JPS5215438B2 - - Google Patents

Info

Publication number
JPS5215438B2
JPS5215438B2 JP7276426A JP7642672A JPS5215438B2 JP S5215438 B2 JPS5215438 B2 JP S5215438B2 JP 7276426 A JP7276426 A JP 7276426A JP 7642672 A JP7642672 A JP 7642672A JP S5215438 B2 JPS5215438 B2 JP S5215438B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7276426A
Other versions
JPS4831875A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ZA715111A external-priority patent/ZA715111B/xx
Application filed filed Critical
Publication of JPS4831875A publication Critical patent/JPS4831875A/ja
Publication of JPS5215438B2 publication Critical patent/JPS5215438B2/ja
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
JP7276426A 1971-07-30 1972-07-29 Expired JPS5215438B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ZA715111A ZA715111B (en) 1971-07-30 1971-07-30 A novel diamond particle particularly for use in heat sinks
ZA715666 1971-08-24
ZA717816 1971-11-19

Publications (2)

Publication Number Publication Date
JPS4831875A JPS4831875A (ja) 1973-04-26
JPS5215438B2 true JPS5215438B2 (ja) 1977-04-28

Family

ID=27420848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7276426A Expired JPS5215438B2 (ja) 1971-07-30 1972-07-29

Country Status (15)

Country Link
US (1) US3828848A (ja)
JP (1) JPS5215438B2 (ja)
AU (1) AU466719B2 (ja)
BE (1) BE786812A (ja)
CA (1) CA978282A (ja)
CH (1) CH544524A (ja)
DE (1) DE2236011A1 (ja)
DK (1) DK140647B (ja)
FR (1) FR2148087B1 (ja)
GB (1) GB1393934A (ja)
IE (1) IE36616B1 (ja)
IL (1) IL39936A (ja)
IT (1) IT969524B (ja)
NL (1) NL160434C (ja)
SE (1) SE374007B (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5642779A (en) * 1909-06-30 1997-07-01 Sumitomo Electric Industries, Ltd. Heat sink and a process for the production of the same
JPS54107266A (en) * 1978-02-10 1979-08-22 Nec Corp High-output semiconductor element
JPS5617128A (en) * 1979-07-23 1981-02-18 Banyou Kogyo Kk Drawing apparatus for pipe
IL69576A (en) * 1982-09-16 1986-08-31 Colliva Giovanni Apparatus for the cutting of spherical-faceted gems and gems thus obtained
IT1168707B (it) * 1983-08-03 1987-05-20 Giovanni Colliva Apparecchiature per il taglio di gemme a faccette sferiche e gemme cosi' ottenute
GB8325320D0 (en) * 1983-09-21 1983-10-26 Plessey Co Plc Diamond heatsink assemblies
GB8326983D0 (en) * 1983-10-08 1983-11-09 Plessey Co Plc Diamond heatsink assemblies
GB8328573D0 (en) * 1983-10-26 1983-11-30 Plessey Co Plc Diamond heatsink assemblies
US4649992A (en) * 1984-10-05 1987-03-17 Plessey Overseas Limited Diamond heatsink assemblies
GB8607526D0 (en) * 1986-03-26 1986-04-30 Artus R G C Cooled component assembly
US4782893A (en) * 1986-09-15 1988-11-08 Trique Concepts, Inc. Electrically insulating thermally conductive pad for mounting electronic components
GB2227402B (en) * 1989-01-26 1992-02-19 M Vainer Limited Improvements in or relating to gemstones
US5455738A (en) * 1993-07-28 1995-10-03 E-Systems, Inc. High thermal conductivity, matched CTE. low density mounting plate for a semiconductor circuit
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
US20060113546A1 (en) * 2002-10-11 2006-06-01 Chien-Min Sung Diamond composite heat spreaders having low thermal mismatch stress and associated methods
KR20050084845A (ko) 2002-10-11 2005-08-29 치엔 민 성 탄소질 열 확산기 및 관련 방법
US20050189647A1 (en) * 2002-10-11 2005-09-01 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
US7173334B2 (en) 2002-10-11 2007-02-06 Chien-Min Sung Diamond composite heat spreader and associated methods
US7791188B2 (en) * 2007-06-18 2010-09-07 Chien-Min Sung Heat spreader having single layer of diamond particles and associated methods
US9006086B2 (en) 2010-09-21 2015-04-14 Chien-Min Sung Stress regulated semiconductor devices and associated methods
US8778784B2 (en) 2010-09-21 2014-07-15 Ritedia Corporation Stress regulated semiconductor devices and associated methods
CN103221180A (zh) 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法

Also Published As

Publication number Publication date
DK140647B (da) 1979-10-15
AU4473272A (en) 1974-01-24
IL39936A0 (en) 1972-09-28
DE2236011A1 (de) 1973-02-08
NL160434B (nl) 1979-05-15
BE786812A (fr) 1972-11-16
JPS4831875A (ja) 1973-04-26
SE374007B (ja) 1975-02-17
CH544524A (de) 1973-11-30
CA978282A (en) 1975-11-18
IL39936A (en) 1975-04-25
AU466719B2 (en) 1975-11-06
NL7210348A (ja) 1973-02-01
IT969524B (it) 1974-04-10
NL160434C (nl) 1979-10-15
US3828848A (en) 1974-08-13
IE36616L (en) 1973-01-30
IE36616B1 (en) 1977-01-19
FR2148087B1 (ja) 1977-04-01
DK140647C (ja) 1980-03-10
FR2148087A1 (ja) 1973-03-11
GB1393934A (en) 1975-05-14

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