DK2493033T3 - Eksternt lagerapparat - Google Patents

Eksternt lagerapparat Download PDF

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Publication number
DK2493033T3
DK2493033T3 DK12153313.7T DK12153313T DK2493033T3 DK 2493033 T3 DK2493033 T3 DK 2493033T3 DK 12153313 T DK12153313 T DK 12153313T DK 2493033 T3 DK2493033 T3 DK 2493033T3
Authority
DK
Denmark
Prior art keywords
substrate
external storage
storage device
features
usb
Prior art date
Application number
DK12153313.7T
Other languages
English (en)
Inventor
Martin Kuster
Original Assignee
Martin Kuster
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=45529016&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK2493033(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Martin Kuster filed Critical Martin Kuster
Application granted granted Critical
Publication of DK2493033T3 publication Critical patent/DK2493033T3/da

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R27/00—Coupling parts adapted for co-operation with two or more dissimilar counterparts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/382—Information transfer, e.g. on bus using universal interface adapter
    • G06F13/385—Information transfer, e.g. on bus using universal interface adapter for adaptation of a particular data processing system to different peripheral devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/409—Mechanical coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45

Claims (10)

1. Eksternt lagerapparat omfattende: (a) et substrat (12), (b) en styreindretning (16), som er koblet elektrisk sammen med substratet, (c) i det mindste en hukommelseschip-stabel (18), som er koblet elektrisk sammen med substratet, (d) en forbindelsesindretning (14), som er koblet elektrisk sammen med substratet, (e) hvorved det eksterne lagerapparat er konfigureret til at understøtte i det mindste to USB-standarder med grænseflader, som er mekanisk forskellige, (f) hvorved forbindelsesindretningen (14) omfatter fjedre (52) og forbindelsesfingre (20), som er koblet elektrisk sammen med substratet (12), kendetegnet ved, at (g) forbindelsesindretningen (14) omfatter et dæklag (32), som har et antal åbninger (44), der er placeret i umiddelbar nærhed af og/eller bag forbindelsesfingrene (20), (h) hver fjeder (52) har et koblingsfremspring (60), som strækker sig igennem hver åbning (44), når fjedrene (52) befinder sig i en usammenpresset position, og at forbindelsesfingrene (20) er indlejret i dæklaget (32).
2. Eksternt lagerapparat ifølge krav 1, og som yderligere omfatter et antal koblingspunkter (28), som er monteret på substratets forbindelsesoverflade, og som er indrettet til at blive koblet til en kontaktskinne (22).
3. Eksternt lagerapparat-stik ifølge krav 2, hvorved kontaktskinnen (22) er monteret på en komponentoverflade (24) på substratet (12).
4. Eksternt lagerapparat ifølge krav 3, hvorved kontaktskinnen (22) er i alt væsentligt indesluttet ved hjælp af et ydre hus (26), som omgiver substratet (12).
5. Eksternt lagerapparat ifølge krav 3, hvorved kontaktskinnen (22) yderligere omfatter et dæklag (32).
6. Eksternt lagerapparat ifølge ethvert af kravene 1 til 5, hvorved den i det mindste ene hukommelseschip-stabel (18) er monteret på en komponentoverflade (24) eller en forbindelsesoverflade (26) på substratet (12).
7. Eksternt lagerapparat ifølge krav 6, og som yderligere omfatter et antal hukommelseschip-stabler (18), hvorved i det mindste en ud af antallet af hukommelseschip-stabler er monteret på en forbindelsesoverflade (26) på substratet (12) og i det mindste en ud af antallet af hukommelseschip-stabler er monteret på en komponentoverflade (24) på substratet.
8. Eksternt lagerapparat ifølge krav 7, hvorved hver hukommelseschip-stabel (18) omfatter et antal chips (64).
9. Eksternt lagerapparat ifølge krav 8, hvorved antallet af chips (64) i i det mindste to af hukommelseschip-stablerne (18) er i et overlappende arrangement.
10. Eksternt lagerapparat ifølge ethvert af kravene 1 til 9, hvorved det eksterne lagerapparat (10) har i alt væsentligt flade overflader på alle sider.
DK12153313.7T 2011-01-31 2012-01-31 Eksternt lagerapparat DK2493033T3 (da)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161438123P 2011-01-31 2011-01-31
US201161438140P 2011-01-31 2011-01-31
US201161438139P 2011-01-31 2011-01-31
US201161442379P 2011-02-14 2011-02-14

Publications (1)

Publication Number Publication Date
DK2493033T3 true DK2493033T3 (da) 2018-09-03

Family

ID=45529016

Family Applications (2)

Application Number Title Priority Date Filing Date
DK18168629.6T DK3367517T6 (da) 2011-01-31 2012-01-31 Eksternt lagermedie
DK12153313.7T DK2493033T3 (da) 2011-01-31 2012-01-31 Eksternt lagerapparat

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DK18168629.6T DK3367517T6 (da) 2011-01-31 2012-01-31 Eksternt lagermedie

Country Status (4)

Country Link
EP (4) EP2482391A3 (da)
DK (2) DK3367517T6 (da)
ES (2) ES2683697T3 (da)
PT (2) PT3367517T (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111179979A (zh) * 2019-12-20 2020-05-19 宜鼎国际股份有限公司 迭板构造
CN111405753A (zh) * 2020-03-30 2020-07-10 武汉光谷信息光电子创新中心有限公司 一种印刷电路板金手指的保护套

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080318449A1 (en) * 1999-08-04 2008-12-25 Super Talent Electronics, Inc. MULTI-LEVEL CELL (MLC) DUAL PERSONALITY EXTENDED eSATA FLASH MEMORY DEVICE
US20050156333A1 (en) * 2003-09-11 2005-07-21 Super Talent Electronics Inc. Narrow Universal-Serial-Bus (USB) Flash-Memory Card with Straight Sides using a Ball-Grid-Array (BGA) Chip
US7440286B2 (en) * 2005-04-21 2008-10-21 Super Talent Electronics, Inc. Extended USB dual-personality card reader
US7872873B2 (en) * 2003-12-02 2011-01-18 Super Talent Electronics, Inc. Extended COB-USB with dual-personality contacts
US7623354B2 (en) * 2005-09-29 2009-11-24 Kingston Technology Corporation Folding USB drive
US20070112981A1 (en) * 2005-11-15 2007-05-17 Motorola, Inc. Secure USB storage device
TW200935319A (en) * 2008-04-11 2009-08-16 Chant Sincere Co Ltd A card reader
US8239581B2 (en) * 2008-05-15 2012-08-07 Seagate Technology Llc Data storage device compatible with multiple interconnect standards
US20100203751A1 (en) * 2009-02-10 2010-08-12 Chou Hsien Tsai Socket structure
TWM387417U (en) * 2010-03-18 2010-08-21 Power Quotient Int Co Ltd USB connector
DE202010009523U1 (de) * 2010-06-25 2010-11-11 Shenzhen Oversea Win Technology Co., Ltd. Verbundstecker

Also Published As

Publication number Publication date
EP2511829A3 (en) 2014-09-24
EP2511829A2 (en) 2012-10-17
ES2763279T7 (es) 2023-11-29
DK3367517T3 (da) 2020-01-02
EP3367517B3 (en) 2023-06-21
DK3367517T6 (da) 2023-09-11
EP2493033A2 (en) 2012-08-29
PT2493033T (pt) 2018-07-26
EP2482391A2 (en) 2012-08-01
EP3367517B1 (en) 2019-09-18
EP2482391A3 (en) 2013-12-04
EP2493033A3 (en) 2015-01-21
PT3367517T (pt) 2019-12-04
EP3367517A1 (en) 2018-08-29
EP2493033B1 (en) 2018-05-30
ES2763279T3 (es) 2020-05-27
ES2683697T3 (es) 2018-09-27

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