DK121664B - Fremgangsmåde til fremstilling af elektroniske komponenter, navnlig halvlederkomponenter, med et lag korn indlejret i en plastfolie. - Google Patents

Fremgangsmåde til fremstilling af elektroniske komponenter, navnlig halvlederkomponenter, med et lag korn indlejret i en plastfolie.

Info

Publication number
DK121664B
DK121664B DK475468AA DK475468A DK121664B DK 121664 B DK121664 B DK 121664B DK 475468A A DK475468A A DK 475468AA DK 475468 A DK475468 A DK 475468A DK 121664 B DK121664 B DK 121664B
Authority
DK
Denmark
Prior art keywords
manufacture
layer
plastic film
particular semiconductor
components
Prior art date
Application number
DK475468AA
Other languages
Danish (da)
English (en)
Inventor
Velde T Te
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of DK121664B publication Critical patent/DK121664B/da

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0384Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including other non-monocrystalline materials, e.g. semiconductor particles embedded in an insulating material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/58Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
    • B29C70/64Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres the filler influencing the surface characteristics of the material, e.g. by concentrating near the surface or by incorporating in the surface by force
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C73/00Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D
    • B29C73/04Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D using preformed elements
    • B29C73/10Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D using preformed elements using patches sealing on the surface of the article
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00Use of polyesters or derivatives thereof, as moulding material
    • B29K2067/06Unsaturated polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2075/00Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00Flat articles, e.g. films or sheets
    • B29L2007/008Wide strips, e.g. films, webs

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Weting (AREA)
  • Photovoltaic Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Formation Of Insulating Films (AREA)
  • ing And Chemical Polishing (AREA)
  • Led Devices (AREA)
DK475468AA 1967-10-05 1968-10-02 Fremgangsmåde til fremstilling af elektroniske komponenter, navnlig halvlederkomponenter, med et lag korn indlejret i en plastfolie. DK121664B (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6713531A NL6713531A (ja) 1967-10-05 1967-10-05

Publications (1)

Publication Number Publication Date
DK121664B true DK121664B (da) 1971-11-15

Family

ID=19801371

Family Applications (1)

Application Number Title Priority Date Filing Date
DK475468AA DK121664B (da) 1967-10-05 1968-10-02 Fremgangsmåde til fremstilling af elektroniske komponenter, navnlig halvlederkomponenter, med et lag korn indlejret i en plastfolie.

Country Status (12)

Country Link
US (1) US3796782A (ja)
JP (1) JPS4535147B1 (ja)
BE (1) BE721804A (ja)
BR (1) BR6802820D0 (ja)
CH (1) CH526845A (ja)
DE (1) DE1789065B1 (ja)
DK (1) DK121664B (ja)
ES (1) ES358760A1 (ja)
FR (1) FR1585544A (ja)
GB (1) GB1236967A (ja)
NL (1) NL6713531A (ja)
SE (1) SE340661B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247499A (en) * 1979-05-18 1981-01-27 General Electric Company Methods of forming a solid ion-conductive electrolyte
JPS608224B2 (ja) * 1980-05-29 1985-03-01 花王株式会社 多孔質シ−ト
JPS5792456A (en) * 1980-11-29 1982-06-09 Sony Corp Sliding member
US9502729B2 (en) 2012-08-29 2016-11-22 Corning Incorporated Ion-conducting composite electrolyte comprising path-engineered particles

Also Published As

Publication number Publication date
US3796782A (en) 1974-03-12
DE1789065B1 (de) 1972-05-31
FR1585544A (ja) 1970-01-23
GB1236967A (en) 1971-06-23
BE721804A (ja) 1969-04-03
SE340661B (ja) 1971-11-29
ES358760A1 (es) 1970-06-01
CH526845A (de) 1972-08-15
JPS4535147B1 (ja) 1970-11-10
NL6713531A (ja) 1969-04-09
BR6802820D0 (pt) 1973-01-04

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