DK1115087T3 - Process for manufacturing a transponder device - Google Patents

Process for manufacturing a transponder device

Info

Publication number
DK1115087T3
DK1115087T3 DK00127594T DK00127594T DK1115087T3 DK 1115087 T3 DK1115087 T3 DK 1115087T3 DK 00127594 T DK00127594 T DK 00127594T DK 00127594 T DK00127594 T DK 00127594T DK 1115087 T3 DK1115087 T3 DK 1115087T3
Authority
DK
Denmark
Prior art keywords
manufacturing
transponder
mold
transponder device
switching circuit
Prior art date
Application number
DK00127594T
Other languages
Danish (da)
Inventor
Holm Dr Baeger
Original Assignee
Aeg Identifikationssys Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aeg Identifikationssys Gmbh filed Critical Aeg Identifikationssys Gmbh
Application granted granted Critical
Publication of DK1115087T3 publication Critical patent/DK1115087T3/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • B29C45/1671Making multilayered or multicoloured articles with an insert
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456Antennas, e.g. radomes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Burglar Alarm Systems (AREA)
  • Radio Relay Systems (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

The method for producing a transponder unit involves production of a carrier element with seatings (KA) and (SA) respectively for the switching circuit and the transponder coil, insertion of these items, positioning of the resultant assembly into a mold, and filling the free space in the mold with a casting material. Also claimed is a carrier element capable of accommodating a switching circuit and a transponder coil.
DK00127594T 1999-12-21 2000-12-15 Process for manufacturing a transponder device DK1115087T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19962077A DE19962077A1 (en) 1999-12-21 1999-12-21 Method for producing a transponder arrangement

Publications (1)

Publication Number Publication Date
DK1115087T3 true DK1115087T3 (en) 2009-02-02

Family

ID=7933858

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00127594T DK1115087T3 (en) 1999-12-21 2000-12-15 Process for manufacturing a transponder device

Country Status (6)

Country Link
EP (1) EP1115087B1 (en)
AT (1) ATE413665T1 (en)
DE (2) DE19962077A1 (en)
DK (1) DK1115087T3 (en)
ES (1) ES2316334T3 (en)
PT (1) PT1115087E (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10328836A1 (en) 2003-06-26 2005-01-13 Schoeller Wavin Systems Services Gmbh Method for producing a container with a data carrier and container with a data carrier
CA2875383C (en) 2004-05-17 2016-08-02 Stertil B.V. Device and system for lifting a motor vehicle
AT506069B1 (en) * 2008-07-02 2009-06-15 Engel Austria Gmbh INJECTION MOLDING DEVICE WITH OPEN AND LOCKABLE FORM
FR3059592A1 (en) * 2016-12-05 2018-06-08 Compagnie Generale Des Etablissements Michelin METHOD FOR MANUFACTURING A PATCH EQUIPPED WITH A RADIOFREQUENCY AND PNEUMATIC TRANSPONDER COMPRISING SUCH A PATCH
DE102020122072A1 (en) * 2020-08-24 2022-02-24 Neosid Pemetzrieder Gmbh & Co. Kg transponder cap

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8909783U1 (en) * 1989-08-16 1990-09-13 Pepperl & Fuchs Gmbh, 6800 Mannheim, De
FR2721733B1 (en) * 1994-06-22 1996-08-23 Gemplus Card Int Method for manufacturing a contactless card by overmolding and contactless card obtained by such a method.
FR2723228B1 (en) * 1994-07-26 1996-09-20 Bourgogne Grasset IMPROVED GAME TOKEN
FR2739587B1 (en) * 1995-10-09 1997-11-07 Bourgogne Grasset GAME TOKEN
DE19600481A1 (en) * 1996-01-09 1997-07-10 Orga Kartensysteme Gmbh Chip- or intelligent-card design
WO1998039989A1 (en) * 1997-03-10 1998-09-17 Etablissements Bourgogne Et Grasset Token with electronic chip
DE19710656A1 (en) * 1997-03-14 1998-09-17 Fd Fleischhauer Datentraeger U Contactless smart card has core sheet stamped out
EP0947952B1 (en) * 1998-03-31 2005-08-17 Omron Corporation A data carrier and a production method for the same
FR2777675B1 (en) * 1998-04-15 2001-12-07 Rue Cartes Et Systemes De METHOD OF MANUFACTURING A MICROCIRCUIT CARD AND A MICROCIRCUIT CARD OBTAINED BY IMPLEMENTATION OF THIS PROCESS
DE19854986A1 (en) * 1998-11-27 2000-05-31 Giesecke & Devrient Gmbh Process for the production of single or multi-layer cards with electronic components embedded in foamed plastic

Also Published As

Publication number Publication date
EP1115087A3 (en) 2002-09-04
DE50015439D1 (en) 2008-12-18
DE19962077A1 (en) 2001-06-28
EP1115087A2 (en) 2001-07-11
ES2316334T3 (en) 2009-04-16
ATE413665T1 (en) 2008-11-15
EP1115087B1 (en) 2008-11-05
PT1115087E (en) 2008-12-22

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