formation zone 17, where they are activated, move to the substrate and form a coating .____________

Layer number Layer index Material n Physical Thickness [nm] 1 N SiN _x 1.8 14.5 2 3 L N SiO _x SiN _x 1.44 1.8 32,5 65.1 4 L SiO _x 1.44 48.1 5 N SiN _x 1.8 38 6 L SiO _x 1.44 30.6 7 N SiN _x 1.8 85.6 8 L SiO _x 1.44 86.1

In FIG. Figure 8 shows the dependence of the reflection coefficient of the antireflection coating corresponding to the table on the wavelength of the incident light.

The formation of the coating is carried out in the following sequence. Through the gas supply system 14, the working gases SiH ₄ , N ₂ used to form an antireflection coating are fed into the vacuum process chamber 1. The pressure in the chamber is adjusted to 0.5-3Pa and the high-density plasma generation system is turned on 15. An odd layer of an antireflection coating with a high H refractive index is deposited. In this case, this layer is silicon nitride SiN _x . The moment of deposition is determined by the moment the RF power is turned off. Then, the composition of the gaseous medium is changed: the working gases SiH4, O ₂ are fed into the chamber 1 through the gas supply system 14, and again the high-density plasma generation system 15 is turned on. An even layer of a-SiO _x antireflection coating with a low L refractive index is deposited.

In the deposition process, the density of the RF power is “0.2 W / cm ³ , the rotational speed of the drum is 150 rpm. Such conditions ensure the deposition in one revolution of a layer with a thickness of about 0.15-0.5 nm, which corresponds to a thickness of 2-6 monomolecular layers and ensures the formation of a dense (pore-free) and defect-free coating with the lowest mechanical stresses.

The deposition of layers L and H is repeated 4 times until an antireflection coating with the given optical properties is formed (table), after which the flow of reactive gases is stopped.

After coating with the desired optical properties, the rotation of the substrate holder 5 is stopped by the rotation drive 6, then the substrate holder is moved to the airlock 8 by the feeder 10, the high-vacuum shutter 9 is closed, air is let into the airlock and the atmospheric pressure is equalized, after which the airlock the chamber 8 with the drum holder 5 is moved by a rotary on-off transport system 7 to a clean area at the loading / unloading position, where the substrates are changed.

Cleaning the process chamber 1 is as follows. After unloading the substrate carrier of drum type 5 from the process chamber 1 to the lock chamber 8 and close the high-vacuum shutter 9, the working gas NF _{3 is} supplied to the process chamber. The working pressure is adjusted to 1 Pa, the high-density plasma generation system 15 is turned on. Moreover, the density of the RF power is “0.2 W / cm ³ . Cleaning is continued for 10 minutes. Next, turn off the high-density plasma generation system, turn off the supply of working gases. Installation is ready for the repetition of technological

- 6,035,003 processes with the next batch of substrates. Moreover, the implementation of optical transmission control during the implementation of the process ensures its reproducibility.

The claimed vacuum installation for applying thin-film coatings due to the use in the technological chamber of a rotating holder of drum-type substrates in the vertical position allows the use of various technological devices placed on its side surface. In this case, individual conditions for each technological device inside the chamber are achieved through the use of gose separation into working areas.

The placement of technological devices of various types in one vacuum technological chamber allows to reduce the size and material consumption of equipment, reduce the number of pumping facilities and, thus, ensure the compactness of equipment placement in the production room. The compactness of the vacuum equipment as a whole is also ensured by the placement of a transport system with lock chambers fixed on it under the technological chambers.

The claimed installation and the method of applying thin-film optical coatings on it allow you to implement complex methods of applying thin-film coatings on substrates of various sizes and increase the intervals of operation of the equipment. At the same time, the claimed method for producing optical coatings at the installation has high performance, allows to reduce the number of defects and improve the uniformity of the optical and physical properties of the coatings.

Sources of information.

1. US Patent No. 6274014, published August 14, 2001.

2. RF patent No. RU 2507308, published on 02.20.2014.

3.Official website of Company Oxford Instrument, - Mode of access: http://www.oxfordinstmments.com/products/etching-deposition-and-growth/processes/deposition-processes/dielectrics/sio2deposition - Date of access: 12.02. 2016.

4. Presentation by Company Corial Corial 300 IL GaN & Sapphire Etching ICP System - Mode of access: http://www.corial.net/resources/13_300IL/Corial%2030QIL.pdf-Date of access: 02/12/2016.

Claims (14)

CLAIM 1. Vacuum installation for applying thin-film coatings, comprising at least one technological chamber, containing technological devices and means of high-vacuum pumping, at least one lock chamber, high-vacuum shutter connecting the technological chamber with the lock chamber, drum type substrate holder made for rotation around its axis, and a transport system for moving the drum-type substrate holder, characterized in that the lock chamber is mounted on the transport system and is configured to move with the drum-type substrate holder vertically located with or without it and docking with the process chamber through a horizontal high-vacuum shutter located under technological chamber; the working space in the technological chamber is divided into working areas due to the use of high vacuum pumping means and protective shields. 2. Installation according to claim 1, characterized in that the device for moving and rotating the substrate holder of the drum type are located outside the lock and process chambers. 3. Installation according to claim 1, characterized in that the drum type substrate holder has interchangeable receiving devices for mounting substrates of various sizes. 4. Installation according to claim 3, characterized in that the drum type substrate holder has at least six interchangeable receiving devices for different sizes of substrates. 5. Installation according to claim 3, characterized in that the drum type substrate holder has a replaceable cylindrical surface for mounting flexible substrates. 6. Installation according to claim 1, characterized in that one lock chamber is fixed on the transport system, which performs reciprocating movements along linear guides. 7. Installation according to claim 1, characterized in that the transport system is a carousel with at least two lock chambers installed on it. 8. Installation according to claim 1, characterized in that at least one technological device is a high density plasma generation system comprising at least two sources of induction discharge, on the axis of each of which there are permanent electromagnets. 9. The method of applying thin-film optical coatings using the device according to claim 1, characterized in that the thin film coatings are applied to substrates mounted on a drum type substrate holder rotating at a constant angular velocity, into which the drum type substrate holder is transferred using a transport systems from the lock chamber, characterized in that the transportation of the vertically arranged drum holder of the drum mud is carried out in a lock chamber fixed to the transport system, which is joined to the process chamber from below through a horizontal high-vacuum shutter; thin-film optical coatings are applied in techno work areas - 7 035003 of the logic chamber by chemical deposition in high-density plasma, and at least one plasma generation system is used for coating, in which the sources of induction discharge are located on a vertical axis parallel to the axis of rotation of the drum holder, or in a checkerboard pattern relative to this axis after coating and removing the drum holder, the process chamber is cleaned; the separation of the working space into working areas is carried out by means of high-vacuum pumping facilities and protective screens. 10. The method according to claim 9, characterized in that before applying the optical coating, the surface of the rotating substrates is cleaned and activated in oxygen and hydrogen plasma. 11. The method according to claim 9, characterized in that the power density transmitted to the plasma by sources of induction discharge exceeds 0.1 W / cm ³ . 12. The method according to claim 9, characterized in that the ionization of the working gas in the working zone of plasma formation is carried out due to an external constant magnetic field with induction of 0.1-3 mT. 13. The method according to p. 12, characterized in that the magnetic field is formed by permanent electromagnets located outside the process chamber on the axis of the sources of the induction discharge. 14. The method according to claim 9, characterized in that the plasma is formed using at least two plasma generation systems, wherein the coating is carried out by means of one plasma generation system, and the oxidation is performed by the other.