DK469489A - Underlag til en trykt kredsloebsplade, flydende materiale til dens fremstilling samt deres fremstilling - Google Patents

Underlag til en trykt kredsloebsplade, flydende materiale til dens fremstilling samt deres fremstilling Download PDF

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Publication number
DK469489A
DK469489A DK469489A DK469489A DK469489A DK 469489 A DK469489 A DK 469489A DK 469489 A DK469489 A DK 469489A DK 469489 A DK469489 A DK 469489A DK 469489 A DK469489 A DK 469489A
Authority
DK
Denmark
Prior art keywords
manufacturing
support
printed circuit
liquid material
circuit plate
Prior art date
Application number
DK469489A
Other languages
Danish (da)
English (en)
Other versions
DK469489D0 (da
Inventor
George Martin Benedikt
David John Smith
Original Assignee
Goodrich Co B F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goodrich Co B F filed Critical Goodrich Co B F
Publication of DK469489D0 publication Critical patent/DK469489D0/da
Publication of DK469489A publication Critical patent/DK469489A/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
DK469489A 1988-09-23 1989-09-22 Underlag til en trykt kredsloebsplade, flydende materiale til dens fremstilling samt deres fremstilling DK469489A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/248,371 US5274026A (en) 1988-09-23 1988-09-23 Curable polycycloolefin resin solutions, their use in making printed circuit boards and the boards so made

Publications (2)

Publication Number Publication Date
DK469489D0 DK469489D0 (da) 1989-09-22
DK469489A true DK469489A (da) 1990-03-24

Family

ID=22938806

Family Applications (1)

Application Number Title Priority Date Filing Date
DK469489A DK469489A (da) 1988-09-23 1989-09-22 Underlag til en trykt kredsloebsplade, flydende materiale til dens fremstilling samt deres fremstilling

Country Status (8)

Country Link
US (1) US5274026A (ja)
EP (1) EP0360295A3 (ja)
JP (1) JPH02198190A (ja)
CN (1) CN1042158A (ja)
BR (1) BR8904847A (ja)
DK (1) DK469489A (ja)
MX (1) MX170095B (ja)
NO (1) NO174245C (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5728785A (en) * 1995-07-07 1998-03-17 California Institute Of Technology Romp polymerization in the presence of peroxide crosslinking agents to form high-density crosslinked polymers
AU756688B2 (en) * 1998-06-05 2003-01-23 Georgia Tech Research Corporation Porous insulating compounds and method for making same
MY139405A (en) 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
AU6416399A (en) 1998-10-01 2000-04-17 Airtech International, Inc. Method of molding or curing a resin material at high temperatures using a multilayer release film
JP2001071416A (ja) * 1999-09-03 2001-03-21 Hitachi Chem Co Ltd 銅張り積層板の製造方法
FR2807521A1 (fr) * 2000-04-07 2001-10-12 Bp Chemicals Snc Methode de mesure de compressibilite a chaud de poudre
US6559215B2 (en) * 2000-07-19 2003-05-06 Dow Global Technologies Inc. Spin-on-dielectric compositions with coating enhancer
TWI226103B (en) 2000-08-31 2005-01-01 Georgia Tech Res Inst Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
US20040058106A1 (en) * 2002-09-17 2004-03-25 Leone Erlinda Dugaduga Packaged solvent-containing cosmetic composition
WO2004067601A1 (ja) * 2003-01-31 2004-08-12 Zeon Corporation 重合性組成物、熱可塑性樹脂組成物、架橋樹脂及び架橋樹脂複合材料
KR101129739B1 (ko) * 2003-08-13 2012-03-23 니폰 제온 가부시키가이샤 중합성 조성물, 및 이것을 이용하여 제조된 성형체
US7364672B2 (en) * 2004-12-06 2008-04-29 Arlon, Inc. Low loss prepregs, compositions useful for the preparation thereof and uses therefor
WO2007125922A1 (ja) * 2006-04-25 2007-11-08 Hitachi Chemical Company, Ltd. 接着層付き導体箔、導体張積層板、印刷配線板及び多層配線板
US7648758B2 (en) * 2007-02-06 2010-01-19 Innegrity, Llc Low dielectric loss composite material
JP2008294459A (ja) * 2008-07-11 2008-12-04 Ibiden Co Ltd 多層プリント配線板
JP5116857B2 (ja) * 2011-01-07 2013-01-09 イビデン株式会社 多層プリント配線板及び多層プリント配線板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3318758A (en) * 1963-02-18 1967-05-09 Tellite Corp Method of making a printed circuit board which includes low temperature saturation and the product
US3508983A (en) * 1967-04-24 1970-04-28 Schjeldahl Co G T Use of a silane coating to bond copper to plastic in making a printed circuit
US3558423A (en) * 1967-10-16 1971-01-26 Electronized Chem Corp Low loss electrical printed circuit board comprising polyolefin,fiberglass and metallic foil
US4136247A (en) * 1977-12-05 1979-01-23 The B. F. Goodrich Company Ring-opened iso-propylnorbornene copolymers
US4178424A (en) * 1977-12-05 1979-12-11 The Bf Goodrich Company Cycloolefin copolymers
US4292106A (en) * 1978-07-11 1981-09-29 Clark-Schwebel Fiber Glass Corp. Process of producing reinforced laminates from crosslinkable thermoplastic olefin polymer material
US4241132A (en) * 1978-08-17 1980-12-23 Castall Incorporated Insulating boards
JPS5698136A (en) * 1980-01-08 1981-08-07 Kanegafuchi Chem Ind Co Ltd Continuous manufacture of laminated substance
US4315970A (en) * 1980-02-11 1982-02-16 Dow Corning Corporation Adhesion of metals to solid substrates
JPS61185994A (ja) * 1985-02-13 1986-08-19 信越化学工業株式会社 耐熱性フレキシブルプリント配線用基板およびその製造方法
JPS61296036A (ja) * 1985-06-24 1986-12-26 Hitachi Chem Co Ltd 積層板の製造法
JPH0641523B2 (ja) * 1985-08-08 1994-06-01 三井石油化学工業株式会社 環状オレフイン共重合体の架橋方法
US4701510A (en) * 1985-12-16 1987-10-20 The B.F. Goodrich Company Polycycloolefins resistant to solvents
IN168456B (ja) * 1985-12-16 1991-04-06 Goodrich Co B F
EP0303969A3 (en) * 1987-08-14 1990-10-17 The B.F. Goodrich Company Bulk polymerized cycloolefin circuit boards
US4910077A (en) * 1988-08-04 1990-03-20 B.F. Goodrich Company Polynorbornene laminates and method of making the same

Also Published As

Publication number Publication date
EP0360295A3 (en) 1992-02-26
BR8904847A (pt) 1990-05-08
NO174245B (no) 1993-12-27
EP0360295A2 (en) 1990-03-28
JPH02198190A (ja) 1990-08-06
NO174245C (no) 1994-04-06
US5274026A (en) 1993-12-28
NO893800D0 (no) 1989-09-25
NO893800L (no) 1990-03-26
CN1042158A (zh) 1990-05-16
DK469489D0 (da) 1989-09-22
MX170095B (es) 1993-08-06

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment