DK87587D0 - Epoxy/aromatiske aminharpikssystemer, der indeholder aromatiske trihydroxyforbindelser som haerdeacceleratorer - Google Patents

Epoxy/aromatiske aminharpikssystemer, der indeholder aromatiske trihydroxyforbindelser som haerdeacceleratorer

Info

Publication number
DK87587D0
DK87587D0 DK087587A DK87587A DK87587D0 DK 87587 D0 DK87587 D0 DK 87587D0 DK 087587 A DK087587 A DK 087587A DK 87587 A DK87587 A DK 87587A DK 87587 D0 DK87587 D0 DK 87587D0
Authority
DK
Denmark
Prior art keywords
aromatic
aminharpic
accelerators
epoxy
hard
Prior art date
Application number
DK087587A
Other languages
English (en)
Other versions
DK87587A (da
Inventor
Shahid Parvez Qureshi
Hugh Chester Gardner
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Publication of DK87587A publication Critical patent/DK87587A/da
Publication of DK87587D0 publication Critical patent/DK87587D0/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DK087587A 1985-06-21 1987-02-20 Epoxy/aromatiske aminharpikssystemer, der indeholder aromatiske trihydroxyforbindelser som haerdeacceleratorer DK87587D0 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/747,189 US4593056A (en) 1985-06-21 1985-06-21 Epoxy/aromatic amine resin systems containing aromatic trihydroxy compounds as cure accelerators
PCT/US1986/000898 WO1986007597A1 (en) 1985-06-21 1986-04-30 Epoxy/aromatic amine resin systems containing aromatic trihydroxy compounds as cure accelerators

Publications (2)

Publication Number Publication Date
DK87587A DK87587A (da) 1987-02-20
DK87587D0 true DK87587D0 (da) 1987-02-20

Family

ID=25004041

Family Applications (1)

Application Number Title Priority Date Filing Date
DK087587A DK87587D0 (da) 1985-06-21 1987-02-20 Epoxy/aromatiske aminharpikssystemer, der indeholder aromatiske trihydroxyforbindelser som haerdeacceleratorer

Country Status (10)

Country Link
US (1) US4593056A (da)
EP (1) EP0229770B1 (da)
JP (1) JPS63500102A (da)
AU (1) AU5865386A (da)
CA (1) CA1246293A (da)
DE (1) DE3674183D1 (da)
DK (1) DK87587D0 (da)
IL (1) IL78658A0 (da)
WO (1) WO1986007597A1 (da)
ZA (1) ZA863252B (da)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5599628A (en) * 1984-03-01 1997-02-04 Amoco Corporation Accelerated cycloaliphatic epoxide/aromatic amine resin systems
CA1259897A (en) * 1985-04-02 1989-09-26 Madan M. Bagga Bonding process using curable epoxide resin adhesive
DE3517013A1 (de) * 1985-05-11 1986-11-13 Schering AG, 1000 Berlin und 4709 Bergkamen Verwendung von haertbaren kunstharzmischungen fuer druckfarben und ueberdrucklacke, verfahren zum bedrucken von oberflaechen und mittel fuer das verfahren
CA1307610C (en) * 1986-10-03 1992-09-15 Robert C. Allen Rubber-modified thermosettable resin composition
US5096771A (en) * 1988-07-14 1992-03-17 General Electric Company Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether
US4975319A (en) * 1988-07-14 1990-12-04 General Electric Company Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether
US4853423A (en) * 1988-07-14 1989-08-01 General Electric Company Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production
JPH0760918B2 (ja) * 1988-07-20 1995-06-28 三菱電機株式会社 積層用樹脂組成物
US5075379A (en) * 1989-02-23 1991-12-24 First Chemical Corporation Rubber/diamine blends for use in curing epoxy resins
JPH02291992A (ja) * 1989-05-01 1990-12-03 Sumitomo Heavy Ind Ltd 放射線測定装置の製造方法
EP0446719A1 (en) * 1990-03-08 1991-09-18 Bromine Compounds Ltd. Amino phenoxy compounds and process for their preparation
AU7711891A (en) * 1990-05-17 1991-11-21 Ici Australia Operations Proprietary Limited Heat curable adhesive
US5244719A (en) * 1990-10-23 1993-09-14 Amoco Corporation Prepreg with improved room temperature storage stability
US5385990A (en) * 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance
US5541000A (en) * 1993-08-17 1996-07-30 Minnesota Mining And Manufacturing Company Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms
ES2254855T3 (es) 1997-03-10 2006-06-16 Nippon Shokubai Co., Ltd. Procedimiento para preparar derivados de tetraquis (fluoroaril) borato.
US6590011B1 (en) 2000-05-01 2003-07-08 Polymeright, Inc. Radiation initiated epoxy-amine systems
US7118837B2 (en) * 2002-01-08 2006-10-10 International Business Machines Corporation Photoimaged dielectric polymer and film, and circuit package containing the same
US6806033B2 (en) 2002-01-08 2004-10-19 International Business Machines Corporation Photoimaged dielectric, its manufacture and use in electronics
DE102004049717A1 (de) * 2004-10-11 2006-04-13 Henkel Kgaa Alterungsbeständige Beschichtungen und Klebeverbunde
JP4732001B2 (ja) * 2005-05-26 2011-07-27 株式会社タムラ製作所 ビルドアップ基板層間絶縁材料用熱硬化性樹脂組成物、樹脂フィルム、フィルム付き製品およびビルドアップ基板の層間絶縁材料
US20080200084A1 (en) * 2007-02-16 2008-08-21 Angus Richard O Compositions for thin circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
KR20140018852A (ko) * 2010-12-01 2014-02-13 플라산 카본 컴포짓, 인코포레이티드 복합 물품을 형성하는 방법과 시스템
DE102011016918B4 (de) * 2011-04-13 2018-01-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Lösungsmittelfreie Epoxidharzmischung, Verfahren zu deren Herstellung sowie deren Verwendung
US20140159267A1 (en) 2011-07-28 2014-06-12 Plasan Carbon Composites, Inc. System and method for forming composite articles
JP5983590B2 (ja) * 2013-12-13 2016-08-31 株式会社デンソー 硬化性樹脂組成物、封止材、及びこれを用いた電子デバイス製品
CN110352207A (zh) * 2017-03-02 2019-10-18 东丽株式会社 环氧树脂组合物、预浸料坯以及纤维增强复合材料
RU2663444C1 (ru) * 2017-10-30 2018-08-06 Акционерное общество "Препрег-Современные Композиционные Материалы" (АО "Препрег-СКМ") Эпоксидное связующее, препрег на его основе и изделие, выполненное из него
WO2020187681A1 (en) 2019-03-15 2020-09-24 Henkel Ag & Co. Kgaa Sulfone-resin containing gas-barrier adhesive

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1054045A (da) * 1900-01-01
US2510885A (en) * 1946-03-08 1950-06-06 Devoe & Raynolds Co Amine-epoxy-phenol compositions
GB1017699A (en) * 1963-03-11 1966-01-19 Ciba Ltd Curable b-stage epoxide resin compositions
US3779950A (en) * 1972-01-03 1973-12-18 Gen Electric Epoxy resin compositions
BE793700A (fr) * 1972-01-07 1973-07-05 Schering Ag Durcisseurs pour les resines epoxydiques
JPS534056A (en) * 1975-12-25 1978-01-14 Dainippon Toryo Co Ltd Aqueous resin compositions having chelate-forming ability
JPS53102400A (en) * 1976-05-14 1978-09-06 Dainippon Toryo Co Ltd Solventiless epoxy resin composition having chelate formability
JPS5322598A (en) * 1976-08-05 1978-03-02 Dainippon Toryo Co Ltd Aqueous epoxy resin composition using chelate-forming curing agent
CH635604A5 (de) * 1978-06-22 1983-04-15 Ciba Geigy Ag Mischung auf basis eines haertbaren epoxidharzes, eines haerters dafuer und eines haertungsbeschleunigers.
CH637150A5 (de) * 1978-10-30 1983-07-15 Ciba Geigy Ag Epoxidharzformmasse.
JPS57192428A (en) * 1981-05-20 1982-11-26 Ajinomoto Co Inc One-pack type epoxy resin composition

Also Published As

Publication number Publication date
IL78658A0 (en) 1986-08-31
US4593056A (en) 1986-06-03
EP0229770A1 (en) 1987-07-29
DK87587A (da) 1987-02-20
JPS63500102A (ja) 1988-01-14
WO1986007597A1 (en) 1986-12-31
AU5865386A (en) 1987-01-13
DE3674183D1 (de) 1990-10-18
CA1246293A (en) 1988-12-06
EP0229770B1 (en) 1990-09-12
ZA863252B (en) 1986-12-30

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