DK1921908T3 - Kredsløbsarrangement med et effektmodul, som er kombineret med et kredsløbskort - Google Patents

Kredsløbsarrangement med et effektmodul, som er kombineret med et kredsløbskort

Info

Publication number
DK1921908T3
DK1921908T3 DK07021363T DK07021363T DK1921908T3 DK 1921908 T3 DK1921908 T3 DK 1921908T3 DK 07021363 T DK07021363 T DK 07021363T DK 07021363 T DK07021363 T DK 07021363T DK 1921908 T3 DK1921908 T3 DK 1921908T3
Authority
DK
Denmark
Prior art keywords
combined
power module
circuit board
circuit
circuit arrangement
Prior art date
Application number
DK07021363T
Other languages
English (en)
Inventor
Marco Lederer
Rainer Popp
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK1921908T3 publication Critical patent/DK1921908T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10575—Insulating foil under component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
DK07021363T 2006-11-08 2007-11-02 Kredsløbsarrangement med et effektmodul, som er kombineret med et kredsløbskort DK1921908T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200610052619 DE102006052619B4 (de) 2006-11-08 2006-11-08 Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist

Publications (1)

Publication Number Publication Date
DK1921908T3 true DK1921908T3 (da) 2012-10-22

Family

ID=39056377

Family Applications (1)

Application Number Title Priority Date Filing Date
DK07021363T DK1921908T3 (da) 2006-11-08 2007-11-02 Kredsløbsarrangement med et effektmodul, som er kombineret med et kredsløbskort

Country Status (4)

Country Link
EP (1) EP1921908B1 (da)
JP (1) JP5183148B2 (da)
DE (1) DE102006052619B4 (da)
DK (1) DK1921908T3 (da)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6355994B2 (ja) * 2014-07-09 2018-07-11 株式会社ユーシン 制御装置の防水構造
DE102014227024A1 (de) 2014-12-30 2016-06-30 Robert Bosch Gmbh Leistungsbauteil
DE102014227027A1 (de) 2014-12-30 2016-06-30 Robert Bosch Gmbh Leistungshalbleiteransteuerung
EP3181284B1 (de) * 2015-12-17 2018-09-12 Robert Bosch Gmbh Stromrichterschaltung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19630173C2 (de) * 1996-07-26 2001-02-08 Semikron Elektronik Gmbh Leistungsmodul mit Halbleiterbauelementen
JP3476142B2 (ja) * 2001-05-24 2003-12-10 日本電気株式会社 結露防止構造を備えた電子デバイス
US6417747B1 (en) * 2001-08-23 2002-07-09 Raytheon Company Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards
JP4186826B2 (ja) * 2004-01-28 2008-11-26 株式会社デンソー プリント基板の取り付け構造
JP4764979B2 (ja) * 2004-06-08 2011-09-07 富士電機株式会社 半導体装置
DE102005024900B4 (de) * 2004-06-08 2012-08-16 Fuji Electric Co., Ltd. Leistungsmodul

Also Published As

Publication number Publication date
DE102006052619B4 (de) 2009-07-30
EP1921908A3 (de) 2009-12-02
DE102006052619A1 (de) 2008-05-15
EP1921908B1 (de) 2012-08-01
JP5183148B2 (ja) 2013-04-17
JP2008124456A (ja) 2008-05-29
EP1921908A2 (de) 2008-05-14

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