DK165153B - MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS - Google Patents
MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS Download PDFInfo
- Publication number
- DK165153B DK165153B DK359287A DK359287A DK165153B DK 165153 B DK165153 B DK 165153B DK 359287 A DK359287 A DK 359287A DK 359287 A DK359287 A DK 359287A DK 165153 B DK165153 B DK 165153B
- Authority
- DK
- Denmark
- Prior art keywords
- flexible
- rigid
- circuit board
- layers
- areas
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Cable Accessories (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
iin
DK 165153 BDK 165153 B
Opfindelsen angår en flerlaget kredsløbsplade med stive og bøjelige områder og med gennemgående kontakt huller, bestående af flere sammenpressede enkeltlag.The invention relates to a multilayer circuit board with rigid and flexible areas and with through contact holes consisting of several compressed single layers.
For nogle år siden er der i elektronikindustrien 5 indført trykte kredsløb, der har stive og bøjelige områder. Disse kredsløbsplader opbygges af oven på hinanden liggende stive og bøjelige enkeltlag, der ved hjælp af forbindelsesfolie klæbes fast sammen og presses. Der er her tale om ubøjelige, f.eks. glas-10 epoxyharpiks, og bøjelige isolationsbærere, f.eks. poly imidfolie, med enkelt- eller dobbeltsidig kobberbelæg ning, hvori kredsløbsbanerne ætses. De stive lags form fastlægger den stive del af kredsløbspladen, fra hvilken de bøjelige lag fører ud og danner de bøjelige kredsløb-15 sområder, der yderligere forbinder kredsløbets dele med hinanden og danner forbindelsen til ydre opbygninger.A few years ago, in the electronics industry 5 printed circuits were introduced which have rigid and flexible areas. These circuit boards are made up of superposed rigid and flexible single layers, which are bonded together and pressed together by means of connecting foil. These are inexcusable, e.g. glass-epoxy resin, and flexible insulation carriers, e.g. polyimide foil, with single or double-sided copper coating, in which the orbits are etched. The rigid layer shape defines the rigid portion of the circuit board from which the flexible layers extend and form the flexible circuit 15 regions which further connect the circuit parts to each other and form the connection to outer structures.
De bøjelige dele fremstilles ved, at man i disse områder bortbryder de stive yderlag. En sådan fremgangsmåde er f.eks. beskrevet i DE-PS 26 52 212. De bø-20 jelige enkeltlag dækker ved de kendte kredsløbsplader med stive og bøjelige områder af fremstillingsgrunde hele kredsløbspladen, selvom de egentlig kun er nødvendige i den bøjelige del.The flexible parts are made by breaking away the rigid outer layers in these areas. Such a method is e.g. described in DE-PS 26 52 212. The flexible single layers of the known circuit boards with rigid and flexible areas for manufacturing reasons cover the entire circuit board, although they are really only needed in the flexible part.
Før presningen af enkeltlagene til en flerlags-25 kobling fremstilles ledningsbanerne ved ætseteknik på de inderste lag. Kresløbspladerne bliver derpå gennemboret bestemte steder, og hullerne forkobres kemisk og galvanisk. Derved får man en elektrisk forbindelse mellem ledningsbanerne i de forskellige planer. Desuden tjener 30 disse gennemgående kontakthuller til optagelse af tilslutningsbenene på de komponenter, som kredsløbspladen bestykkes med.Prior to pressing the single layers into a multilayer coupling, the conductive paths are prepared by etching technique on the innermost layers. The circular plates are then pierced at specific locations and the holes are chemically and galvanically sealed. This creates an electrical connection between the wiring paths in the different plans. In addition, 30 of these through-contact holes serve to receive the connecting pins on the components with which the circuit board is fitted.
Da ved kendte kredsløbsplader også de stive områder er opbygget af oven på hinanden liggende stive og 35 bøjelige enkeltlag, består hulvæggene lagsvis af forskellige materialer. Frem for alt gennembores også klæbe-Since at known circuit boards, the rigid areas are also made up of superposed rigid and flexible single layers, the hollow walls are layered of different materials. Above all, the adhesive is also pierced
DK 165153 BDK 165153 B
2 middellag, hvorved klæbemiddlet smørres ud over hulvæggen. Rengøringen af væggen før forkobringen er meget kostbar og angriber de forskellige kunststoflag med forskellig styrke således, at der opstår fordybninger 5 i hulvæggen. Også den kemiske forkobring er kostbar, da forskellige stoffer skal aktiveres og metaliseres. Desuden er de termiske udvidelseskofficienter for den bøjelige kunststoffolie og den stive kunststofplade forskellige således, at der ved lodning af kredsløbet 10 kan optræde spændinger og revner, der kan føres til de-laminering.2 medium layers, whereby the adhesive is lubricated beyond the hollow wall. The cleaning of the wall before the dressing is very expensive and attacks the different layers of plastic with different strength so that recesses 5 in the hollow wall are formed. Chemical dressing is also expensive, as different substances must be activated and metalized. In addition, the thermal expansion coefficients for the flexible plastic film and the rigid plastic sheet are different so that when soldering the circuit 10, stresses and cracks that can lead to de-lamination can occur.
Til afhjælpning .af disse vankeligheder er det f.eks. kendt at brænde de bøjelige enkeltlags polyimid og klæbemiddel i hulvæggens område med en laserstråle og 15 udfylde dette område med epoxyharpiks for at opnå et sammenhængende materiale i hulvæggen. Men også denne fremgangsmåde er meget omstændelig og dyr.To remedy these difficulties, it is e.g. known to burn the flexible single-layer polyimide and adhesive in the cavity wall area with a laser beam and fill this epoxy resin region to obtain a coherent material in the cavity wall. But also this approach is very cumbersome and expensive.
Det er derfor opfindelsens formål at tilvejebringe en flerlaget kredsløbsplade, der har stive og bøjeli-20 ge områder og gennemgående kontakthuller, bestående af flere sammenpressede enkeltlag, ved hvilken en omstændelig efterfølgende rensning af hulvæggene bortfalder, og borehullerne alligevel enkelt kan metaliseres og føre til pålidelige kontakter mellem ledningsbanerne.It is therefore an object of the invention to provide a multilayer circuit board having rigid and bendable areas and through contact holes consisting of several compressed single layers, in which a substantial subsequent cleaning of the cavity walls lapses, and yet the boreholes can be easily metallized and lead to reliable contacts between the wiring circuits.
25 Denne opgave løses ifølge opfindelsen ved, at kredsløbspladen er opbygget af stive enkelt- og dobbeltlag og enkelt- eller dobbeltlag af samme ikke bøjelige materiale, i hvilket der i de områder, hvori den senere kredsløbsplade skal være bøjelige er indført bøjelige 30 klæbemiddelovertrukne kunststoffolier uden spalter langs kanterne med samme tykkelse og med noget større omfang, end hvad der svarer til den bøjelige område, og at de gennemgående kontakthuller kun er tilvejebragt i det om råde af lederpladen, der set i tværsnit i hovedsagen kun 35 består af de stive enkeltlags materiale og kobber.This problem is solved according to the invention in that the circuit board is made up of rigid single and double layers and single or double layers of the same non-flexible material, into which flexible adhesive-coated plastic films are introduced in the areas where the later circuit board must be flexible. slits along the edges with the same thickness and to a somewhat greater extent than corresponds to the flexible region, and that the through contact holes are provided only in the area of the conductor plate, seen in cross-section generally only 35 of the rigid single-layer material and copper.
De gennemgående kontakthuller er fortrinsvis anbragt i det område af kredsløbspladen, der udelukkende består af de stive enkeltlags materiale.The through contact holes are preferably located in the region of the circuit board consisting solely of the rigid single-layer material.
DK 165153 BDK 165153 B
33
De indpassede bøjelige kunststoffolierområder må være nogle få millimeter, fortrinsvis 2 til 10 mm, større end det senere bøjelige område, således at der sikres en upåklagelig klæbning af den bøjelige kunststoffolie i 5 det stive område.The fitted flexible plastic film areas must be a few millimeters, preferably 2 to 10 mm, larger than the later flexible area, so that an impeccable adhesion of the flexible plastic film in the rigid area is ensured.
Fremstillingen af disse enkeltlag sker på den måde, at man i såkaldte pre-preg, det vil sige glasmåtter med ikke udhærdet epoxyharpiks, med et værktøj stanser eller skærer en udsparing, der er noget større end 10 kredsløbspladens ønskede bøjelige område. Med samme værktøj udskæres et komplementært stykke af en klæbemid-delovertrukket bøjelig kunststoffolie og indsættes uden spalter langs kanten i pre-preget. Pre-preg og kunststoffolie må her vælges således, at pre-pregets tykkelse 15 i presset tilstand er lig med tykkelsen af den klæbemid-delovertrukne kunststoffolie. På oven- og undersiden af dette forlaminat lægger man derpå en kobberfolie og presser ved tryk og temperatur denne forbindelse til et laminat. Ledningsmønsteret indbrændes derpå ætningste-20 knisk i kobberfolien.The manufacture of these single layers is done in such a way that in so-called pre-marks, ie glass mats with non-cured epoxy resin, a tool is cut or cut into a recess somewhat larger than the desired flexible area of the circuit board. With the same tool, a complementary piece of an adhesive-coated flexible plastic film is cut and inserted without gaps along the edge in the pre-embossed. Pre-embossing and plastic foil must here be selected such that the thickness of the pre-embossing 15 in the pressed state is equal to the thickness of the adhesive-coated plastic foil. On the top and bottom of this laminate, a copper foil is then placed and pressurized at pressure and temperature to a laminate. The conduit pattern is then burnt etch-20 in the copper foil.
Fortrinsvis består det stive materiale af glasfiberforstærket epoxyharpiks.Preferably, the rigid material consists of fiberglass reinforced epoxy resin.
Sammenklæbes enkeltlagene til den flerlagede stive-bøjelige kredsløbsplade - dette sker med pre-preg, 25 glasmåtter med ikke udhærdet epoxyharpiks - har man i kredsløbspladen stive område, hvori boringer til gennemgående kontakt derefter skal tilvejebringes, en forbindelse, der kun består af glasfibre, epoxyharpiks og Cu-folie.If the single layers are glued to the multi-layer rigid flexible circuit board - this is done with pre-stamping, 25 glass mats with non-cured epoxy resin - there is a rigid area in the circuit board in which bores for through contact must then be provided, a compound consisting only of glass fibers, epoxy resin and Cu foil.
30 Disse boringer kan således væsentligt enklere for synes med en gennemgående kontakt end det er tilfældet ved de kendte kredsløbspladeopbygninger. Borehullernes kobberbøsninger er stabile ved efterfølgende lodning og også senere ved indsættelse af det færdige kredsløbskon-35 cept.Thus, these bores can be substantially simpler to appear with a through contact than is the case with the known circuit board structures. The copper bushings of the boreholes are stable upon subsequent brazing and also later upon insertion of the finished circuit concept.
Ved stive-bøjelige lederplader kan de bøjelige lag andrage 20 eller flere planer. Det har vist sig, atIn the case of rigid flexible guide plates, the flexible layers can be 20 or more planes. It has been found that
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3624718 | 1986-07-22 | ||
DE19863624718 DE3624718A1 (en) | 1986-07-22 | 1986-07-22 | MULTI-LAYER, RIGID AND FLEXIBLE AREAS HAVING PCB |
Publications (4)
Publication Number | Publication Date |
---|---|
DK359287D0 DK359287D0 (en) | 1987-07-10 |
DK359287A DK359287A (en) | 1988-01-23 |
DK165153B true DK165153B (en) | 1992-10-12 |
DK165153C DK165153C (en) | 1993-03-01 |
Family
ID=6305683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK359287A DK165153C (en) | 1986-07-22 | 1987-07-10 | MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0254082B1 (en) |
AT (1) | ATE55532T1 (en) |
DE (2) | DE3624718A1 (en) |
DK (1) | DK165153C (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03196691A (en) * | 1989-12-26 | 1991-08-28 | Cmk Corp | Formation of insulating layer of printed wiring board |
US5004639A (en) * | 1990-01-23 | 1991-04-02 | Sheldahl, Inc. | Rigid flex printed circuit configuration |
DE4003344C1 (en) * | 1990-02-05 | 1991-06-13 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
DE4003345C1 (en) * | 1990-02-05 | 1991-08-08 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
DE4115703C1 (en) * | 1991-05-14 | 1992-08-27 | Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De | |
GB9125173D0 (en) * | 1991-11-27 | 1992-01-29 | Northumbria Circuits Limited | Printed circuit combination and process |
DE4208610C1 (en) * | 1992-03-18 | 1993-05-19 | Fa. Carl Freudenberg, 6940 Weinheim, De | Rigid-flexible PCB with flexible circuit foil mfg. - having flexible PCB in flexible region with fracture lines in rigid outer layers along rigid-flexible transition allowing rigid part to be removed along fracture lines after processing |
US6298013B1 (en) | 1993-11-15 | 2001-10-02 | Siemens Aktiengesellschaft | Device for monitoring the travel time of mail shipments |
JPH09510319A (en) * | 1994-03-08 | 1997-10-14 | テレダイン インダストリーズ,インク. | Method for manufacturing multi-layered rigid and flexible printed circuit board |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3346415A (en) * | 1963-12-16 | 1967-10-10 | Carl L Hachenberger | Flexible printed circuit wiring |
DE2657212C3 (en) * | 1976-12-17 | 1982-09-02 | Schoeller & Co Elektronik Gmbh, 3552 Wetter | Process for the production of rigid and flexible areas having printed circuit boards |
JPS5683096A (en) * | 1979-12-10 | 1981-07-07 | Sony Corp | Hybrid integrated circuit and method of manufacturing same |
DE3119884C1 (en) * | 1981-05-19 | 1982-11-04 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Process for the production of rigid and flexible printed circuit boards |
US4597177A (en) * | 1984-01-03 | 1986-07-01 | International Business Machines Corporation | Fabricating contacts for flexible module carriers |
US4687695A (en) * | 1985-09-27 | 1987-08-18 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
-
1986
- 1986-07-22 DE DE19863624718 patent/DE3624718A1/en active Granted
-
1987
- 1987-06-30 EP EP87109368A patent/EP0254082B1/en not_active Expired - Lifetime
- 1987-06-30 DE DE8787109368T patent/DE3764215D1/en not_active Expired - Lifetime
- 1987-06-30 AT AT87109368T patent/ATE55532T1/en not_active IP Right Cessation
- 1987-07-10 DK DK359287A patent/DK165153C/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE55532T1 (en) | 1990-08-15 |
DE3624718C2 (en) | 1988-06-23 |
DK165153C (en) | 1993-03-01 |
DK359287A (en) | 1988-01-23 |
DE3624718A1 (en) | 1988-01-28 |
DK359287D0 (en) | 1987-07-10 |
EP0254082A3 (en) | 1988-07-13 |
DE3764215D1 (en) | 1990-09-13 |
EP0254082B1 (en) | 1990-08-08 |
EP0254082A2 (en) | 1988-01-27 |
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Legal Events
Date | Code | Title | Description |
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PBP | Patent lapsed |