DK3388876T3 - Integration af fiberoptisk integreret kredsløb af silicium til høj datahastighed - Google Patents

Integration af fiberoptisk integreret kredsløb af silicium til høj datahastighed Download PDF

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Publication number
DK3388876T3
DK3388876T3 DK18159675.0T DK18159675T DK3388876T3 DK 3388876 T3 DK3388876 T3 DK 3388876T3 DK 18159675 T DK18159675 T DK 18159675T DK 3388876 T3 DK3388876 T3 DK 3388876T3
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Denmark
Prior art keywords
silicium
integration
high data
data speed
fiber optically
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DK18159675.0T
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English (en)
Inventor
Hong Liu
Ryohei Urata
Woon Seong Kwon
Teckgyu Kang
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Google Llc
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Publication of DK3388876T3 publication Critical patent/DK3388876T3/da

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

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  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Optical Integrated Circuits (AREA)
DK18159675.0T 2017-04-14 2018-03-02 Integration af fiberoptisk integreret kredsløb af silicium til høj datahastighed DK3388876T3 (da)

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EP3388876A1 (en) 2018-10-17
DE202018101163U1 (de) 2018-06-18
CN108735688A (zh) 2018-11-02
GB201803082D0 (en) 2018-04-11
DE102018104775A1 (de) 2018-10-18
EP3388876B1 (en) 2021-07-21
GB2561691A (en) 2018-10-24
GB2561691B (en) 2020-02-26
CN208256644U (zh) 2018-12-18
WO2018190957A1 (en) 2018-10-18
GB2561691B8 (en) 2021-05-12
US10025047B1 (en) 2018-07-17
TWI684254B (zh) 2020-02-01
TW201901888A (zh) 2019-01-01

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