DK165040C - MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS - Google Patents

MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS

Info

Publication number
DK165040C
DK165040C DK359187A DK359187A DK165040C DK 165040 C DK165040 C DK 165040C DK 359187 A DK359187 A DK 359187A DK 359187 A DK359187 A DK 359187A DK 165040 C DK165040 C DK 165040C
Authority
DK
Denmark
Prior art keywords
flexible
rigid
circuit plate
regions
multiple circuit
Prior art date
Application number
DK359187A
Other languages
Danish (da)
Other versions
DK165040B (en
DK359187D0 (en
DK359187A (en
Inventor
Friedrich-Wilhelm Schlitter
Original Assignee
Schoeller & Co Elektronik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller & Co Elektronik filed Critical Schoeller & Co Elektronik
Publication of DK359187D0 publication Critical patent/DK359187D0/en
Publication of DK359187A publication Critical patent/DK359187A/en
Publication of DK165040B publication Critical patent/DK165040B/en
Application granted granted Critical
Publication of DK165040C publication Critical patent/DK165040C/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0187Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Glass Compositions (AREA)

Abstract

1. A prelaminate which may be used instead of flexible single layers in the construction of rigid-flexible circuit boards, characterized in that it consists of a plate (1) of a non-flexible (rigid) material into which flexible, adhesive-coated plastic films (2) free from edge gaps and equal in thickness to the plate (1) are inserted in the regions where the subsequent circuit board is to be flexible, the regions of the inserted flexible plastic films having to be 2 to 10 mm larger than the desired subsequent flexible regions of the circuit board.
DK359187A 1986-07-22 1987-07-10 MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS DK165040C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3624719 1986-07-22
DE19863624719 DE3624719A1 (en) 1986-07-22 1986-07-22 PRELAMINATE FOR RIGID-FLEXIBLE PCB

Publications (4)

Publication Number Publication Date
DK359187D0 DK359187D0 (en) 1987-07-10
DK359187A DK359187A (en) 1988-01-23
DK165040B DK165040B (en) 1992-09-28
DK165040C true DK165040C (en) 1993-02-08

Family

ID=6305684

Family Applications (1)

Application Number Title Priority Date Filing Date
DK359187A DK165040C (en) 1986-07-22 1987-07-10 MULTIPLE CIRCUIT PLATE WITH RIGID AND FLEXIBLE AREAS

Country Status (4)

Country Link
EP (1) EP0255607B1 (en)
AT (1) ATE55531T1 (en)
DE (2) DE3624719A1 (en)
DK (1) DK165040C (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5095628A (en) * 1990-08-09 1992-03-17 Teledyne Industries, Inc. Process of forming a rigid-flex circuit
GB9125173D0 (en) * 1991-11-27 1992-01-29 Northumbria Circuits Limited Printed circuit combination and process
CN101605430B (en) * 2009-07-16 2012-01-25 东莞康源电子有限公司 Method for pressing layer gasket of rigid-flexible product
CN104302126A (en) * 2014-10-11 2015-01-21 无锡长辉机电科技有限公司 Manufacturing technique of rigid and flexible combined printed board
WO2017017127A1 (en) * 2015-07-28 2017-02-02 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Stretchable electronic component carrier
CN108260275B (en) * 2017-12-21 2019-09-06 深南电路股份有限公司 Using the rigid-flexible combination PCB and its processing method of extraction-type gasket construction

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3346415A (en) * 1963-12-16 1967-10-10 Carl L Hachenberger Flexible printed circuit wiring
DE2657212C3 (en) * 1976-12-17 1982-09-02 Schoeller & Co Elektronik Gmbh, 3552 Wetter Process for the production of rigid and flexible areas having printed circuit boards
JPS5683096A (en) * 1979-12-10 1981-07-07 Sony Corp Hybrid integrated circuit and method of manufacturing same
DE3119884C1 (en) * 1981-05-19 1982-11-04 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Process for the production of rigid and flexible printed circuit boards
US4597177A (en) * 1984-01-03 1986-07-01 International Business Machines Corporation Fabricating contacts for flexible module carriers
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein

Also Published As

Publication number Publication date
DK165040B (en) 1992-09-28
DK359187D0 (en) 1987-07-10
DE3624719C2 (en) 1988-05-26
EP0255607B1 (en) 1990-08-08
ATE55531T1 (en) 1990-08-15
EP0255607A2 (en) 1988-02-10
DE3764217D1 (en) 1990-09-13
DE3624719A1 (en) 1988-01-28
DK359187A (en) 1988-01-23
EP0255607A3 (en) 1988-07-13

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Legal Events

Date Code Title Description
PBP Patent lapsed