DK0641469T3 - Fremgangsmåde til fremstilling af et kort omfattende mindst et elektronisk element - Google Patents

Fremgangsmåde til fremstilling af et kort omfattende mindst et elektronisk element

Info

Publication number
DK0641469T3
DK0641469T3 DK94908246T DK94908246T DK0641469T3 DK 0641469 T3 DK0641469 T3 DK 0641469T3 DK 94908246 T DK94908246 T DK 94908246T DK 94908246 T DK94908246 T DK 94908246T DK 0641469 T3 DK0641469 T3 DK 0641469T3
Authority
DK
Denmark
Prior art keywords
card
producing
coil
electronic component
electronic element
Prior art date
Application number
DK94908246T
Other languages
Danish (da)
English (en)
Inventor
Fran Ois Droz
Francois Droz
Original Assignee
Fran Ois Droz
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25685741&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK0641469(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fran Ois Droz, Nagraid Sa filed Critical Fran Ois Droz
Application granted granted Critical
Publication of DK0641469T3 publication Critical patent/DK0641469T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2429/00—Carriers for sound or information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
DK94908246T 1993-03-17 1994-03-14 Fremgangsmåde til fremstilling af et kort omfattende mindst et elektronisk element DK0641469T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH00804/93A CH688696A5 (fr) 1993-03-17 1993-03-17 Procédé de fabrication d'une carte comprenant au moins un élément électronique.
FR9303822A FR2703490B1 (fr) 1993-03-17 1993-03-30 Procédé de fabrication d'une carte comprenant au moins un élément électronique.
PCT/CH1994/000056 WO1994022111A1 (fr) 1993-03-17 1994-03-14 Procede de fabrication d'une carte comprenant au moins un element electronique

Publications (1)

Publication Number Publication Date
DK0641469T3 true DK0641469T3 (da) 1999-07-19

Family

ID=25685741

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94908246T DK0641469T3 (da) 1993-03-17 1994-03-14 Fremgangsmåde til fremstilling af et kort omfattende mindst et elektronisk element

Country Status (10)

Country Link
EP (1) EP0641469B1 (xx)
AT (1) ATE173105T1 (xx)
AU (1) AU6153594A (xx)
CH (1) CH688696A5 (xx)
DE (1) DE69414331T2 (xx)
DK (1) DK0641469T3 (xx)
ES (1) ES2126098T3 (xx)
FR (1) FR2703490B1 (xx)
HK (1) HK1012746A1 (xx)
WO (1) WO1994022111A1 (xx)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716555B1 (fr) * 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE19509233A1 (de) * 1995-03-19 1996-09-26 Melzer Maschinenbau Gmbh Verfahren zum Herstellen von Elektronik-Komponenten enthaltenden Kunststoffkarten
DE19525933C5 (de) * 1995-07-17 2004-02-19 Finn, David Verfahren und Vorrichtung zur Einbettung einer Spule in das Trägersubstrat einer IC-Karte
FR2744819B1 (fr) * 1996-02-09 1998-08-21 Solaic Sa Carte a circuit integre sans contact, procede et outillage pour la fabrication d'une telle carte
DE19843425A1 (de) * 1998-09-22 2000-03-23 Kunz Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
DE10006515C5 (de) * 2000-02-15 2004-09-16 Datacard Corp., Minnetonka Verfahren zum Einbau von Chips in Kartenkörper

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
JPS60227406A (ja) * 1984-04-25 1985-11-12 Nippon Lsi Kaade Kk 電子または電気回路の接続装置
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Ｉｃカードの製造方法

Also Published As

Publication number Publication date
AU6153594A (en) 1994-10-11
EP0641469B1 (fr) 1998-11-04
EP0641469A1 (fr) 1995-03-08
FR2703490B1 (fr) 1995-05-19
WO1994022111A1 (fr) 1994-09-29
DE69414331D1 (de) 1998-12-10
CH688696A5 (fr) 1998-01-15
ATE173105T1 (de) 1998-11-15
FR2703490A1 (fr) 1994-10-07
DE69414331T2 (de) 1999-06-17
HK1012746A1 (en) 1999-08-06
ES2126098T3 (es) 1999-03-16

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Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment