DE9201546U1 - Device for coating printed circuit boards with solvent-free lacquer layers - Google Patents

Device for coating printed circuit boards with solvent-free lacquer layers

Info

Publication number
DE9201546U1
DE9201546U1 DE9201546U DE9201546U DE9201546U1 DE 9201546 U1 DE9201546 U1 DE 9201546U1 DE 9201546 U DE9201546 U DE 9201546U DE 9201546 U DE9201546 U DE 9201546U DE 9201546 U1 DE9201546 U1 DE 9201546U1
Authority
DE
Germany
Prior art keywords
solvent
circuit boards
printed circuit
heatable
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9201546U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE9201546U priority Critical patent/DE9201546U1/en
Publication of DE9201546U1 publication Critical patent/DE9201546U1/en
Priority to JP5506428A priority patent/JPH07502603A/en
Priority to AT93901735T priority patent/ATE123884T1/en
Priority to PCT/EP1993/000004 priority patent/WO1993014444A1/en
Priority to DE59300265T priority patent/DE59300265D1/en
Priority to US08/030,217 priority patent/US5336529A/en
Priority to EP93901735A priority patent/EP0620930B1/en
Priority to US08/204,648 priority patent/US5421884A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/007—Slide-hopper coaters, i.e. apparatus in which the liquid or other fluent material flows freely on an inclined surface before contacting the work
    • B05C5/008—Slide-hopper curtain coaters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/30—Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
    • B05D2401/30—Form of the coating product, e.g. solution, water dispersion, powders or the like the coating being applied in other forms than involving eliminable solvent, diluent or dispersant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0218—Pretreatment, e.g. heating the substrate
    • B05D3/0227—Pretreatment, e.g. heating the substrate with IR heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)

Description

-1-Hans-Jürgen Schäfer Ritterstraße 36 4060 Viersen 12-1-Hans-Jürgen Schäfer Ritterstrasse 36 4060 Viersen 12

BeschreibungDescription

Vorrichtung zur Beschichtung von .eiterplatten mit lösungsmittelfreien Lackschichten.Device for coating circuit boards with solvent-free layers of paint.

Der vorliegenden Erfindung liegt die Aufgabe zu Grunde,eine Vorrichtung verfügbar zu machen.mit der es möglich ist,im Vorhanggießverfahren Leiter platten mit lösungsmittelfreien Lachfilmen zu beschichten,ohne daß die Gefahr von Luftblasen- und Lösungsmitteleinschlüssen zwischen den Leitern mit geringem Abstand besteht.The present invention is based on the object of making a device available with which it is possible to coat circuit boards with solvent-free lacquer films using the curtain coating process without the risk of air bubbles and solvent inclusions between the conductors with a small gap.

Das Vorhanggießverfahren wurde in der Patentschrift US-PS 4230793 beschrieben. Zur Erzielung gleichmäßiger Lackschichten ist eine möglichst niedrige Lackviskosität erforderlich. Diese niedrige Viskosität führt jedoch dazu,daß der Lack von den Leiterkanten abläuft.( Kantenflucht) und somit eine ungenügende Kantenabdeckung erzielt wird . Dieses Problem wurde in der EP 0075537 beschrieben und erfindungsgemäß durch zugabe von feinteiligem Füllstoff gelöst. Die erforderliche Viskosität wird erst bei Festkörperanteilen von 33-40% erzielt.The curtain coating process was described in the patent US-PS 4230793. To achieve uniform paint layers, the paint viscosity must be as low as possible. However, this low viscosity leads to the paint running off the edges of the conductors (edge drift) and thus insufficient edge coverage is achieved. This problem was described in EP 0075537 and solved according to the invention by adding finely divided filler. The required viscosity is only achieved with a solids content of 33-40%.

Diese hohen Lösungsmittelanteile machen eine sehr langsame und aufwendige Trocknung erforderlich.Es besteht insbesondere bei engen und hohen Leiterzügen die Gefahr von Luftblasen und Lösungsmitteleinschlüssen. Dieses Problem wird durch die erfindungsgemäße Vorrichtung gelöst.These high solvent contents make very slow and complex drying necessary. There is a risk of air bubbles and solvent inclusions, particularly in narrow and high conductor lines. This problem is solved by the device according to the invention.

Die Leiterplatten werden in einem Kühlspeicher vorgekühlt und dann mit erhitztem lösungsmittelfreiem Lack beschichtet. Die erfindungsgemäße Vorrichtung besitzt eine temperierbare Lackwanne(1) in die von unten Lack aus aus einem temperierten Vorratsgefäß (2) gepumpt wird. Dieser wird mit einer beheizbaren Walze ( 3) geschöpft und dann auf einem beheiztem Rakel ( 9 } von Lösungsmittel befreit. Durch parallel angebrachte Infrarotstrahler (4) wird restliches Lösungsmittel entfernt. Dieser Beschichtungseinheit ist ein Kühlspeicher (5) vorgeschaltet,der die Leiterplatten abkühlt. Das Lösungsmittel wird in einem Kühler (6)kondensiert und in den Vorratsbehälter (2) zurückgeführt.The circuit boards are pre-cooled in a cooling tank and then coated with heated solvent-free paint. The device according to the invention has a temperature-controlled paint tank (1) into which paint is pumped from below from a temperature-controlled storage container (2). This is scooped up with a heatable roller (3) and then freed of solvent on a heated doctor blade (9). Any remaining solvent is removed by infrared radiators (4) installed in parallel. A cooling tank (5) is connected upstream of this coating unit, which cools the circuit boards. The solvent is condensed in a cooler (6) and returned to the storage container (2).

Die gekühlten Leiterplatten werden mit einer Transporteinrichtung (7) unter dem Lackvorhang (8) hindurchgeführt und beschichtet.The cooled circuit boards are guided by a transport device (7) under the paint curtain (8) and coated.

HJSCHHJSCH

Claims (1)

Ansprüche:Expectations: Anspruch 1Claim 1 Vorrichtung zur Beschichtung von Leiterplatten mit lösungsmittelfreien Lackschichten dadurch gekennzeichnet,daß eine beheizbare Walze (3) mitDevice for coating printed circuit boards with solvent-free coating layers, characterized in that a heatable roller (3) with einem Durchmesser von vorzugsweise 15-25cm in einer rinnenförmigen beheizbaren Wanne (1) mit einem 3-5 cm größerem Durchmesser angeordnet ist,daß an der Walze (3) ein beheizbares Rakelblech (9) angebracht ist,über dem parallel hierzu Infrarotstrahler (4) angebracht sind. 10a diameter of preferably 15-25cm in a channel-shaped heatable trough (1) with a diameter 3-5cm larger, that a heatable doctor blade (9) is attached to the roller (3), above which infrared radiators (4) are attached parallel to it. 10 Anspruch 2Claim 2 Vorrichtung nach Anspruch 1 dadurch gekennzeichnet,daß der Beschichtungswalze(3) ein Kühlspeicher (5) vorgeschaltet ist.Device according to claim 1, characterized in that a cooling reservoir (5) is connected upstream of the coating roller (3). Anspruch 3Claim 3 Vorrichtung nach Anspruch 1 dadurch gekennzeichnet, daß die Lackwanne (1) eine Bodenöffnug besitzt.Device according to claim 1, characterized in that the paint tray (1) has a bottom opening. Anspruch 4Claim 4 Vorrichtung nach Anspruch 1 dadurch gekennzeichnet,daß auf der beheizbaren Walze (3) zwei breitenverstellbare Abstreifrakel(IO) angebracht sind.Device according to claim 1, characterized in that two width-adjustable scraper blades (IO) are mounted on the heatable roller (3). Anspruch 5Claim 5 Vorrichtung nach Anspruch 1 dadurch gekennzeichnet,daß am Ende des Rakelbleches (9) zwei Infrarotstrahler^senkrecht angeordnet sind.Device according to claim 1, characterized in that two infrared radiators are arranged vertically at the end of the doctor blade (9). Anspruch 6Claim 6 Vorrichtung nach Anspruch 1 dadurch gekennzeichnet, daß unterhalb der Infrarotstrahler (4) über dem Transportband(7) Fotozellen angebracht sind.Device according to claim 1, characterized in that photocells are mounted below the infrared radiators (4) above the conveyor belt (7). HJSCHHJSCH
DE9201546U 1992-01-07 1992-02-08 Device for coating printed circuit boards with solvent-free lacquer layers Expired - Lifetime DE9201546U1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE9201546U DE9201546U1 (en) 1992-02-08 1992-02-08 Device for coating printed circuit boards with solvent-free lacquer layers
JP5506428A JPH07502603A (en) 1992-01-07 1993-01-04 Method and apparatus for coating printed wiring boards
AT93901735T ATE123884T1 (en) 1992-01-07 1993-01-04 METHOD AND DEVICE FOR COATING CIRCUIT BOARDS.
PCT/EP1993/000004 WO1993014444A1 (en) 1992-01-07 1993-01-04 Method and device for coating circuit boards
DE59300265T DE59300265D1 (en) 1992-01-07 1993-01-04 METHOD AND DEVICE FOR COATING PCBS.
US08/030,217 US5336529A (en) 1992-01-07 1993-01-04 Method for coating circuitboards
EP93901735A EP0620930B1 (en) 1992-01-07 1993-01-04 Method and device for coating circuit boards
US08/204,648 US5421884A (en) 1992-01-07 1994-03-01 Apparatus for coating circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9201546U DE9201546U1 (en) 1992-02-08 1992-02-08 Device for coating printed circuit boards with solvent-free lacquer layers

Publications (1)

Publication Number Publication Date
DE9201546U1 true DE9201546U1 (en) 1992-05-21

Family

ID=6875889

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9201546U Expired - Lifetime DE9201546U1 (en) 1992-01-07 1992-02-08 Device for coating printed circuit boards with solvent-free lacquer layers

Country Status (1)

Country Link
DE (1) DE9201546U1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993014444A1 (en) * 1992-01-07 1993-07-22 Rütgerswerke Aktiengesellschaft Method and device for coating circuit boards
WO1994027189A1 (en) * 1993-05-12 1994-11-24 Ciba-Geigy Ag Process and device for coating printed circuit boards
DE4436266A1 (en) * 1994-10-11 1996-04-18 Kuesters Eduard Maschf Device for applying a fluid treatment or patterning agent
US5843621A (en) * 1993-05-12 1998-12-01 Ciba-Geigy Ag Process and apparatus for coating printed circuit boards

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1225846B (en) * 1956-01-16 1966-09-29 Scherer Corp R P Slot caster for producing films from gelatine or the like.
DE1546903A1 (en) * 1961-10-26 1969-12-18 Eastman Kodak Co Slot caster
DE1928031B2 (en) * 1968-06-03 1972-10-12 Eastman Kodak Co., Rochester, N.Y. (V.St.A.) Method for coating an object, in particular a strip, and device for carrying out the method
DE2361517A1 (en) * 1973-12-11 1975-06-12 Kuesters Eduard METHOD AND DEVICE FOR SAMPLEING A SAMPLE GOODS CONTINUOUSLY IN A LINE
DE2114309C3 (en) * 1971-03-24 1976-11-04 Textilausrüstungs-Gesellschaft Schroers & Co, 4150 Krefeld Device for the continuous application of liquids to webs
US4170958A (en) * 1977-09-29 1979-10-16 Eduard Kusters Device for applying designs
DE3026793A1 (en) * 1980-07-15 1982-02-25 Iwata Air Compressor Manufacturing Co. Ltd., Tokyo Flow method item painting system - has discharge conveyor at lower level at paint head to form step
DE3133165A1 (en) * 1980-08-22 1982-04-22 Fuji Photo Film Co., Ltd., Minami-Ashigara, Kanagawa METHOD FOR PRODUCING A PRINT-SENSITIVE RECORDING FILM
AT367943B (en) * 1977-11-21 1982-08-10 Ciba Geigy Ag METHOD FOR PRODUCING SOLDER STOP MASKS ON PRINTED CIRCUITS
DE3241831A1 (en) * 1982-11-12 1984-05-17 Agfa-Gevaert Ag, 5090 Leverkusen Process and apparatus for producing the width or strip width of coatings on lengths of material
DE3300150A1 (en) * 1983-01-04 1984-07-05 Agfa-Gevaert Ag, 5090 Leverkusen METHOD AND DEVICE FOR STABILIZING FREE-FALLING LIQUID CURTAINS
DE3339780A1 (en) * 1983-11-03 1985-05-15 Sandy Hill Corp., Hudson Falls, N.Y. Apparatus for the application of a controllable layer of a saturation or coating medium by means of a free-falling curtain, and process therefor
DE3424884C1 (en) * 1984-07-06 1986-02-20 Du Pont de Nemours (Deutschland) GmbH, 4000 Düsseldorf Device for applying at least one pouring layer and method for operating this device
DE3815159A1 (en) * 1988-03-09 1989-09-21 Rido Richard Dohse & Sohn Apparatus for applying premelted polyurethane adhesives

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1225846B (en) * 1956-01-16 1966-09-29 Scherer Corp R P Slot caster for producing films from gelatine or the like.
DE1546903A1 (en) * 1961-10-26 1969-12-18 Eastman Kodak Co Slot caster
DE1928031B2 (en) * 1968-06-03 1972-10-12 Eastman Kodak Co., Rochester, N.Y. (V.St.A.) Method for coating an object, in particular a strip, and device for carrying out the method
DE2114309C3 (en) * 1971-03-24 1976-11-04 Textilausrüstungs-Gesellschaft Schroers & Co, 4150 Krefeld Device for the continuous application of liquids to webs
DE2361517A1 (en) * 1973-12-11 1975-06-12 Kuesters Eduard METHOD AND DEVICE FOR SAMPLEING A SAMPLE GOODS CONTINUOUSLY IN A LINE
US4170958A (en) * 1977-09-29 1979-10-16 Eduard Kusters Device for applying designs
AT367943B (en) * 1977-11-21 1982-08-10 Ciba Geigy Ag METHOD FOR PRODUCING SOLDER STOP MASKS ON PRINTED CIRCUITS
DE3026793A1 (en) * 1980-07-15 1982-02-25 Iwata Air Compressor Manufacturing Co. Ltd., Tokyo Flow method item painting system - has discharge conveyor at lower level at paint head to form step
DE3133165A1 (en) * 1980-08-22 1982-04-22 Fuji Photo Film Co., Ltd., Minami-Ashigara, Kanagawa METHOD FOR PRODUCING A PRINT-SENSITIVE RECORDING FILM
DE3241831A1 (en) * 1982-11-12 1984-05-17 Agfa-Gevaert Ag, 5090 Leverkusen Process and apparatus for producing the width or strip width of coatings on lengths of material
DE3300150A1 (en) * 1983-01-04 1984-07-05 Agfa-Gevaert Ag, 5090 Leverkusen METHOD AND DEVICE FOR STABILIZING FREE-FALLING LIQUID CURTAINS
DE3339780A1 (en) * 1983-11-03 1985-05-15 Sandy Hill Corp., Hudson Falls, N.Y. Apparatus for the application of a controllable layer of a saturation or coating medium by means of a free-falling curtain, and process therefor
DE3424884C1 (en) * 1984-07-06 1986-02-20 Du Pont de Nemours (Deutschland) GmbH, 4000 Düsseldorf Device for applying at least one pouring layer and method for operating this device
DE3815159A1 (en) * 1988-03-09 1989-09-21 Rido Richard Dohse & Sohn Apparatus for applying premelted polyurethane adhesives

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
63-158157 A. C-543, Nov.15,1988, Vol.12,No.433 *
Patents Abstracts of Japan: 62-110775 A. C-454, Oct.23,1987, Vol.11,No.326 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993014444A1 (en) * 1992-01-07 1993-07-22 Rütgerswerke Aktiengesellschaft Method and device for coating circuit boards
WO1994027189A1 (en) * 1993-05-12 1994-11-24 Ciba-Geigy Ag Process and device for coating printed circuit boards
US5843621A (en) * 1993-05-12 1998-12-01 Ciba-Geigy Ag Process and apparatus for coating printed circuit boards
DE4436266A1 (en) * 1994-10-11 1996-04-18 Kuesters Eduard Maschf Device for applying a fluid treatment or patterning agent
US6071342A (en) * 1994-10-11 2000-06-06 Eduard Kusters Maschinenfabrik Gmbh & Co. Kg Device for applying a fluid treatment or decoration agent

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