DK222978A - Lapadskillelsesmiddel - Google Patents

Lapadskillelsesmiddel

Info

Publication number
DK222978A
DK222978A DK222978A DK222978A DK222978A DK 222978 A DK222978 A DK 222978A DK 222978 A DK222978 A DK 222978A DK 222978 A DK222978 A DK 222978A DK 222978 A DK222978 A DK 222978A
Authority
DK
Denmark
Prior art keywords
lapad
separator
lapad separator
Prior art date
Application number
DK222978A
Other languages
Danish (da)
English (en)
Inventor
D Regler
A Moritz
Original Assignee
Wacker Chemitronic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemitronic filed Critical Wacker Chemitronic
Publication of DK222978A publication Critical patent/DK222978A/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Lubricants (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DK222978A 1977-05-20 1978-05-19 Lapadskillelsesmiddel DK222978A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772722780 DE2722780A1 (de) 1977-05-20 1977-05-20 Laepptrennmittel

Publications (1)

Publication Number Publication Date
DK222978A true DK222978A (da) 1978-11-21

Family

ID=6009443

Family Applications (1)

Application Number Title Priority Date Filing Date
DK222978A DK222978A (da) 1977-05-20 1978-05-19 Lapadskillelsesmiddel

Country Status (9)

Country Link
US (1) US4246003A (cg-RX-API-DMAC7.html)
JP (1) JPS53145177A (cg-RX-API-DMAC7.html)
BE (1) BE867201A (cg-RX-API-DMAC7.html)
DE (1) DE2722780A1 (cg-RX-API-DMAC7.html)
DK (1) DK222978A (cg-RX-API-DMAC7.html)
FR (1) FR2391034A1 (cg-RX-API-DMAC7.html)
GB (1) GB1597928A (cg-RX-API-DMAC7.html)
IT (1) IT1103283B (cg-RX-API-DMAC7.html)
NL (1) NL7804613A (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632291Y2 (cg-RX-API-DMAC7.html) * 1979-03-20 1988-01-20
JPH0741530B2 (ja) * 1985-11-27 1995-05-10 株式会社日立製作所 磁気デイスクの製造方法
US4773920B1 (en) * 1985-12-16 1995-05-02 Minnesota Mining & Mfg Coated abrasive suitable for use as a lapping material.
US4770672A (en) * 1986-10-24 1988-09-13 Menard Alfred J Lapping compound and method for using same
US4867757A (en) * 1988-09-09 1989-09-19 Nalco Chemical Company Lapping slurry compositions with improved lap rate
JPH1052816A (ja) * 1996-08-13 1998-02-24 M Ii M C Kk ワイヤ式切断方法
EP0824055A1 (en) * 1996-08-13 1998-02-18 MEMC Electronic Materials, Inc. Method and apparatus for cutting an ingot
DE19741617A1 (de) * 1997-09-20 1999-04-01 Overbeck Kampmann Claudia Verfahren und Vorrichtung zum Schneiden oder Trennen von Werkstücken
DE10011513A1 (de) * 2000-03-09 2001-09-20 Fraunhofer Ges Forschung Verfahren zum Aufbereiten einer gebrauchten Schneidsuspension
WO2008047446A1 (en) * 2006-10-20 2008-04-24 Mitsubishi Electric Corporation Slurry for silicon ingot cutting and method of cutting silicon ingot therewith

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2006162A (en) * 1934-07-25 1935-06-25 Permatex Company Inc Grinding composition
US2270888A (en) * 1940-08-03 1942-01-27 Minnesota Mining & Mfg Nondrying water-washable lapping and grinding composition
US2375825A (en) * 1941-10-16 1945-05-15 Interchem Corp Polishing compositions
US2944879A (en) * 1957-04-25 1960-07-12 Kenmore Res Company Lapping compound
BE605230A (cg-RX-API-DMAC7.html) * 1960-06-27
FR1284054A (fr) * 1960-12-29 1962-02-09 Perfectionnements aux produits liquides pour polissage, lustrage, avivage et analogues
NL280948A (cg-RX-API-DMAC7.html) * 1961-07-13
US3272195A (en) * 1964-03-23 1966-09-13 Hughes Aircraft Co Device for slicing crystalline material
FR1578199A (cg-RX-API-DMAC7.html) * 1967-07-03 1969-08-14
JPS49772A (cg-RX-API-DMAC7.html) * 1972-04-21 1974-01-07
JPS549287B2 (cg-RX-API-DMAC7.html) * 1972-05-10 1979-04-23
DD99599A1 (de) * 1972-10-23 1973-08-12 Komposition zum Polieren der Oberflächen von festen Körpern
JPS536756B2 (cg-RX-API-DMAC7.html) * 1974-05-13 1978-03-10
US4038048A (en) * 1975-02-14 1977-07-26 Thrower Jr Herbert T Lapping composition containing a carboxy vinyl polymer

Also Published As

Publication number Publication date
FR2391034A1 (fr) 1978-12-15
IT1103283B (it) 1985-10-14
IT7849433A0 (it) 1978-05-18
DE2722780C2 (cg-RX-API-DMAC7.html) 1988-07-07
GB1597928A (en) 1981-09-16
JPS53145177A (en) 1978-12-18
DE2722780A1 (de) 1978-11-23
NL7804613A (nl) 1978-11-22
US4246003A (en) 1981-01-20
FR2391034B1 (cg-RX-API-DMAC7.html) 1980-07-04
BE867201A (fr) 1978-11-20

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Legal Events

Date Code Title Description
ATS Application withdrawn