DK1275462T3 - Fremgangsmåde og anordning til lodning af elektriske komponenter på en plastfolie - Google Patents
Fremgangsmåde og anordning til lodning af elektriske komponenter på en plastfolieInfo
- Publication number
- DK1275462T3 DK1275462T3 DK02014075T DK02014075T DK1275462T3 DK 1275462 T3 DK1275462 T3 DK 1275462T3 DK 02014075 T DK02014075 T DK 02014075T DK 02014075 T DK02014075 T DK 02014075T DK 1275462 T3 DK1275462 T3 DK 1275462T3
- Authority
- DK
- Denmark
- Prior art keywords
- plastic film
- components
- hot gas
- electrical components
- soldering electrical
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10133217A DE10133217A1 (de) | 2001-07-09 | 2001-07-09 | Verfahren und Vorrichtung zum Verlöten von elektrischen Bauteilen auf Kunststofffolie |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1275462T3 true DK1275462T3 (da) | 2007-01-08 |
Family
ID=7691119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK02014075T DK1275462T3 (da) | 2001-07-09 | 2002-07-01 | Fremgangsmåde og anordning til lodning af elektriske komponenter på en plastfolie |
Country Status (7)
Country | Link |
---|---|
US (1) | US6726087B2 (da) |
EP (1) | EP1275462B1 (da) |
AT (1) | ATE337882T1 (da) |
DE (2) | DE10133217A1 (da) |
DK (1) | DK1275462T3 (da) |
ES (1) | ES2269565T3 (da) |
PT (1) | PT1275462E (da) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051671A (ja) * | 2001-06-01 | 2003-02-21 | Nec Corp | 実装構造体の製造方法および実装構造体 |
DE10133217A1 (de) * | 2001-07-09 | 2003-01-23 | Seho Systemtechnik Gmbh | Verfahren und Vorrichtung zum Verlöten von elektrischen Bauteilen auf Kunststofffolie |
DE10350699B3 (de) | 2003-10-30 | 2005-06-30 | Rehm Anlagenbau Gmbh | Verfahren und Vorrichtung zum Aufschmelzlöten mit Volumenstromsteuerung |
US7124931B2 (en) * | 2003-11-18 | 2006-10-24 | Intel Corporation | Via heat sink material |
FR2864419B1 (fr) * | 2003-12-19 | 2006-04-28 | Hispano Suiza Sa | Procede pour braser un composant electronique sur une carte electronique, procede de reparation de la carte et installation pour la mise en oeuvre du procede |
DE102004057505B4 (de) * | 2004-11-29 | 2008-08-21 | Lisa Dräxlmaier GmbH | Elektrisches Funktionsbauteil |
DE102005032135A1 (de) * | 2005-07-07 | 2007-01-18 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Löten einer Leiterplatte mit bleifreier Lotpaste in einem Reflow-Lötofen, Leiterplatte für solch ein Verfahren und Reflow-Lötofen |
DE102005039829A1 (de) * | 2005-08-22 | 2007-03-08 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Löten von SMD-Bauteilen, Leiterplatte und Reflow-Lötofen dazu |
US7592702B2 (en) * | 2006-07-31 | 2009-09-22 | Intel Corporation | Via heat sink material |
US20080241563A1 (en) * | 2007-03-30 | 2008-10-02 | Khamvong Thammasouk | Polymer substrate for electronic components |
US11456160B2 (en) * | 2018-03-26 | 2022-09-27 | Tokyo Electron Limited | Plasma processing apparatus |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3617682A (en) * | 1969-06-23 | 1971-11-02 | Gen Electric | Semiconductor chip bonder |
US3742181A (en) * | 1971-02-25 | 1973-06-26 | Argus Eng Co | Method and apparatus for heatbonding in a local area using combined heating techniques |
DE2640613C2 (de) * | 1976-09-09 | 1985-03-07 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und Vorrichtung zum Kontaktieren von Schaltungsbausteinen in eine Schichtschaltung |
US4610388A (en) * | 1984-02-24 | 1986-09-09 | Eldon Industries, Inc. | Circuit board and component manipulation device |
DE3737457A1 (de) * | 1987-11-04 | 1989-05-18 | Peter Gammelin | Loetvorrichtung |
JPH0677830B2 (ja) * | 1987-12-25 | 1994-10-05 | 松下電器産業株式会社 | 基板加熱方法 |
US4979664A (en) * | 1989-11-15 | 1990-12-25 | At&T Bell Laboratories | Method for manufacturing a soldered article |
US5433368A (en) * | 1992-11-10 | 1995-07-18 | Spigarelli; Donald J. | Soldering system |
DE9304076U1 (de) * | 1993-03-19 | 1993-07-22 | Fredart Sondermaschinen GmbH, 4000 Düsseldorf | Lötgerät für SMD-Leiterplatten |
JP2664878B2 (ja) * | 1994-01-31 | 1997-10-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 半導体チップパッケージおよびその製造方法 |
US5639011A (en) * | 1995-02-02 | 1997-06-17 | Jacks; David C. | Attaching components and reworking circuit boards |
DE19527398A1 (de) * | 1995-07-27 | 1997-01-30 | Philips Patentverwaltung | Verfahren zum Löten von Bauelementen auf einer Trägerfolie |
US6145734A (en) * | 1996-04-16 | 2000-11-14 | Matsushita Electric Industrial Co., Ltd. | Reflow method and reflow device |
US6257866B1 (en) * | 1996-06-18 | 2001-07-10 | Hy-Tech Forming Systems, Inc. | Apparatus for accurately forming plastic sheet |
US6005224A (en) * | 1997-10-30 | 1999-12-21 | U.S. Philips Corporation | Method of soldering components to at least one carrier |
EP1133219A4 (en) * | 1998-10-13 | 2004-10-27 | Matsushita Electric Ind Co Ltd | HEATING DEVICE AND HEATING METHOD |
JP2001144428A (ja) * | 1999-11-10 | 2001-05-25 | Sony Corp | ハンダ付け装置及びハンダ付け方法 |
DE10133217A1 (de) * | 2001-07-09 | 2003-01-23 | Seho Systemtechnik Gmbh | Verfahren und Vorrichtung zum Verlöten von elektrischen Bauteilen auf Kunststofffolie |
US6642485B2 (en) * | 2001-12-03 | 2003-11-04 | Visteon Global Technologies, Inc. | System and method for mounting electronic components onto flexible substrates |
-
2001
- 2001-07-09 DE DE10133217A patent/DE10133217A1/de not_active Withdrawn
-
2002
- 2002-07-01 AT AT02014075T patent/ATE337882T1/de not_active IP Right Cessation
- 2002-07-01 EP EP02014075A patent/EP1275462B1/de not_active Expired - Lifetime
- 2002-07-01 DE DE50207975T patent/DE50207975D1/de not_active Expired - Lifetime
- 2002-07-01 ES ES02014075T patent/ES2269565T3/es not_active Expired - Lifetime
- 2002-07-01 DK DK02014075T patent/DK1275462T3/da active
- 2002-07-01 PT PT02014075T patent/PT1275462E/pt unknown
- 2002-07-09 US US10/190,618 patent/US6726087B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE10133217A1 (de) | 2003-01-23 |
ES2269565T3 (es) | 2007-04-01 |
DE50207975D1 (de) | 2006-10-12 |
EP1275462B1 (de) | 2006-08-30 |
PT1275462E (pt) | 2007-01-31 |
US6726087B2 (en) | 2004-04-27 |
EP1275462A1 (de) | 2003-01-15 |
US20030024966A1 (en) | 2003-02-06 |
ATE337882T1 (de) | 2006-09-15 |
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