DK359287A - Flerlaget kredsloebsplade med stive og boejelige omraader - Google Patents

Flerlaget kredsloebsplade med stive og boejelige omraader

Info

Publication number
DK359287A
DK359287A DK359287A DK359287A DK359287A DK 359287 A DK359287 A DK 359287A DK 359287 A DK359287 A DK 359287A DK 359287 A DK359287 A DK 359287A DK 359287 A DK359287 A DK 359287A
Authority
DK
Denmark
Prior art keywords
flexible
circuit board
rigid
layers
locally
Prior art date
Application number
DK359287A
Other languages
English (en)
Other versions
DK359287D0 (da
DK165153C (da
DK165153B (da
Inventor
Friedrich-Wilhelm Schlitter
Original Assignee
Schoeller & Co Elektronik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller & Co Elektronik filed Critical Schoeller & Co Elektronik
Publication of DK359287D0 publication Critical patent/DK359287D0/da
Publication of DK359287A publication Critical patent/DK359287A/da
Publication of DK165153B publication Critical patent/DK165153B/da
Application granted granted Critical
Publication of DK165153C publication Critical patent/DK165153C/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Cable Accessories (AREA)
DK359287A 1986-07-22 1987-07-10 Flerlaget kredsloebsplade med stive og boejelige omraader DK165153C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3624718 1986-07-22
DE19863624718 DE3624718A1 (de) 1986-07-22 1986-07-22 Mehrlagige, starre und flexible bereiche aufweisende leiterplatte

Publications (4)

Publication Number Publication Date
DK359287D0 DK359287D0 (da) 1987-07-10
DK359287A true DK359287A (da) 1988-01-23
DK165153B DK165153B (da) 1992-10-12
DK165153C DK165153C (da) 1993-03-01

Family

ID=6305683

Family Applications (1)

Application Number Title Priority Date Filing Date
DK359287A DK165153C (da) 1986-07-22 1987-07-10 Flerlaget kredsloebsplade med stive og boejelige omraader

Country Status (4)

Country Link
EP (1) EP0254082B1 (da)
AT (1) ATE55532T1 (da)
DE (2) DE3624718A1 (da)
DK (1) DK165153C (da)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
US5004639A (en) * 1990-01-23 1991-04-02 Sheldahl, Inc. Rigid flex printed circuit configuration
DE4003345C1 (da) * 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4003344C1 (da) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4115703C1 (da) * 1991-05-14 1992-08-27 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
GB9125173D0 (en) * 1991-11-27 1992-01-29 Northumbria Circuits Limited Printed circuit combination and process
DE4208610C1 (en) * 1992-03-18 1993-05-19 Fa. Carl Freudenberg, 6940 Weinheim, De Rigid-flexible PCB with flexible circuit foil mfg. - having flexible PCB in flexible region with fracture lines in rigid outer layers along rigid-flexible transition allowing rigid part to be removed along fracture lines after processing
US6298013B1 (en) 1993-11-15 2001-10-02 Siemens Aktiengesellschaft Device for monitoring the travel time of mail shipments
WO1995024821A1 (en) * 1994-03-08 1995-09-14 Teledyne Industries, Inc. Fabrication multilayer combined rigid/flex printed circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3346415A (en) * 1963-12-16 1967-10-10 Carl L Hachenberger Flexible printed circuit wiring
DE2657212C3 (de) * 1976-12-17 1982-09-02 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
JPS5683096A (en) * 1979-12-10 1981-07-07 Sony Corp Hybrid integrated circuit and method of manufacturing same
DE3119884C1 (de) * 1981-05-19 1982-11-04 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
US4597177A (en) * 1984-01-03 1986-07-01 International Business Machines Corporation Fabricating contacts for flexible module carriers
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein

Also Published As

Publication number Publication date
DE3624718A1 (de) 1988-01-28
ATE55532T1 (de) 1990-08-15
DK359287D0 (da) 1987-07-10
DE3764215D1 (de) 1990-09-13
EP0254082A3 (en) 1988-07-13
DK165153C (da) 1993-03-01
DK165153B (da) 1992-10-12
DE3624718C2 (da) 1988-06-23
EP0254082B1 (de) 1990-08-08
EP0254082A2 (de) 1988-01-27

Similar Documents

Publication Publication Date Title
DE69115171D1 (de) Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
DE69106225D1 (de) Integrierte Schaltungseinheit mit flexiblem Substrat.
DE3778261D1 (de) Substrat mit mehrschichtiger verdrahtung.
DE68917011T2 (de) Mehrfachkontaktanordnung zur Aufnahme der Kontaktkante einer dünnen gedruckten Schaltkarte sowie flexibles Kontaktelement für diesen Zweck.
DE69206424T2 (de) Mehrschichtfolie und selbstklebendes Band.
DK359287A (da) Flerlaget kredsloebsplade med stive og boejelige omraader
DE68920080T2 (de) Polyimide und Polyimidfilme und Herstellungsverfahren.
DE69608530D1 (de) Nicht-entflammbare thermoplastische Olefinelastomerzusammmensetzung, daraus hergestellte Laminierfolie sowie Verwendungen der Zusammensetzung und des Laminats
EP1037511A3 (en) Surface treatment of copper to prevent microcracking in flexible circuits
NO872916L (no) FremgangsmŸte for Ÿ tilveiebringe av passive tynnsjiktkretser med forskjellige resistansesjikt og en passiv krets fremstilt ved fremgangsmŸten.
DE69630412D1 (de) Dünnfilmkondensator und Hybridleiterplatte sowie deren Herstellungsverfahren
DE69007597D1 (de) Laminate aus weichen polymeren Lagen und ihre Herstellung.
DK0963290T3 (da) Højtemperatur slipfilm
DE69300615D1 (de) Mehrschichtige Leiterplatte und Herstellungsverfahren.
DE68925054D1 (de) Verschweisstes Keramik-Metall-Verbundsubstrat, damit aufgebaute Schaltkarte und Verfahren zur Herstellung derselben
ATE464777T1 (de) Leiterplatte mit mindestens einem starren und mindestens einem flexiblen bereich sowie verfahren zur herstellung von starr-flexiblen leiterplatten
SE9402546L (sv) Elektroluminescerande anordning samt sätt att framställa denna
MY116494A (en) Copper foils and high-density multilayer printed circuit board using the copper foils for inner-layer circuit
DK359187D0 (da) Flerlaget kredsloebsplade med stive og boejelige omraader
ES2034970T3 (es) Un circuito de pelicula delgada.
BR9710749A (pt) Produto de mÚltiplas camadas tendo uma camada central eletricamente condutora Útil como elemento de capta-Æo indutivo
NO893673L (no) Fremgangsmaate til fremstilling av fleksible elektroniske kretser under anvendelse av et laminerende klebemiddel.
ATE260760T1 (de) Verbundschichtplatte
DE69429815D1 (de) Integrierte EEPROM-Schaltung mit reduziertem Substrat-Effekt und Zwei-Wannen-Herstellungsverfahren hiervon
DE3850096D1 (de) CMOS-Parallel-Serien-Multiplizierschaltung sowie deren Multiplizier- und Addierstufen.

Legal Events

Date Code Title Description
PBP Patent lapsed