DK1788625T3 - Modul med kondensatorer til elektrisk kontakt ved tryk - Google Patents
Modul med kondensatorer til elektrisk kontakt ved trykInfo
- Publication number
- DK1788625T3 DK1788625T3 DK06023026.5T DK06023026T DK1788625T3 DK 1788625 T3 DK1788625 T3 DK 1788625T3 DK 06023026 T DK06023026 T DK 06023026T DK 1788625 T3 DK1788625 T3 DK 1788625T3
- Authority
- DK
- Denmark
- Prior art keywords
- pressure
- capacitors
- module
- electrical contact
- pressure body
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
- H01R25/161—Details
- H01R25/162—Electrical connections between or with rails or bus-bars
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
- Measuring Fluid Pressure (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Power Conversion In General (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005055608A DE102005055608B3 (de) | 2005-11-22 | 2005-11-22 | Leistungshalbleitermodul mit zueinander parallel geschalteten Kondensatoren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK1788625T3 true DK1788625T3 (da) | 2010-09-20 |
Family
ID=37763871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK06023026.5T DK1788625T3 (da) | 2005-11-22 | 2006-11-06 | Modul med kondensatorer til elektrisk kontakt ved tryk |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7613008B2 (da) |
| EP (1) | EP1788625B1 (da) |
| JP (1) | JP4914697B2 (da) |
| AT (1) | ATE470238T1 (da) |
| DE (2) | DE102005055608B3 (da) |
| DK (1) | DK1788625T3 (da) |
| ES (1) | ES2345349T3 (da) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009046403B4 (de) * | 2009-11-04 | 2015-05-28 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul in Druckkontakttechnik |
| DE102012202539A1 (de) * | 2012-02-20 | 2013-08-22 | Siemens Aktiengesellschaft | Montagebaugruppe für elektrische oder elektronische Bauelemente |
| DE102013209431B4 (de) | 2013-05-22 | 2018-04-05 | Siemens Aktiengesellschaft | Leistungshalbleitermodul |
| DE102013209444A1 (de) | 2013-05-22 | 2014-11-27 | Siemens Aktiengesellschaft | Leistungshalbleitermodul, Verfahren zum Betrieb eines Leistungshalbleitermoduls und Verfahren zur Herstellung eines Leistungshalbleitermoduls |
| DE102014208594A1 (de) * | 2014-05-08 | 2015-11-12 | Zf Friedrichshafen Ag | Leistungselektronikanordnung |
| DE102016100617B4 (de) * | 2016-01-15 | 2019-05-16 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Gehäuse und einem Kondensator |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4111401A1 (de) * | 1991-04-09 | 1992-10-15 | Abb Patent Gmbh | Kondensationsanordnung |
| DE9403108U1 (de) * | 1994-02-24 | 1994-04-14 | Siemens AG, 80333 München | Niederinduktive Hochstromverschienung für Stromrichtermodule |
| JP3228021B2 (ja) * | 1994-09-13 | 2001-11-12 | 富士電機株式会社 | インバータユニット及びインバータ装置 |
| DE19519538A1 (de) * | 1995-05-27 | 1996-11-28 | Export Contor Ausenhandelsgese | Induktivitätsarme Schaltungsanordnung |
| JPH098224A (ja) * | 1995-06-23 | 1997-01-10 | Hitachi Ltd | 半導体モジュールと電力変換装置 |
| EP0782216B1 (en) * | 1995-12-14 | 2002-04-17 | Sumitomo Wiring Systems, Ltd. | An electrical connection box, a connection construction, a bus bar fixing construction and a connection terminal |
| FR2777109B1 (fr) * | 1998-04-06 | 2000-08-04 | Gec Alsthom Transport Sa | Batterie de condensateurs, dispositif electronique de puissance comportant une telle batterie et ensemble electronique de puissance comportant un tel dispositif |
| DE19847029A1 (de) * | 1998-10-13 | 2000-04-27 | Semikron Elektronik Gmbh | Umrichter mit niederinduktivem Kondensator im Zwischenkreis |
| JP4044265B2 (ja) * | 2000-05-16 | 2008-02-06 | 三菱電機株式会社 | パワーモジュール |
| DE10057140A1 (de) * | 2000-11-17 | 2002-06-06 | Siemens Ag | Hochstromverbindung |
| JP4770083B2 (ja) * | 2001-08-03 | 2011-09-07 | 日産自動車株式会社 | 電力変換装置 |
| DE10306643B4 (de) * | 2003-02-18 | 2005-08-25 | Semikron Elektronik Gmbh | Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul |
| JP2007281127A (ja) * | 2006-04-05 | 2007-10-25 | Shindengen Electric Mfg Co Ltd | コンデンサを備える回路装置及びコンデンサモジュール |
-
2005
- 2005-11-22 DE DE102005055608A patent/DE102005055608B3/de not_active Expired - Fee Related
-
2006
- 2006-11-06 EP EP06023026A patent/EP1788625B1/de not_active Not-in-force
- 2006-11-06 AT AT06023026T patent/ATE470238T1/de active
- 2006-11-06 ES ES06023026T patent/ES2345349T3/es active Active
- 2006-11-06 DK DK06023026.5T patent/DK1788625T3/da active
- 2006-11-06 DE DE502006007077T patent/DE502006007077D1/de active Active
- 2006-11-21 JP JP2006314274A patent/JP4914697B2/ja not_active Expired - Fee Related
- 2006-11-22 US US11/603,606 patent/US7613008B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| ATE470238T1 (de) | 2010-06-15 |
| EP1788625B1 (de) | 2010-06-02 |
| US20070117421A1 (en) | 2007-05-24 |
| ES2345349T3 (es) | 2010-09-21 |
| EP1788625A1 (de) | 2007-05-23 |
| JP2007142438A (ja) | 2007-06-07 |
| DE102005055608B3 (de) | 2007-05-10 |
| JP4914697B2 (ja) | 2012-04-11 |
| US7613008B2 (en) | 2009-11-03 |
| DE502006007077D1 (de) | 2010-07-15 |
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