DK165040C - MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS - Google Patents
MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREASInfo
- Publication number
- DK165040C DK165040C DK359187A DK359187A DK165040C DK 165040 C DK165040 C DK 165040C DK 359187 A DK359187 A DK 359187A DK 359187 A DK359187 A DK 359187A DK 165040 C DK165040 C DK 165040C
- Authority
- DK
- Denmark
- Prior art keywords
- flexible
- rigid
- circuit plate
- regions
- multiple circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Glass Compositions (AREA)
Abstract
1. A prelaminate which may be used instead of flexible single layers in the construction of rigid-flexible circuit boards, characterized in that it consists of a plate (1) of a non-flexible (rigid) material into which flexible, adhesive-coated plastic films (2) free from edge gaps and equal in thickness to the plate (1) are inserted in the regions where the subsequent circuit board is to be flexible, the regions of the inserted flexible plastic films having to be 2 to 10 mm larger than the desired subsequent flexible regions of the circuit board.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3624719 | 1986-07-22 | ||
DE19863624719 DE3624719A1 (en) | 1986-07-22 | 1986-07-22 | PRELAMINATE FOR RIGID-FLEXIBLE PCB |
Publications (4)
Publication Number | Publication Date |
---|---|
DK359187D0 DK359187D0 (en) | 1987-07-10 |
DK359187A DK359187A (en) | 1988-01-23 |
DK165040B DK165040B (en) | 1992-09-28 |
DK165040C true DK165040C (en) | 1993-02-08 |
Family
ID=6305684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK359187A DK165040C (en) | 1986-07-22 | 1987-07-10 | MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0255607B1 (en) |
AT (1) | ATE55531T1 (en) |
DE (2) | DE3624719A1 (en) |
DK (1) | DK165040C (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5095628A (en) * | 1990-08-09 | 1992-03-17 | Teledyne Industries, Inc. | Process of forming a rigid-flex circuit |
GB9125173D0 (en) * | 1991-11-27 | 1992-01-29 | Northumbria Circuits Limited | Printed circuit combination and process |
CN101605430B (en) * | 2009-07-16 | 2012-01-25 | 东莞康源电子有限公司 | Method for pressing layer gasket of rigid-flexible product |
CN104302126A (en) * | 2014-10-11 | 2015-01-21 | 无锡长辉机电科技有限公司 | Manufacturing technique of rigid and flexible combined printed board |
WO2017017127A1 (en) * | 2015-07-28 | 2017-02-02 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Stretchable electronic component carrier |
CN108260275B (en) * | 2017-12-21 | 2019-09-06 | 深南电路股份有限公司 | Using the rigid-flexible combination PCB and its processing method of extraction-type gasket construction |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3346415A (en) * | 1963-12-16 | 1967-10-10 | Carl L Hachenberger | Flexible printed circuit wiring |
DE2657212C3 (en) * | 1976-12-17 | 1982-09-02 | Schoeller & Co Elektronik Gmbh, 3552 Wetter | Process for the production of rigid and flexible areas having printed circuit boards |
JPS5683096A (en) * | 1979-12-10 | 1981-07-07 | Sony Corp | Hybrid integrated circuit and method of manufacturing same |
DE3119884C1 (en) * | 1981-05-19 | 1982-11-04 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Process for the production of rigid and flexible printed circuit boards |
US4597177A (en) * | 1984-01-03 | 1986-07-01 | International Business Machines Corporation | Fabricating contacts for flexible module carriers |
US4687695A (en) * | 1985-09-27 | 1987-08-18 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
-
1986
- 1986-07-22 DE DE19863624719 patent/DE3624719A1/en active Granted
-
1987
- 1987-06-30 DE DE8787109367T patent/DE3764217D1/en not_active Expired - Lifetime
- 1987-06-30 AT AT87109367T patent/ATE55531T1/en not_active IP Right Cessation
- 1987-06-30 EP EP87109367A patent/EP0255607B1/en not_active Expired - Lifetime
- 1987-07-10 DK DK359187A patent/DK165040C/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DK165040B (en) | 1992-09-28 |
DK359187D0 (en) | 1987-07-10 |
DE3624719C2 (en) | 1988-05-26 |
EP0255607B1 (en) | 1990-08-08 |
ATE55531T1 (en) | 1990-08-15 |
EP0255607A2 (en) | 1988-02-10 |
DE3764217D1 (en) | 1990-09-13 |
DE3624719A1 (en) | 1988-01-28 |
DK359187A (en) | 1988-01-23 |
EP0255607A3 (en) | 1988-07-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PBP | Patent lapsed |