DK552386A - Termoplastisk loddemiddel og fremgangsmaade samt apparat til dettes anvendelse - Google Patents

Termoplastisk loddemiddel og fremgangsmaade samt apparat til dettes anvendelse

Info

Publication number
DK552386A
DK552386A DK552386A DK552386A DK552386A DK 552386 A DK552386 A DK 552386A DK 552386 A DK552386 A DK 552386A DK 552386 A DK552386 A DK 552386A DK 552386 A DK552386 A DK 552386A
Authority
DK
Denmark
Prior art keywords
soldering
components
bonding material
temperature
soldered
Prior art date
Application number
DK552386A
Other languages
Danish (da)
English (en)
Other versions
DK552386D0 (da
Inventor
Karl Heinz Wendisch
Original Assignee
Kawe Electronik Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawe Electronik Gmbh & Co Kg filed Critical Kawe Electronik Gmbh & Co Kg
Publication of DK552386D0 publication Critical patent/DK552386D0/da
Publication of DK552386A publication Critical patent/DK552386A/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
DK552386A 1985-03-20 1986-11-19 Termoplastisk loddemiddel og fremgangsmaade samt apparat til dettes anvendelse DK552386A (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853510000 DE3510000A1 (de) 1985-03-20 1985-03-20 Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung
PCT/EP1986/000146 WO1986005428A1 (en) 1985-03-20 1986-03-14 Thermoplastic soldering material, process and device

Publications (2)

Publication Number Publication Date
DK552386D0 DK552386D0 (da) 1986-11-19
DK552386A true DK552386A (da) 1986-11-19

Family

ID=6265760

Family Applications (1)

Application Number Title Priority Date Filing Date
DK552386A DK552386A (da) 1985-03-20 1986-11-19 Termoplastisk loddemiddel og fremgangsmaade samt apparat til dettes anvendelse

Country Status (8)

Country Link
EP (1) EP0219517B1 (enrdf_load_stackoverflow)
JP (1) JPS62502673A (enrdf_load_stackoverflow)
AT (1) ATE45692T1 (enrdf_load_stackoverflow)
AU (1) AU5664686A (enrdf_load_stackoverflow)
BR (1) BR8606737A (enrdf_load_stackoverflow)
DE (2) DE3510000A1 (enrdf_load_stackoverflow)
DK (1) DK552386A (enrdf_load_stackoverflow)
WO (1) WO1986005428A1 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4831724A (en) * 1987-08-04 1989-05-23 Western Digital Corporation Apparatus and method for aligning surface mountable electronic components on printed circuit board pads
JPH0747233B2 (ja) * 1987-09-14 1995-05-24 古河電気工業株式会社 半田析出用組成物および半田析出方法
DE3908097A1 (de) * 1989-03-13 1990-09-20 Irion & Vosseler Praegefolie zum aufbringen von leiterbahnen auf feste oder plastische unterlagen
JPH02259721A (ja) * 1989-03-31 1990-10-22 Tokyo Electron Ltd 液晶基板の製造装置
DE4033430A1 (de) * 1990-10-20 1992-04-23 Licentia Gmbh Verfahren zum herstellen eines lotmittelauftrags
US5346558A (en) * 1993-06-28 1994-09-13 W. R. Grace & Co.-Conn. Solderable anisotropically conductive composition and method of using same
JP3498427B2 (ja) * 1995-06-19 2004-02-16 ソニー株式会社 成形はんだ用フラックス

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2833030A (en) * 1952-09-19 1958-05-06 Wall Colmonoy Corp Method of joining metal parts with flexible composite joining material
GB1131375A (en) * 1967-05-12 1968-10-23 Standard Telephones Cables Ltd Copper brazing paste
GB1375997A (enrdf_load_stackoverflow) * 1970-12-31 1974-12-04
CH569543A5 (enrdf_load_stackoverflow) * 1972-07-26 1975-11-28 Castolin Sa
US3915729A (en) * 1974-04-09 1975-10-28 Du Pont High temperature solder pastes
ES490073A0 (es) * 1979-04-06 1981-05-16 Johnson Matthey Co Ltd Procedimiento para la obtencion de una composicion para sol-dar.
DE2914621A1 (de) * 1979-04-11 1980-10-23 Standard Elektrik Lorenz Ag Verfahren zum loeten von bauelementen in hybridschaltkreise und einrichtung zur durchfuehrung des verfahrens
FR2476428A1 (fr) * 1980-02-15 1981-08-21 Tech Electro Cie Indle Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede
DE3010610A1 (de) * 1980-03-20 1981-10-01 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur selektiven verzinnung der loetaugen von gedruckten schaltungen

Also Published As

Publication number Publication date
EP0219517A1 (de) 1987-04-29
DE3510000A1 (de) 1986-10-02
DK552386D0 (da) 1986-11-19
AU5664686A (en) 1986-10-13
EP0219517B1 (de) 1989-08-23
ATE45692T1 (de) 1989-09-15
JPS62502673A (ja) 1987-10-15
BR8606737A (pt) 1987-08-11
DE3665141D1 (en) 1989-09-28
WO1986005428A1 (en) 1986-09-25
DE3510000C2 (enrdf_load_stackoverflow) 1990-02-15

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment