DK445375A - Fremgangsmade til formning af en berer for et halvlederorgan under tryk - Google Patents

Fremgangsmade til formning af en berer for et halvlederorgan under tryk

Info

Publication number
DK445375A
DK445375A DK445375A DK445375A DK445375A DK 445375 A DK445375 A DK 445375A DK 445375 A DK445375 A DK 445375A DK 445375 A DK445375 A DK 445375A DK 445375 A DK445375 A DK 445375A
Authority
DK
Denmark
Prior art keywords
bererer
leader
organ
shaping
procedure
Prior art date
Application number
DK445375A
Other languages
Danish (da)
English (en)
Inventor
R A Nippert
Original Assignee
Nippert Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippert Co filed Critical Nippert Co
Publication of DK445375A publication Critical patent/DK445375A/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49915—Overedge assembling of seated part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49925—Inward deformation of aperture or hollow body wall
    • Y10T29/49934—Inward deformation of aperture or hollow body wall by axially applying force
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/49—Member deformed in situ
    • Y10T403/4991—Both members deformed
DK445375A 1974-10-03 1975-10-02 Fremgangsmade til formning af en berer for et halvlederorgan under tryk DK445375A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US511939A US3918625A (en) 1974-10-03 1974-10-03 Method of making a double extruded semiconductor joint

Publications (1)

Publication Number Publication Date
DK445375A true DK445375A (da) 1976-04-04

Family

ID=24037049

Family Applications (1)

Application Number Title Priority Date Filing Date
DK445375A DK445375A (da) 1974-10-03 1975-10-02 Fremgangsmade til formning af en berer for et halvlederorgan under tryk

Country Status (11)

Country Link
US (1) US3918625A (enExample)
JP (1) JPS5731297B2 (enExample)
CA (1) CA1027259A (enExample)
CH (1) CH590559A5 (enExample)
DE (1) DE2529789C3 (enExample)
DK (1) DK445375A (enExample)
FR (1) FR2287106A1 (enExample)
GB (1) GB1525122A (enExample)
IT (1) IT1036425B (enExample)
NL (1) NL176413C (enExample)
SE (1) SE408352B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device
US4049185A (en) * 1977-03-11 1977-09-20 The Nippert Company Method of forming double extruded mount
US4624303A (en) * 1985-04-29 1986-11-25 The Nippert Company Heat sink mounting and method of making
US4985978A (en) * 1988-03-01 1991-01-22 Textron Inc. Method for assembling a self-clinching fastening structure
US6453558B1 (en) * 2001-04-06 2002-09-24 Arvinmeritor, Inc. Method of locking together exhaust components
US7247564B2 (en) * 2004-06-28 2007-07-24 Hewlett-Packard Development Company, L.P. Electronic device
US10446351B2 (en) * 2017-06-06 2019-10-15 Littelfuse, Inc. Electrical contact assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2419469A (en) * 1943-04-24 1947-04-22 Gen Electric Manufacturing method for electrical contacts
US3042428A (en) * 1954-04-05 1962-07-03 Gen Electric Copper-aluminum tubular connector
US3191268A (en) * 1958-02-28 1965-06-29 Gen Motors Corp Process for encapsulating transistors
NL120008C (enExample) * 1959-05-15
NL270996A (enExample) * 1960-11-09
US3198874A (en) * 1961-01-23 1965-08-03 Standard Pressed Steel Co Semi-conductor housings and method of making the same
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
NL142278B (nl) * 1964-06-20 1974-05-15 Philips Nv Werkwijze voor het vervaardigen van een bodem van een voor een halfgeleidende inrichting bestemde omhulling en bodem, vervaardigd volgens deze werkwijze.
NL7115486A (enExample) * 1970-11-16 1972-05-18

Also Published As

Publication number Publication date
NL176413B (nl) 1984-11-01
SE7506919L (sv) 1976-04-05
CA1027259A (en) 1978-02-28
SE408352B (sv) 1979-06-05
NL7510492A (nl) 1976-04-06
DE2529789B2 (de) 1980-07-03
DE2529789A1 (de) 1976-04-15
JPS5148276A (enExample) 1976-04-24
JPS5731297B2 (enExample) 1982-07-03
US3918625A (en) 1975-11-11
GB1525122A (en) 1978-09-20
DE2529789C3 (de) 1981-12-10
CH590559A5 (enExample) 1977-08-15
FR2287106A1 (fr) 1976-04-30
IT1036425B (it) 1979-10-30
FR2287106B1 (enExample) 1982-05-28
NL176413C (nl) 1985-04-01

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