DK165153C - MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS - Google Patents

MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS

Info

Publication number
DK165153C
DK165153C DK359287A DK359287A DK165153C DK 165153 C DK165153 C DK 165153C DK 359287 A DK359287 A DK 359287A DK 359287 A DK359287 A DK 359287A DK 165153 C DK165153 C DK 165153C
Authority
DK
Denmark
Prior art keywords
flexible
rigid
circuit board
layers
locally
Prior art date
Application number
DK359287A
Other languages
Danish (da)
Other versions
DK359287D0 (en
DK165153B (en
DK359287A (en
Inventor
Friedrich-Wilhelm Schlitter
Original Assignee
Schoeller & Co Elektronik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller & Co Elektronik filed Critical Schoeller & Co Elektronik
Publication of DK359287D0 publication Critical patent/DK359287D0/en
Publication of DK359287A publication Critical patent/DK359287A/en
Publication of DK165153B publication Critical patent/DK165153B/en
Application granted granted Critical
Publication of DK165153C publication Critical patent/DK165153C/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Cable Accessories (AREA)
  • Laminated Bodies (AREA)

Abstract

1. A multilayer, locally rigid and locally flexible circuit board with through-connection holes consisting of several individual layers press-moulded with one another, characterized in that it is made up alternately of first single or double layers (2) and second single or double layers (3) of the same non-flexible (rigid) material into which flexible adhesive-coated plastic films (4) free from edge gaps, of equal thickness and with a somewhat larger area than corresponds to the flexible region are inserted in the regions in which the circuit board is intended to be flexible and in that the through-connection holes (7) are only introduced in those regions of the circuit board (1) which, over the cross-section, predominantly consist solely of the material of the rigid single layers (2, 3) and copper.
DK359287A 1986-07-22 1987-07-10 MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS DK165153C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3624718 1986-07-22
DE19863624718 DE3624718A1 (en) 1986-07-22 1986-07-22 MULTI-LAYER, RIGID AND FLEXIBLE AREAS HAVING PCB

Publications (4)

Publication Number Publication Date
DK359287D0 DK359287D0 (en) 1987-07-10
DK359287A DK359287A (en) 1988-01-23
DK165153B DK165153B (en) 1992-10-12
DK165153C true DK165153C (en) 1993-03-01

Family

ID=6305683

Family Applications (1)

Application Number Title Priority Date Filing Date
DK359287A DK165153C (en) 1986-07-22 1987-07-10 MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS

Country Status (4)

Country Link
EP (1) EP0254082B1 (en)
AT (1) ATE55532T1 (en)
DE (2) DE3624718A1 (en)
DK (1) DK165153C (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03196691A (en) * 1989-12-26 1991-08-28 Cmk Corp Formation of insulating layer of printed wiring board
US5004639A (en) * 1990-01-23 1991-04-02 Sheldahl, Inc. Rigid flex printed circuit configuration
DE4003344C1 (en) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4003345C1 (en) * 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4115703C1 (en) * 1991-05-14 1992-08-27 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
GB9125173D0 (en) * 1991-11-27 1992-01-29 Northumbria Circuits Limited Printed circuit combination and process
DE4208610C1 (en) * 1992-03-18 1993-05-19 Fa. Carl Freudenberg, 6940 Weinheim, De Rigid-flexible PCB with flexible circuit foil mfg. - having flexible PCB in flexible region with fracture lines in rigid outer layers along rigid-flexible transition allowing rigid part to be removed along fracture lines after processing
US6298013B1 (en) 1993-11-15 2001-10-02 Siemens Aktiengesellschaft Device for monitoring the travel time of mail shipments
JPH09510319A (en) * 1994-03-08 1997-10-14 テレダイン インダストリーズ，インク． Method for manufacturing multi-layered rigid and flexible printed circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3346415A (en) * 1963-12-16 1967-10-10 Carl L Hachenberger Flexible printed circuit wiring
DE2657212C3 (en) * 1976-12-17 1982-09-02 Schoeller & Co Elektronik Gmbh, 3552 Wetter Process for the production of rigid and flexible areas having printed circuit boards
JPS5683096A (en) * 1979-12-10 1981-07-07 Sony Corp Hybrid integrated circuit and method of manufacturing same
DE3119884C1 (en) * 1981-05-19 1982-11-04 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Process for the production of rigid and flexible printed circuit boards
US4597177A (en) * 1984-01-03 1986-07-01 International Business Machines Corporation Fabricating contacts for flexible module carriers
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein

Also Published As

Publication number Publication date
EP0254082A2 (en) 1988-01-27
DK359287D0 (en) 1987-07-10
DK165153B (en) 1992-10-12
DE3764215D1 (en) 1990-09-13
ATE55532T1 (en) 1990-08-15
DE3624718A1 (en) 1988-01-28
EP0254082A3 (en) 1988-07-13
EP0254082B1 (en) 1990-08-08
DK359287A (en) 1988-01-23
DE3624718C2 (en) 1988-06-23

Similar Documents

Publication Publication Date Title
DE69106225D1 (en) Integrated circuit unit with flexible substrate.
DE68923054D1 (en) Thin film transistor panel and manufacturing process.
DE3778261D1 (en) SUBSTRATE WITH MULTILAYER WIRING.
DE69115171D1 (en) Flexible polyimide multilayer laminates and their production.
DE69206424D1 (en) Multi-layer film and self-adhesive tape.
DK165153C (en) MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS
DE69300907D1 (en) Ceramic multilayer substrate with gradient contact holes.
NO902785D0 (en) PRESSURE WITH BOARD CIRCUIT.
ATE220569T1 (en) ASSEMBLY PLAY APPARATUS, PARTICULARLY FOR PRODUCING ROLLER RACKS
DE69020421D1 (en) Multiplex electroluminescent edge radiator structure with thin film and electronic operating system for it.
AU2002364391A8 (en) Perforierte stretchfolie
MY126965A (en) Liquid-pervious topsheet for disposable absorbent article and process for making the same
SE9402546D0 (en) Electroluminescent device and method of making it
DK165040C (en) MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS
MY116494A (en) Copper foils and high-density multilayer printed circuit board using the copper foils for inner-layer circuit
ES2156002T3 (en) MULTIPLE LAYER PRODUCTS WITH ELECTRICALLY CONDUCTING CENTRAL LAYER USEFUL AS THE INDUCTOR CAPTOR ELEMENT.
ES2034970T3 (en) A THIN FILM CIRCUIT.
NO893673D0 (en) PROCEDURE FOR THE MANUFACTURE OF FLEXIBLE ELECTRONIC CIRCUITS USING A Laminating Adhesive.
AU7726591A (en) The bonding of polyimide films, and printed circuit boards
ES528343A0 (en) IMPROVEMENTS INTRODUCED IN THE PRODUCTION OF HIGHLY ELECTRO-CONDUCTIVE ELASTOMERIC FILMS AND OF VERY REDUCED THICKNESS
ATE260760T1 (en) COMPOSITE LAYER BOARD
BR8402681A (en) GRAFT POLYMER, SOLUTION UNDERSTANDING THE SAID POLYMER, AND FIBROUS SUBSTRATE
DE3850096D1 (en) CMOS parallel series multiplier circuit and its multiplier and adder stages.
ATE127394T1 (en) ALARM GLASS PANEL MADE OF LAMINATED GLASS.
ATE302541T1 (en) FILM CIRCUIT BOARD AND ITS MANUFACTURING AND ASSEMBLY PROCESS

Legal Events

Date Code Title Description
PBP Patent lapsed