DK1115087T3 - Fremgangsmåde til fremstilling af en transponderanordning - Google Patents

Fremgangsmåde til fremstilling af en transponderanordning

Info

Publication number
DK1115087T3
DK1115087T3 DK00127594T DK00127594T DK1115087T3 DK 1115087 T3 DK1115087 T3 DK 1115087T3 DK 00127594 T DK00127594 T DK 00127594T DK 00127594 T DK00127594 T DK 00127594T DK 1115087 T3 DK1115087 T3 DK 1115087T3
Authority
DK
Denmark
Prior art keywords
manufacturing
transponder
mold
transponder device
switching circuit
Prior art date
Application number
DK00127594T
Other languages
English (en)
Inventor
Holm Dr Baeger
Original Assignee
Aeg Identifikationssys Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aeg Identifikationssys Gmbh filed Critical Aeg Identifikationssys Gmbh
Application granted granted Critical
Publication of DK1115087T3 publication Critical patent/DK1115087T3/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456—Antennas, e.g. radomes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Radio Relay Systems (AREA)
  • Burglar Alarm Systems (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
DK00127594T 1999-12-21 2000-12-15 Fremgangsmåde til fremstilling af en transponderanordning DK1115087T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19962077A DE19962077A1 (de) 1999-12-21 1999-12-21 Verfahren zur Herstellung einer Transponderanordnung

Publications (1)

Publication Number Publication Date
DK1115087T3 true DK1115087T3 (da) 2009-02-02

Family

ID=7933858

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00127594T DK1115087T3 (da) 1999-12-21 2000-12-15 Fremgangsmåde til fremstilling af en transponderanordning

Country Status (6)

Country Link
EP (1) EP1115087B1 (da)
AT (1) ATE413665T1 (da)
DE (2) DE19962077A1 (da)
DK (1) DK1115087T3 (da)
ES (1) ES2316334T3 (da)
PT (1) PT1115087E (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10328836A1 (de) 2003-06-26 2005-01-13 Schoeller Wavin Systems Services Gmbh Verfahren zum Herstellen eines Behälters mit einem Datenträger und Behälter mit einem Datenträger
US8191865B2 (en) 2004-05-17 2012-06-05 Stertil B.V. Device and system for lifting a motor vehicle
AT506069B1 (de) * 2008-07-02 2009-06-15 Engel Austria Gmbh Spritzgiesseinrichtung mit einer öffen- und schliessbaren form
FR3059592A1 (fr) * 2016-12-05 2018-06-08 Compagnie Generale Des Etablissements Michelin Procede de fabrication d'un patch equipe d'un transpondeur radiofrequence et pneumatique comportant un tel patch
DE102020122072A1 (de) * 2020-08-24 2022-02-24 Neosid Pemetzrieder Gmbh & Co. Kg Transponderkappe

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8909783U1 (da) * 1989-08-16 1990-09-13 Pepperl & Fuchs Gmbh, 6800 Mannheim, De
FR2721733B1 (fr) * 1994-06-22 1996-08-23 Gemplus Card Int Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé.
FR2723228B1 (fr) * 1994-07-26 1996-09-20 Bourgogne Grasset Jeton de jeu perfectionne
FR2739587B1 (fr) * 1995-10-09 1997-11-07 Bourgogne Grasset Jeton de jeu
DE19600481A1 (de) * 1996-01-09 1997-07-10 Orga Kartensysteme Gmbh Chipkarte
DE69812919T2 (de) * 1997-03-10 2003-11-13 Bourgogne Et Grasset Savigny L Marke mit elektronischen chip
DE19710656A1 (de) * 1997-03-14 1998-09-17 Fd Fleischhauer Datentraeger U Chipkarte
US6299070B1 (en) * 1998-03-31 2001-10-09 Omron Corporation Data carrier and a production method for the same
FR2777675B1 (fr) * 1998-04-15 2001-12-07 Rue Cartes Et Systemes De Procede de fabrication d'une carte a microcircuit et carte a microcircuit obtenue par mise en oeuvre de ce procede
DE19854986A1 (de) * 1998-11-27 2000-05-31 Giesecke & Devrient Gmbh Verfahren zur Herstellung ein- oder mehrschichtiger Karten mit in geschäumtem Kunststoff eingebetteten elektronischen Bauelementen

Also Published As

Publication number Publication date
DE19962077A1 (de) 2001-06-28
PT1115087E (pt) 2008-12-22
ATE413665T1 (de) 2008-11-15
EP1115087A2 (de) 2001-07-11
EP1115087A3 (de) 2002-09-04
ES2316334T3 (es) 2009-04-16
EP1115087B1 (de) 2008-11-05
DE50015439D1 (de) 2008-12-18

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