SE7506919L - Hallare for halvledareanordning och sett att framstella denna hallare - Google Patents
Hallare for halvledareanordning och sett att framstella denna hallareInfo
- Publication number
- SE7506919L SE7506919L SE7506919A SE7506919A SE7506919L SE 7506919 L SE7506919 L SE 7506919L SE 7506919 A SE7506919 A SE 7506919A SE 7506919 A SE7506919 A SE 7506919A SE 7506919 L SE7506919 L SE 7506919L
- Authority
- SE
- Sweden
- Prior art keywords
- haller
- main body
- semiconductor device
- extrusion
- cup
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000001125 extrusion Methods 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49915—Overedge assembling of seated part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49925—Inward deformation of aperture or hollow body wall
- Y10T29/49934—Inward deformation of aperture or hollow body wall by axially applying force
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T403/00—Joints and connections
- Y10T403/49—Member deformed in situ
- Y10T403/4991—Both members deformed
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US511939A US3918625A (en) | 1974-10-03 | 1974-10-03 | Method of making a double extruded semiconductor joint |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7506919L true SE7506919L (sv) | 1976-04-05 |
| SE408352B SE408352B (sv) | 1979-06-05 |
Family
ID=24037049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7506919A SE408352B (sv) | 1974-10-03 | 1975-06-17 | Hallare med vermebortledande egenskaper for en halvledaranordning och sett for dess framstellning |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US3918625A (sv) |
| JP (1) | JPS5731297B2 (sv) |
| CA (1) | CA1027259A (sv) |
| CH (1) | CH590559A5 (sv) |
| DE (1) | DE2529789C3 (sv) |
| DK (1) | DK445375A (sv) |
| FR (1) | FR2287106A1 (sv) |
| GB (1) | GB1525122A (sv) |
| IT (1) | IT1036425B (sv) |
| NL (1) | NL176413C (sv) |
| SE (1) | SE408352B (sv) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4192063A (en) * | 1975-12-10 | 1980-03-11 | Yoshio Sato | Method for manufacturing a base of a semi-conductor device |
| US4049185A (en) * | 1977-03-11 | 1977-09-20 | The Nippert Company | Method of forming double extruded mount |
| US4624303A (en) * | 1985-04-29 | 1986-11-25 | The Nippert Company | Heat sink mounting and method of making |
| US4985978A (en) * | 1988-03-01 | 1991-01-22 | Textron Inc. | Method for assembling a self-clinching fastening structure |
| US6453558B1 (en) * | 2001-04-06 | 2002-09-24 | Arvinmeritor, Inc. | Method of locking together exhaust components |
| US7247564B2 (en) * | 2004-06-28 | 2007-07-24 | Hewlett-Packard Development Company, L.P. | Electronic device |
| US10446351B2 (en) * | 2017-06-06 | 2019-10-15 | Littelfuse, Inc. | Electrical contact assembly |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2419469A (en) * | 1943-04-24 | 1947-04-22 | Gen Electric | Manufacturing method for electrical contacts |
| US3042428A (en) * | 1954-04-05 | 1962-07-03 | Gen Electric | Copper-aluminum tubular connector |
| US3191268A (en) * | 1958-02-28 | 1965-06-29 | Gen Motors Corp | Process for encapsulating transistors |
| NL266908A (sv) * | 1959-05-15 | |||
| NL270996A (sv) * | 1960-11-09 | |||
| US3198874A (en) * | 1961-01-23 | 1965-08-03 | Standard Pressed Steel Co | Semi-conductor housings and method of making the same |
| US3197843A (en) * | 1961-05-19 | 1965-08-03 | Nippert Electric Products Comp | Method of forming a mount for semiconductors |
| NL142278B (nl) * | 1964-06-20 | 1974-05-15 | Philips Nv | Werkwijze voor het vervaardigen van een bodem van een voor een halfgeleidende inrichting bestemde omhulling en bodem, vervaardigd volgens deze werkwijze. |
| NL7115486A (sv) * | 1970-11-16 | 1972-05-18 |
-
1974
- 1974-10-03 US US511939A patent/US3918625A/en not_active Expired - Lifetime
-
1975
- 1975-06-17 SE SE7506919A patent/SE408352B/sv not_active IP Right Cessation
- 1975-06-20 CA CA229,779A patent/CA1027259A/en not_active Expired
- 1975-07-02 IT IT68717/75A patent/IT1036425B/it active
- 1975-07-03 DE DE2529789A patent/DE2529789C3/de not_active Expired
- 1975-07-31 FR FR7524053A patent/FR2287106A1/fr active Granted
- 1975-08-14 JP JP9905575A patent/JPS5731297B2/ja not_active Expired
- 1975-08-25 CH CH1097675A patent/CH590559A5/xx not_active IP Right Cessation
- 1975-09-05 NL NLAANVRAGE7510492,A patent/NL176413C/xx not_active IP Right Cessation
- 1975-10-02 GB GB40421/75A patent/GB1525122A/en not_active Expired
- 1975-10-02 DK DK445375A patent/DK445375A/da unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2287106B1 (sv) | 1982-05-28 |
| DE2529789A1 (de) | 1976-04-15 |
| GB1525122A (en) | 1978-09-20 |
| CH590559A5 (sv) | 1977-08-15 |
| JPS5148276A (sv) | 1976-04-24 |
| DK445375A (da) | 1976-04-04 |
| IT1036425B (it) | 1979-10-30 |
| NL176413C (nl) | 1985-04-01 |
| DE2529789C3 (de) | 1981-12-10 |
| FR2287106A1 (fr) | 1976-04-30 |
| SE408352B (sv) | 1979-06-05 |
| DE2529789B2 (de) | 1980-07-03 |
| CA1027259A (en) | 1978-02-28 |
| US3918625A (en) | 1975-11-11 |
| NL176413B (nl) | 1984-11-01 |
| NL7510492A (nl) | 1976-04-06 |
| JPS5731297B2 (sv) | 1982-07-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |
Ref document number: 7506919-5 Effective date: 19930109 Format of ref document f/p: F |