DK140647B - Varmeoverføringslegeme og diamantlegeme beregnet til fremstilling deraf. - Google Patents

Varmeoverføringslegeme og diamantlegeme beregnet til fremstilling deraf.

Info

Publication number
DK140647B
DK140647B DK376372AA DK376372A DK140647B DK 140647 B DK140647 B DK 140647B DK 376372A A DK376372A A DK 376372AA DK 376372 A DK376372 A DK 376372A DK 140647 B DK140647 B DK 140647B
Authority
DK
Denmark
Prior art keywords
manufacture
heat transfer
intended
diamond
transfer body
Prior art date
Application number
DK376372AA
Other languages
English (en)
Other versions
DK140647C (da
Inventor
Joseph Lambert Maria Custers
Frederick Anton Raal
Original Assignee
De Beers Ind Diamond
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ZA715111A external-priority patent/ZA715111B/xx
Application filed by De Beers Ind Diamond filed Critical De Beers Ind Diamond
Publication of DK140647B publication Critical patent/DK140647B/da
Application granted granted Critical
Publication of DK140647C publication Critical patent/DK140647C/da

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
DK376372AA 1971-07-30 1972-07-28 Varmeoverføringslegeme og diamantlegeme beregnet til fremstilling deraf. DK140647B (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ZA715111A ZA715111B (en) 1971-07-30 1971-07-30 A novel diamond particle particularly for use in heat sinks
ZA715666 1971-08-24
ZA717816 1971-11-19

Publications (2)

Publication Number Publication Date
DK140647B true DK140647B (da) 1979-10-15
DK140647C DK140647C (da) 1980-03-10

Family

ID=27420848

Family Applications (1)

Application Number Title Priority Date Filing Date
DK376372AA DK140647B (da) 1971-07-30 1972-07-28 Varmeoverføringslegeme og diamantlegeme beregnet til fremstilling deraf.

Country Status (15)

Country Link
US (1) US3828848A (da)
JP (1) JPS5215438B2 (da)
AU (1) AU466719B2 (da)
BE (1) BE786812A (da)
CA (1) CA978282A (da)
CH (1) CH544524A (da)
DE (1) DE2236011A1 (da)
DK (1) DK140647B (da)
FR (1) FR2148087B1 (da)
GB (1) GB1393934A (da)
IE (1) IE36616B1 (da)
IL (1) IL39936A (da)
IT (1) IT969524B (da)
NL (1) NL160434C (da)
SE (1) SE374007B (da)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5642779A (en) * 1909-06-30 1997-07-01 Sumitomo Electric Industries, Ltd. Heat sink and a process for the production of the same
JPS54107266A (en) * 1978-02-10 1979-08-22 Nec Corp High-output semiconductor element
JPS5617128A (en) * 1979-07-23 1981-02-18 Banyou Kogyo Kk Drawing apparatus for pipe
IT1168707B (it) * 1983-08-03 1987-05-20 Giovanni Colliva Apparecchiature per il taglio di gemme a faccette sferiche e gemme cosi' ottenute
IL69576A (en) * 1982-09-16 1986-08-31 Colliva Giovanni Apparatus for the cutting of spherical-faceted gems and gems thus obtained
GB8325320D0 (en) * 1983-09-21 1983-10-26 Plessey Co Plc Diamond heatsink assemblies
GB8326983D0 (en) * 1983-10-08 1983-11-09 Plessey Co Plc Diamond heatsink assemblies
GB8328573D0 (en) * 1983-10-26 1983-11-30 Plessey Co Plc Diamond heatsink assemblies
US4649992A (en) * 1984-10-05 1987-03-17 Plessey Overseas Limited Diamond heatsink assemblies
GB8607526D0 (en) * 1986-03-26 1986-04-30 Artus R G C Cooled component assembly
US4782893A (en) * 1986-09-15 1988-11-08 Trique Concepts, Inc. Electrically insulating thermally conductive pad for mounting electronic components
GB2227402B (en) * 1989-01-26 1992-02-19 M Vainer Limited Improvements in or relating to gemstones
US5455738A (en) * 1993-07-28 1995-10-03 E-Systems, Inc. High thermal conductivity, matched CTE. low density mounting plate for a semiconductor circuit
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
US20060113546A1 (en) * 2002-10-11 2006-06-01 Chien-Min Sung Diamond composite heat spreaders having low thermal mismatch stress and associated methods
US7173334B2 (en) * 2002-10-11 2007-02-06 Chien-Min Sung Diamond composite heat spreader and associated methods
US20050189647A1 (en) * 2002-10-11 2005-09-01 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
WO2005038912A1 (en) 2002-10-11 2005-04-28 Chien-Min Sung Carbonaceous heat spreader and associated methods
US7791188B2 (en) 2007-06-18 2010-09-07 Chien-Min Sung Heat spreader having single layer of diamond particles and associated methods
TWI464839B (zh) 2010-09-21 2014-12-11 Ritedia Corp 單層鑽石顆粒散熱器及其相關方法
US8778784B2 (en) 2010-09-21 2014-07-15 Ritedia Corporation Stress regulated semiconductor devices and associated methods
US9006086B2 (en) 2010-09-21 2015-04-14 Chien-Min Sung Stress regulated semiconductor devices and associated methods

Also Published As

Publication number Publication date
DE2236011A1 (de) 1973-02-08
DK140647C (da) 1980-03-10
FR2148087B1 (da) 1977-04-01
BE786812A (fr) 1972-11-16
JPS5215438B2 (da) 1977-04-28
GB1393934A (en) 1975-05-14
JPS4831875A (da) 1973-04-26
IL39936A (en) 1975-04-25
IE36616L (en) 1973-01-30
SE374007B (da) 1975-02-17
NL160434B (nl) 1979-05-15
NL160434C (nl) 1979-10-15
US3828848A (en) 1974-08-13
CA978282A (en) 1975-11-18
NL7210348A (da) 1973-02-01
FR2148087A1 (da) 1973-03-11
IE36616B1 (en) 1977-01-19
CH544524A (de) 1973-11-30
AU4473272A (en) 1974-01-24
IT969524B (it) 1974-04-10
AU466719B2 (en) 1975-11-06
IL39936A0 (en) 1972-09-28

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Legal Events

Date Code Title Description
PBP Patent lapsed