FR2287106A1 - Procede de realisation d'un support de semiconducteur - Google Patents

Procede de realisation d'un support de semiconducteur

Info

Publication number
FR2287106A1
FR2287106A1 FR7524053A FR7524053A FR2287106A1 FR 2287106 A1 FR2287106 A1 FR 2287106A1 FR 7524053 A FR7524053 A FR 7524053A FR 7524053 A FR7524053 A FR 7524053A FR 2287106 A1 FR2287106 A1 FR 2287106A1
Authority
FR
France
Prior art keywords
making
semiconductor support
semiconductor
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7524053A
Other languages
English (en)
French (fr)
Other versions
FR2287106B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luvata Ohio Inc
Original Assignee
Nippert Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippert Co filed Critical Nippert Co
Publication of FR2287106A1 publication Critical patent/FR2287106A1/fr
Application granted granted Critical
Publication of FR2287106B1 publication Critical patent/FR2287106B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49915—Overedge assembling of seated part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49925—Inward deformation of aperture or hollow body wall
    • Y10T29/49934—Inward deformation of aperture or hollow body wall by axially applying force
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/49—Member deformed in situ
    • Y10T403/4991—Both members deformed
FR7524053A 1974-10-03 1975-07-31 Procede de realisation d'un support de semiconducteur Granted FR2287106A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US511939A US3918625A (en) 1974-10-03 1974-10-03 Method of making a double extruded semiconductor joint

Publications (2)

Publication Number Publication Date
FR2287106A1 true FR2287106A1 (fr) 1976-04-30
FR2287106B1 FR2287106B1 (enExample) 1982-05-28

Family

ID=24037049

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7524053A Granted FR2287106A1 (fr) 1974-10-03 1975-07-31 Procede de realisation d'un support de semiconducteur

Country Status (11)

Country Link
US (1) US3918625A (enExample)
JP (1) JPS5731297B2 (enExample)
CA (1) CA1027259A (enExample)
CH (1) CH590559A5 (enExample)
DE (1) DE2529789C3 (enExample)
DK (1) DK445375A (enExample)
FR (1) FR2287106A1 (enExample)
GB (1) GB1525122A (enExample)
IT (1) IT1036425B (enExample)
NL (1) NL176413C (enExample)
SE (1) SE408352B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device
US4049185A (en) * 1977-03-11 1977-09-20 The Nippert Company Method of forming double extruded mount
US4624303A (en) * 1985-04-29 1986-11-25 The Nippert Company Heat sink mounting and method of making
US4985978A (en) * 1988-03-01 1991-01-22 Textron Inc. Method for assembling a self-clinching fastening structure
US6453558B1 (en) * 2001-04-06 2002-09-24 Arvinmeritor, Inc. Method of locking together exhaust components
US7247564B2 (en) * 2004-06-28 2007-07-24 Hewlett-Packard Development Company, L.P. Electronic device
US10446351B2 (en) * 2017-06-06 2019-10-15 Littelfuse, Inc. Electrical contact assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2419469A (en) * 1943-04-24 1947-04-22 Gen Electric Manufacturing method for electrical contacts
US3042428A (en) * 1954-04-05 1962-07-03 Gen Electric Copper-aluminum tubular connector
US3191268A (en) * 1958-02-28 1965-06-29 Gen Motors Corp Process for encapsulating transistors
NL120008C (enExample) * 1959-05-15
NL270996A (enExample) * 1960-11-09
US3198874A (en) * 1961-01-23 1965-08-03 Standard Pressed Steel Co Semi-conductor housings and method of making the same
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
NL142278B (nl) * 1964-06-20 1974-05-15 Philips Nv Werkwijze voor het vervaardigen van een bodem van een voor een halfgeleidende inrichting bestemde omhulling en bodem, vervaardigd volgens deze werkwijze.
NL7115486A (enExample) * 1970-11-16 1972-05-18

Also Published As

Publication number Publication date
NL176413C (nl) 1985-04-01
SE7506919L (sv) 1976-04-05
DK445375A (da) 1976-04-04
SE408352B (sv) 1979-06-05
US3918625A (en) 1975-11-11
CH590559A5 (enExample) 1977-08-15
NL7510492A (nl) 1976-04-06
JPS5731297B2 (enExample) 1982-07-03
DE2529789A1 (de) 1976-04-15
DE2529789C3 (de) 1981-12-10
FR2287106B1 (enExample) 1982-05-28
CA1027259A (en) 1978-02-28
JPS5148276A (enExample) 1976-04-24
GB1525122A (en) 1978-09-20
NL176413B (nl) 1984-11-01
DE2529789B2 (de) 1980-07-03
IT1036425B (it) 1979-10-30

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Legal Events

Date Code Title Description
ST Notification of lapse