DK164732B - PROCEDURE FOR MANUFACTURING WATER RESISTANT CHIPS - Google Patents
PROCEDURE FOR MANUFACTURING WATER RESISTANT CHIPS Download PDFInfo
- Publication number
- DK164732B DK164732B DK260586A DK260586A DK164732B DK 164732 B DK164732 B DK 164732B DK 260586 A DK260586 A DK 260586A DK 260586 A DK260586 A DK 260586A DK 164732 B DK164732 B DK 164732B
- Authority
- DK
- Denmark
- Prior art keywords
- chips
- tile
- water
- wood
- shavings
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
- B27N1/006—Pretreatment of moulding material for increasing resistance to swelling by humidity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
- B27D1/06—Manufacture of central layers; Form of central layers
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
Description
DK 164732 BDK 164732 B
Opfindelsen angår en fremgangsmåde til fremstilling af vandresistente spånplader.The invention relates to a process for producing water-resistant particleboard.
Spånplader fremstilles af flis eller spåner af træ eller andet vegetabilsk materiale, som formes til en ønsket 5 pladeform og klæbes sammen under anvendelse af et vilkårligt egnet klæbemateriale, sådanne spånplader indeholder i det væsentlige ingen anisotropi og ingen knaster, skævheder eller lignende, som forekommer, i de konventionelle træprodukter. Spånpladerne kan formes således, at de har tilstræk-10 kelig styrke og ønskede dimensioner til praktiske formål også ud fra værdiløse træmaterialer herunder stammer med små diametre. Spånpladerne kan produceres med forøget udbytte. Af disse grunde anvendes partikelplader i dag som møbelmaterialer, bygningsmaterialer og til andre formål.Particleboard is made of wood chips or chips or other vegetable material which is molded to a desired shape and adhered using any suitable adhesive material, such particleboard has essentially no anisotropy and no cracks, bias or the like, in the conventional wood products. The particleboard may be shaped so as to have sufficient strength and desired dimensions for practical purposes also from worthless wood materials including small diameter trunks. The particleboard can be produced with increased yield. For these reasons, particle boards are used today as furniture materials, building materials and for other purposes.
15 Spånplader støbt af træflis eller spåner absorberer imidlertid fugtighed på samme måde som konventionelle træprodukter. Når spånpladerne udsættes for vand eller fugtighed, kan de derfor svulme op, således at dimensionerne såsom tykkelse, bredde og længde ændres. Endvidere vil fugtighed 20 eller vand, som er trængt ind i spånerne eller flisen ikke let fordampe. De opsvulmede spånplader kan derfor vanskeligt bringes tilbage til den oprindelige form, og de vil have reduceret styrke. Disse fænomener giver problemer ved fremstilling og bearbejdning af produkter fremstillet af spånpla-25 der. For at overvinde disse vanskeligheder har der været fremsat flere forslag, f.eks. at forbedre klæbemidlet til sammenklæbning af træflis eller spåner eller at harpiksbehandle træspåner eller flis. Intet af disse forslag har imidlertid kunnet tilvejebringe en spånplade, som har perfekt 30 vand- og fugtighedsresistens.However, chipboard molded from wood chips or shavings absorbs moisture in the same way as conventional wood products. Therefore, when the particle boards are exposed to water or moisture, they can swell, so that the dimensions such as thickness, width and length change. Furthermore, moisture 20 or water that has penetrated the chips or tile will not evaporate easily. The swollen particle board can therefore be difficult to bring back to its original shape and will have reduced strength. These phenomena cause problems in the manufacture and machining of products made of particle board. To overcome these difficulties, several proposals have been made, e.g. to improve the adhesive for bonding wood chips or chips or to resin treat wood chips or chips. However, none of these proposals has been able to provide a particle board that has perfect water and moisture resistance.
Det er derfor formålet med opfindelsen at tilvejebringe en fremgangsmåde til fremstilling af spånplader ved støbning af flis eller spåner af træ eller andet ve- 35It is therefore an object of the invention to provide a method of making particleboard by casting wood chips or chips from wood or other wood.
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o getabilsk fibermateriale til en ønsket pladekonfiguration og at klæbe flisen eller spånerne sammen ved hjælp af et klæbemiddel, hvilken fremgangsmåde er ejendommelig ved, at den indbefatter det trin, at flisen eller spåner op-5 varmes til en temperatur på 100°C til 200°C i mindst én time, samtidig med at flisen eller spånerne roteres i en atmosfære bestående af 95% eller mere af ikke brændbar gas, således at fugtighed og saft fjernes fuldstændigt fra flisen eller spånerne, inden sammenklæbning-10 en af flisen eller spånerne.gable fibrous material for a desired plate configuration and to adhere the tile or chips by an adhesive, the method being characterized in that it includes the step of heating the tile or chips to a temperature of 100 ° C to 200 ° C for at least one hour while rotating the tile or chips in an atmosphere of 95% or more of non-combustible gas, so that moisture and juice are completely removed from the tile or chips before bonding the tile or chips.
Idet den tørrede flis eller spånerne udelukkende består af fibre uden noget vand eller saft, kan klæbemidlet trænge tilstrækkeligt ind i vævet i flisen eller spånerne til at klæbe dem sammen eller sammenføje dem med 15 en forøget styrke. Når en spånplade fremstilles af flis eller spåner sammenføjet på denne måde, kan den ikke svulme op, selv om den udsættes for vand eller fugtighed.Since the dried chips or chips consist solely of fibers without any water or juice, the adhesive may penetrate sufficiently into the tissue of the chip or chips to adhere them or join them with an increased strength. When a chipboard is made of chips or chips joined in this way, it cannot swell, even if exposed to water or moisture.
Der er derfor ved fremgangsmåden ifølge opfindelsen tilvejebragt en spånplade, som har forbedret vand- og 20 fugtighedsresistens.Therefore, the method according to the invention provides a chipboard which has improved water and moisture resistance.
Tegningen er en grafisk fremstilling, som viser forsøgsresultater med spånplader fremstillet ved fremgangsmåden ifølge opfindelsen og med prøver fremstillet ifølge tidligere kendt teknik.The drawing is a graphical representation showing experimental results with particle board made by the method according to the invention and with samples made according to prior art.
25 Ifølge opfindelsen skal et klæbemiddel først påføres på flispartikler eller spåner af et hvilket som helst egnet træmaterialé eller andet vegetabilsk fibermateriale. Flisen eller spånerne formes derfor til en ønsket pladekonfi-guration. Det nye og væsentlige trask ifølge opfindelsen 30 består i, at flisen eller flagerne behandles, således at de har vandresistens før trinnet, hvor klæbemidlet påføres på flisen eller flagerne. Fremgangsmåden ifølge opfindelsen beskrives mere detaljeret nedenfor.According to the invention, an adhesive must first be applied to chip particles or shavings of any suitable wood material or other vegetable fiber material. The tile or chips are therefore formed into a desired plate configuration. The new and essential feature of the invention 30 consists in treating the tile or flakes so that they have water resistance prior to the step of applying the adhesive to the tile or flakes. The process of the invention is described in more detail below.
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Træmaterialer, som anvendes til at fremstille flis eller spåner ved den foreliggende opfindelse, er ikke begrænset til nogen speciel type. F.eks. kan et hvilket som helst træmateriale, som anvendes til 5 at fremstille de konventionelle spånplader, an vendes. Træmaterialer, som indeholder mere vand og saft, kan tilsvarende anvendes ved fremgangsmåden ifølge opfindelsen, idet de kan tørres, således at vandet og saften fjernes fuldstændigt.Wood materials used to make wood chips or chips in the present invention are not limited to any particular type. Eg. For example, any wood material used to make the conventional particle board may be used. Similarly, wood materials containing more water and juice can be used in the process of the invention as they can be dried so that the water and juice are completely removed.
10 Træemnerne snittes og bearbejdes til flisflager eller spåner, på en hvilken som helst egnet måde, ligesom ved de konventionelle fremgangsmåder. Formen og størrelsen af flagerne eller spånerne bestemmes afhængigt af kvaliteten og klassen af spånplader, som skal 15 fremstilles, ligesom ved de konventionelle fremgangsmåder.The wood blanks are cut and machined into tile flakes or chips, in any suitable manner, as in conventional methods. The shape and size of the flakes or chips are determined depending on the quality and class of particle board to be manufactured, as with conventional methods.
Flisflager eller spåner kan opnås ved at nedbryde eller opskære udtørrede trætyper med højt vandindhold. Dersom træmaterialer med et vandhold på ca. 6% anvendes, kan tiden til gennemføring af fremgangsmåden ifølge 20 opfindelsen afkortes.Tile flakes or shavings can be obtained by breaking down or cutting out dried water types with high water content. If wood materials with a water content of approx. 6% is used, the time for carrying out the method of the invention can be shortened.
De fremstillede flisflager eller spåner placeres derefter i en tørrebeholder eller autoklav, som kan være af kendt type. Derefter fjernes luften fra det indre af tørrebeholderen eller autoklaven. En ikke brændbar gas 25 valgt af gruppen bestående af inerte gasser såsom ar gon, helium og krypton, carbondioxid, ammoniak, svovl-dioxyd og nitrogen ledes derefter ind i tørrebeholderen eller autoklaven, således at der tilvejebringes en atmosfære bestående af 95% eller mere af ubrændbar gas.The manufactured tile flakes or chips are then placed in a drying container or autoclave, which may be of known type. The air is then removed from the interior of the drying vessel or autoclave. A non-combustible gas selected by the group consisting of inert gases such as argon, helium and krypton, carbon dioxide, ammonia, sulfur dioxide and nitrogen is then fed into the drying vessel or autoclave to provide an atmosphere of 95% or more of combustible gas.
30 Den ikke brændbare gas, som fyldes i beholderen, kan indbefatte en kombination af to eller flere af de ovenfor nævnte ubrændbare gasser. Det er ønskeligt, at atmosfæren i det indre af tørrebeholderen indeholder meget små mængder oxygen eller slet intet. Dersom der findes 35The non-combustible gas filled into the container may include a combination of two or more of the above non-combustible gases. It is desirable that the atmosphere inside the drying container contains very small amounts of oxygen or nothing at all. If there are 35
OISLAND
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en større mængde oxygen i tørrebeholderen, vil flisen eller spånerne brændes eller carboniseres, således at styrken aftager, når de opvarmes til en for høj temperatur, som beskrevet nedenfor.a greater amount of oxygen in the drying vessel, the chips or chips will be burned or carbonized so that the strength decreases when heated to an excessive temperature, as described below.
5 Temperaturen i tørrebeholderen eller autoklaven hæves derefter til området mellem 100°C og 200°C. Denne temperatur kan vælges afhængigt af egenskaben hos flisen eller spånerne, som er anbragt inde i tørrebeholderen.5 The temperature of the drying vessel or autoclave is then raised to the range between 100 ° C and 200 ° C. This temperature can be selected depending on the property of the tile or chips placed inside the drying container.
I de fleste tilfælde er det ønskeligt at opvarme flisen 10 eller spånerne til en temperatur på 200°C, idet de da kan tørres til den mest ønskelige tilstand for opfyldelsen af formålet med opfindelsen, i hvilken tilstand vand og saft er fuldstændigt fjernet fra flisen eller spånerne. Dersom flisen eller spånerne opvarmes til en temperatur 15 på 100°C eller mindre, fjernes vand og saft ikke i til strækkelig grad. Dersom flisen eller spånerne derimod opvarmes til en temperatur på mere end 200°C, vil de brændes eller carboniseres, således at de bliver uegnede som materiale til spånplader.In most cases, it is desirable to heat the tile 10 or the shavings to a temperature of 200 ° C, as they can then be dried to the most desirable state for the fulfillment of the purpose of the invention, in which state water and juice are completely removed from the tile or chips. If the chips or chips are heated to a temperature of 100 ° C or less, water and juice are not sufficiently removed. On the other hand, if the chips or chips are heated to a temperature of more than 200 ° C, they will be burnt or carbonized so that they become unsuitable as particle board material.
20 Det nævnte atmosfære- og temperaturforhold opret holdes fortrinsvis i mindst én time ved normal tryk. Samtidig roteres flisen eller spånerne for eksempel ved at dreje tørrebeholderen eller autoklaven. Herved forbedres fjernelsen af vand og saft fra flisen eller spånerne.Preferably, said atmospheric and temperature relationship is maintained for at least one hour at normal pressure. At the same time, the tile or chips are rotated, for example, by rotating the drying container or autoclave. This improves the removal of water and juice from the chips or chips.
25 Det tidsrum, hvori flisen eller spånerne opvarmes til en valgt temperatur, bestemmes i afhængighed af egenskaben, størrelsen’og andre faktorer med tilknytning til flisen eller spånerne. I alle tilfælde bør tidsrummet være mindst én time for at opnå det ønskede formål. Normalt opvarmes 30 flisen eller spånerne til en valgt temperatur i 4-8 timer.The length of time the tile or chips are heated to a selected temperature is determined by the property, size and other factors associated with the tile or chips. In all cases, the time should be at least one hour to achieve the desired purpose. Usually, the tile or chips are heated to a selected temperature for 4-8 hours.
Efter at flisen eller spånerne har været opvarmet til en valgt temperatur i et valgt tidsrum, er vand og saft fuldstændigt fjernet, og der er kun fibre tilbage i vævet.After the tile or shavings have been heated to a selected temperature for a selected period of time, water and juice are completely removed and only fibers are left in the tissue.
Vægten af flisen eller spånerne, som er behandlet på denne 35The weight of the tile or shavings treated on this 35
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o måde, er mindre end vægten af flisen eller spånerne, som anvendes til at fremstille de konventionelle spånplader. Flis eller spåner, som er behandlet på denne måde er ikke brændt eller carboniseret, idet de opvarmes i 5 den ovenfor nævnte atmosfære af ikke-brændbar gas. I til gift er flisen eller spånerne behandlet ensartet, idet de er blevet roteret under opvarmningen.o way, is less than the weight of the tile or chips used to make the conventional chipboard. Tile or shavings treated in this way are not burnt or carbonized as they are heated in the aforementioned atmosphere of non-combustible gas. In poison, the tile or chips are treated uniformly, having been rotated during heating.
Et syntetisk harpiksklæbemiddel, f.eks. urea-harpiksklæbemiddel påføres på de tørrede flisflager eller 10 spåner på sædvanlig måde. Kvaliteten og mængden af det syntetiske harpiksklæbemiddel svarer til kvaliteten og mængden af det syntetiske harpiksklæbemiddel, som anvendes i den konventionelle proces. Med andre ord bestemmes disse størrelser inden for et egnet område i afhængighed 15 af forskellige faktorer, som kræves hos de endelige pro dukter såsom kvalitet, klasse, bearbejdelighed, fremstillingsomkostninger og andre faktorer. I dette arbejdstrin kan klæbemidlet trænge tilstrækkeligt ind i det indre af hver af flisflagerne eller spånerne, idet de kun indbe-20 fatter fibre uden noget vand eller saft. Derefter formes flisen eller spånerne til en ønsket pladekonfiguration og klæbes sammen ved hjælp af et konventionelt formgivningsapparatur. Den støbte plade underkastes derefter de sædvanlige behandlingstrin såsom varmpresning, slutbe-25 handling af størrelsen, overfladeslibning og andre trin for at tilvejebringe et slutbehandlet produkt. Den fremstillede spånplade vil ikke svulme op, hvis den udsættes for vand eller fugtighed, idet den er fremstillet af vandresistente flisflager eller spåner, som er klæbet 30 sammen. Spånpladen har forøget styrke og reduceret vægt, idet flisen eller spånflagerne er klæbet fastere sammen.A synthetic resin adhesive, e.g. urea resin adhesive is applied to the dried tile flakes or chips in the usual manner. The quality and quantity of the synthetic resin adhesive corresponds to the quality and quantity of the synthetic resin adhesive used in the conventional process. In other words, these sizes are determined within a suitable range in dependence on 15 of various factors required by the final products such as quality, grade, workability, manufacturing cost and other factors. In this working step, the adhesive may penetrate sufficiently into the interior of each of the tile flakes or chips, including only fibers without any water or juice. Then, the tile or chips are molded to a desired sheet configuration and glued together by a conventional shaping apparatus. The molded plate is then subjected to the usual processing steps such as hot pressing, finishing of size, surface grinding and other steps to provide a finished product. The fabricated chipboard will not swell if exposed to water or moisture as it is made of water-resistant tile flakes or chips that are adhered together. The chipboard has increased strength and reduced weight as the tile or chip flakes are adhered more firmly together.
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O Spånpladen er resistent mod råd og insekter, fordi vand og saft er fuldstændigt fjernet fra pladen.O The particle board is resistant to rot and insects because water and juice are completely removed from the plate.
Nedenfor beskrives et eksempel.An example is described below.
Flis blev først placeret i en autoklav. Luften i autoklaven blev derefter erstattet med en atmosfære inde-5 holdende 95% eller mere af inert gas. Flisen i autoklaven blev opvarmet til en temperatur på 100°C til 200°C i et tidsrum mellem én time og to timer. Derefter blev vandindholdet i flisen kontrolleret og var op til 4%.Tile was first placed in an autoclave. The air in the autoclave was then replaced with an atmosphere containing 95% or more of inert gas. The tile in the autoclave was heated to a temperature of 100 ° C to 200 ° C for a period of one hour to two hours. Then the water content of the tile was controlled and was up to 4%.
Et konventionelt klæbemiddel og vandskyende mate-10 riale blev påført på den tørrede flis, som derefter blev formet til en ønsket pladekonfiguration på konventionel måde uden specielle og ekstra instrumenter eller værktøjer.A conventional adhesive and water-repellent material were applied to the dried tile, which was then molded into a desired plate configuration in the conventional manner without special and additional instruments or tools.
De fremstillede plader blev varmpresset under et tryk på 15-20 kg/cm'2 ved en temperatur på 170-180°C i 15 5 minutter. De resulterende spånplader tilfreds stillede kravene ifølge JIS 5908 kvalitetsstandard ifølge hvilken en spånplade skal have en tæthed på 0,72 - - 0,75, et vandindhold på 5 - 8%, en bøjningsstyrke på 2 2 180 kg/cm eller mere, en afskalningsstyrke på 3 kg/cm , o 20 en kraft til fastholdelse af træskruer på 50 kg/cm eller mere og en mængde frigivet formaldehyd på eller mindre end 5 mg/1 osv..The prepared sheets were hot pressed under a pressure of 15-20 kg / cm 2 at a temperature of 170-180 ° C for 15 minutes. The resulting particleboard satisfied the requirements of JIS 5908 quality standard according to which a particleboard must have a density of 0.72 - - 0.75, a water content of 5 - 8%, a bending strength of 2,280 kg / cm or more, a peel strength of 3 kg / cm, o 20 a force for retaining wood screws of 50 kg / cm or more and an amount of formaldehyde released at or less than 5 mg / 1, etc.
Vandresistente spånplader fremstillet ved fremgangsmåden ifølge opfindelsen og prøver af spånplader 25 fremstillet ved fremgangsmåden ifølge kendt teknik blev underkastet sammenligningsforsøg vedrørende udvidelse på basis af JIS 5908 standard. Resultaterne er gengivet på tegningen, hvor bogstaverne A og B angiver spånplader ifølge tidligere kendt teknik, medens bogstavet C angiver 30 spånplader ifølge den foreliggende opfindelse. Det fremgår af denne grafiske fremstilling, at udvidelsen af de vandresistente spånplader ifølge opfindelsen er mindre end udvidelsen af pladerne ifølge tidligere kendt teknik.Water resistant particle board made by the method of the invention and samples of particle board 25 made by the method of the prior art were subjected to comparative experiments on expansion based on JIS 5908 standard. The results are shown in the drawing, in which the letters A and B denote particle boards of the prior art, while the letter C denotes 30 particle boards of the present invention. It is apparent from this graphic presentation that the expansion of the water resistant chipboard according to the invention is less than the expansion of the boards of the prior art.
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Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60269946A JPS62130801A (en) | 1985-12-01 | 1985-12-01 | Manufacture of particle board |
JP26994685 | 1985-12-01 |
Publications (4)
Publication Number | Publication Date |
---|---|
DK260586D0 DK260586D0 (en) | 1986-06-03 |
DK260586A DK260586A (en) | 1987-06-02 |
DK164732B true DK164732B (en) | 1992-08-10 |
DK164732C DK164732C (en) | 1992-12-28 |
Family
ID=17479406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK260586A DK164732C (en) | 1985-12-01 | 1986-06-03 | PROCEDURE FOR MANUFACTURING WATER RESISTANT CHIPS |
Country Status (14)
Country | Link |
---|---|
JP (1) | JPS62130801A (en) |
KR (1) | KR930007667B1 (en) |
AU (1) | AU589713B2 (en) |
BE (1) | BE905829A (en) |
CA (1) | CA1276767C (en) |
DE (1) | DE3616985A1 (en) |
DK (1) | DK164732C (en) |
FI (1) | FI862363A (en) |
FR (1) | FR2590833A1 (en) |
GB (1) | GB2185748B (en) |
IT (1) | IT1195088B (en) |
NL (1) | NL193793C (en) |
NO (1) | NO169642C (en) |
SE (1) | SE465413B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2603521B1 (en) * | 1986-09-04 | 1989-01-13 | Du Pin Cellulose | COMPOSITE MATERIALS BASED ON A POLYESTER RESIN MATRIX REINFORCED BY DISCONTINUOUS CELLULOSIC FIBERS AND METHOD OF MANUFACTURE |
JPH06270110A (en) * | 1993-03-18 | 1994-09-27 | Hikari Sangyo:Yugen | Manufacture of resin molded piece using wood flour |
FI104569B (en) * | 1994-11-11 | 2000-02-29 | Valtion Teknillinen | A process for preparing compositions comprising cellulose-based fibers |
DE19822485A1 (en) | 1998-05-19 | 1999-11-25 | Kvaerner Panel Sys Gmbh | Fabrication method for fiber/chip board panels |
FR2870154B1 (en) * | 2004-05-13 | 2012-12-14 | Bio 3D Applic | BIO-THERMAL METHOD AND SYSTEM FOR STABILIZING LUMBER |
US7963048B2 (en) * | 2005-05-23 | 2011-06-21 | Pollard Levi A | Dual path kiln |
US8201501B2 (en) | 2009-09-04 | 2012-06-19 | Tinsley Douglas M | Dual path kiln improvement |
US10619921B2 (en) | 2018-01-29 | 2020-04-14 | Norev Dpk, Llc | Dual path kiln and method of operating a dual path kiln to continuously dry lumber |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB155753A (en) * | 1916-12-15 | 1921-11-24 | Ernest Vanlaethem | Improved means for drying wood, and other material |
DE722782C (en) * | 1936-10-27 | 1942-07-21 | Ver Korkindustrie Ag | Process for the production of porous, thermal and acoustic insulating material in small pieces |
FR2520292B1 (en) * | 1982-01-26 | 1986-09-12 | Isorel | COMPOSITE PANELS BASED ON LIGNOCELLULOSIC FIBERS AND POLYOLEFIN FIBERS, AND THEIR MANUFACTURING METHOD |
GR69554B (en) * | 1982-05-12 | 1982-06-30 | Staurakellis Panagiotis |
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1985
- 1985-12-01 JP JP60269946A patent/JPS62130801A/en active Pending
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1986
- 1986-05-20 KR KR1019860003913A patent/KR930007667B1/en not_active IP Right Cessation
- 1986-05-21 DE DE19863616985 patent/DE3616985A1/en not_active Ceased
- 1986-05-26 NO NO862076A patent/NO169642C/en not_active IP Right Cessation
- 1986-06-03 SE SE8602505A patent/SE465413B/en not_active IP Right Cessation
- 1986-06-03 FI FI862363A patent/FI862363A/en not_active IP Right Cessation
- 1986-06-03 DK DK260586A patent/DK164732C/en not_active IP Right Cessation
- 1986-06-11 GB GB8614245A patent/GB2185748B/en not_active Expired
- 1986-06-26 CA CA000512532A patent/CA1276767C/en not_active Expired - Fee Related
- 1986-07-08 IT IT48244/86A patent/IT1195088B/en active
- 1986-11-27 FR FR8616544A patent/FR2590833A1/en active Pending
- 1986-11-28 AU AU65806/86A patent/AU589713B2/en not_active Ceased
- 1986-11-28 NL NL8603045A patent/NL193793C/en not_active IP Right Cessation
- 1986-11-28 BE BE2/61095A patent/BE905829A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DK260586D0 (en) | 1986-06-03 |
FI862363A (en) | 1987-06-02 |
NO862076L (en) | 1987-06-02 |
AU6580686A (en) | 1987-06-04 |
DK164732C (en) | 1992-12-28 |
NL193793C (en) | 2000-11-06 |
FR2590833A1 (en) | 1987-06-05 |
NL8603045A (en) | 1987-07-01 |
SE8602505D0 (en) | 1986-06-03 |
JPS62130801A (en) | 1987-06-13 |
NO169642C (en) | 1992-07-22 |
GB8614245D0 (en) | 1986-07-16 |
CA1276767C (en) | 1990-11-27 |
DE3616985A1 (en) | 1987-06-04 |
SE465413B (en) | 1991-09-09 |
FI862363A0 (en) | 1986-06-03 |
IT1195088B (en) | 1988-10-12 |
KR870005765A (en) | 1987-07-07 |
KR930007667B1 (en) | 1993-08-18 |
NL193793B (en) | 2000-07-03 |
GB2185748B (en) | 1989-12-06 |
NO169642B (en) | 1992-04-13 |
DK260586A (en) | 1987-06-02 |
GB2185748A (en) | 1987-07-29 |
BE905829A (en) | 1987-03-16 |
AU589713B2 (en) | 1989-10-19 |
IT8648244A0 (en) | 1986-07-08 |
SE8602505L (en) | 1987-06-02 |
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