DK0641469T3 - A method of producing a card comprising at least one electronic element - Google Patents

A method of producing a card comprising at least one electronic element

Info

Publication number
DK0641469T3
DK0641469T3 DK94908246T DK94908246T DK0641469T3 DK 0641469 T3 DK0641469 T3 DK 0641469T3 DK 94908246 T DK94908246 T DK 94908246T DK 94908246 T DK94908246 T DK 94908246T DK 0641469 T3 DK0641469 T3 DK 0641469T3
Authority
DK
Denmark
Prior art keywords
card
producing
coil
electronic component
electronic element
Prior art date
Application number
DK94908246T
Other languages
Danish (da)
Inventor
Fran Ois Droz
Francois Droz
Original Assignee
Fran Ois Droz
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25685741&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK0641469(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fran Ois Droz, Nagraid Sa filed Critical Fran Ois Droz
Application granted granted Critical
Publication of DK0641469T3 publication Critical patent/DK0641469T3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2429/00—Carriers for sound or information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

A method for producing a card including at least one electronic component (14), particularly a card having no external contacts and further including a coil (16). According to the method, a structure (10) made of meltable material for positioning the electronic component (14) and the coil (16) is arranged on a work surface (2). By supplying energy, the structure (10) is at least partially melted and pressure is exerted on said melted structure to form a mass in which the electronic component (14) and the coil (16) are embedded.
DK94908246T 1993-03-17 1994-03-14 A method of producing a card comprising at least one electronic element DK0641469T3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH00804/93A CH688696A5 (en) 1993-03-17 1993-03-17 Card with electronic component and coil mfr. for use as bank card, access card
FR9303822A FR2703490B1 (en) 1993-03-17 1993-03-30 Method for manufacturing a card comprising at least one electronic element.
PCT/CH1994/000056 WO1994022111A1 (en) 1993-03-17 1994-03-14 Method for producing a card with at least one electronic component

Publications (1)

Publication Number Publication Date
DK0641469T3 true DK0641469T3 (en) 1999-07-19

Family

ID=25685741

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94908246T DK0641469T3 (en) 1993-03-17 1994-03-14 A method of producing a card comprising at least one electronic element

Country Status (10)

Country Link
EP (1) EP0641469B1 (en)
AT (1) ATE173105T1 (en)
AU (1) AU6153594A (en)
CH (1) CH688696A5 (en)
DE (1) DE69414331T2 (en)
DK (1) DK0641469T3 (en)
ES (1) ES2126098T3 (en)
FR (1) FR2703490B1 (en)
HK (1) HK1012746A1 (en)
WO (1) WO1994022111A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716555B1 (en) * 1994-02-24 1996-05-15 Gemplus Card Int Method of manufacturing a contactless card.
DE19509233A1 (en) * 1995-03-19 1996-09-26 Melzer Maschinenbau Gmbh Process for the production of plastic cards containing electronic components
DE19525933C5 (en) * 1995-07-17 2004-02-19 Finn, David Method and device for embedding a coil in the carrier substrate of an IC card
FR2744819B1 (en) * 1996-02-09 1998-08-21 Solaic Sa CONTACTLESS INTEGRATED CIRCUIT CARD, METHOD AND TOOLS FOR MANUFACTURING SUCH A CARD
DE19843425A1 (en) * 1998-09-22 2000-03-23 Kunz Gmbh Method for producing a contactless chip card
DE10006515C5 (en) * 2000-02-15 2004-09-16 Datacard Corp., Minnetonka Method for installing chips in card bodies

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029939A1 (en) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München ID CARD WITH IC COMPONENT AND METHOD FOR THEIR PRODUCTION
JPS60227406A (en) * 1984-04-25 1985-11-12 Nippon Lsi Kaade Kk Connecting device for electronic or electric circuit
FR2579799B1 (en) * 1985-03-28 1990-06-22 Flonic Sa METHOD FOR MANUFACTURING ELECTRONIC MEMORY CARDS AND CARDS OBTAINED ACCORDING TO SAID METHOD
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
JP2687661B2 (en) * 1990-03-26 1997-12-08 三菱電機株式会社 IC card manufacturing method

Also Published As

Publication number Publication date
FR2703490A1 (en) 1994-10-07
DE69414331T2 (en) 1999-06-17
WO1994022111A1 (en) 1994-09-29
EP0641469B1 (en) 1998-11-04
HK1012746A1 (en) 1999-08-06
ES2126098T3 (en) 1999-03-16
EP0641469A1 (en) 1995-03-08
AU6153594A (en) 1994-10-11
FR2703490B1 (en) 1995-05-19
ATE173105T1 (en) 1998-11-15
DE69414331D1 (en) 1998-12-10
CH688696A5 (en) 1998-01-15

Similar Documents

Publication Publication Date Title
NO943979L (en) Electronic element card, and its manufacture
MY109784A (en) Card comprising at least one electronic element and method of manufacture of such a card.
ATE49826T1 (en) ACTUATOR WITH SHAPE MEMORY EFFECT.
EP0122619A3 (en) Composite product having patterned metal layer and process
HK54095A (en) Data carrier with integrated circuit and method of producing such a carrier.
DE59905982D1 (en) Highly filled plastic part
CA2125742A1 (en) Process for Producing a Casing Providing a Screen Against Electromagnetic Radiation
DK0641469T3 (en) A method of producing a card comprising at least one electronic element
MXPA04004816A (en) Method for making a module comprising at least an electronic component.
DK0660003T3 (en) Method of manufacturing a playback sleeve on a playback device
BR9910717A (en) Method of manufacturing an integrated circuit card and obtained card
DE3584472D1 (en) CONTROL CIRCUIT FOR A BISTABLE ELECTROMAGNET.
IT8521909A0 (en) PROCEDURE AND DEVICE FOR PRODUCING COLUMNS, SUBSTANTIALLY CYLINDRICAL AND COLUMNS PRODUCED ACCORDING TO THE SAID PROCEDURE.
FR2575335B1 (en) CAPACITIVE ELEMENT INTEGRATED ON AN INTEGRATED CIRCUIT PELLET, AND METHOD FOR PRODUCING THE CAPACITIVE ELEMENT
TW350898B (en) Sliding member and manufacture thereof
JPS6457629A (en) Semiconductor device
KR940010174A (en) Manufacturing method of laminate
DK0518964T3 (en) Process for producing an insulating layer, element for use in the method and method for producing the element
JPS5438336A (en) Bonding method
JPS52109675A (en) Method for assembling parts with each other which are punched by press working
JPS53100409A (en) Rectifier and its manufacturing method
JPS5341879A (en) Method of preventing scum from rising in press work
JPS53127073A (en) Method of forming sculpture-like article
JPS52100538A (en) Method of manufacturing decorative material
JPS57187943A (en) Sealing method of semiconductor element

Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment