DE9113601U1 - - Google Patents

Info

Publication number
DE9113601U1
DE9113601U1 DE9113601U DE9113601U DE9113601U1 DE 9113601 U1 DE9113601 U1 DE 9113601U1 DE 9113601 U DE9113601 U DE 9113601U DE 9113601 U DE9113601 U DE 9113601U DE 9113601 U1 DE9113601 U1 DE 9113601U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9113601U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TELBUS GESELLSCHAFT fur ELEKTRONISCHE KOMMUNIKATIONS-SYSTEME MBH 8057 ECHING DE
Original Assignee
TELBUS GESELLSCHAFT fur ELEKTRONISCHE KOMMUNIKATIONS-SYSTEME MBH 8057 ECHING DE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TELBUS GESELLSCHAFT fur ELEKTRONISCHE KOMMUNIKATIONS-SYSTEME MBH 8057 ECHING DE filed Critical TELBUS GESELLSCHAFT fur ELEKTRONISCHE KOMMUNIKATIONS-SYSTEME MBH 8057 ECHING DE
Priority to DE9113601U priority Critical patent/DE9113601U1/de
Publication of DE9113601U1 publication Critical patent/DE9113601U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
DE9113601U 1991-10-31 1991-10-31 Expired - Lifetime DE9113601U1 (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9113601U DE9113601U1 (sv) 1991-10-31 1991-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9113601U DE9113601U1 (sv) 1991-10-31 1991-10-31

Publications (1)

Publication Number Publication Date
DE9113601U1 true DE9113601U1 (sv) 1993-03-04

Family

ID=6872842

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9113601U Expired - Lifetime DE9113601U1 (sv) 1991-10-31 1991-10-31

Country Status (1)

Country Link
DE (1) DE9113601U1 (sv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29516811U1 (de) * 1995-10-25 1995-12-21 Hornig Wolfgang Dr Ing Chipkarten aus Metall

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3124332A1 (de) * 1980-07-09 1982-06-03 Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven "tragbares, aus mehreren schichten aufgebautes ausweiselement"
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
US4552383A (en) * 1981-12-24 1985-11-12 Gao Gesellschaft Fur Automation Und Organisation Mbh Identification card having an IC module
DE2659573C2 (de) * 1975-12-31 1986-02-27 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull, Paris Karte nach Art einer genormten Kreditkarte zur Verarbeitung von elektrischen Signalen und Verfahren zur Herstellung der Karte
DE3535791A1 (de) * 1984-11-05 1986-05-07 Casio Computer Co., Ltd., Tokio/Tokyo Karte mit eingebautem chip
FR2586886A1 (fr) * 1985-08-09 1987-03-06 Sharp Kk Dispositif electronique mince du type carte.
FR2599893A1 (fr) * 1986-05-23 1987-12-11 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
DE3633257A1 (de) * 1986-09-30 1988-05-05 Wilde Membran Impuls Tech Metallisiertes, textiles flaechengebilde als schirmschutz gegen elektromagnetische strahlung und brandschutz bei gegenstaenden, insbesondere elektrischen und elektronischen geraeten und bauteilen sowie raeumen
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
EP0312067A2 (en) * 1987-10-16 1989-04-19 Sumitomo Metal Industries, Ltd. Metal case for housing an IC and a manufacturing method therefor
EP0317201A2 (en) * 1987-11-14 1989-05-24 Kabushiki Kaisha Toshiba Portable storage medium
DE3118298C2 (sv) * 1981-05-08 1989-09-28 Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen, De
EP0391790A1 (fr) * 1989-04-07 1990-10-10 STMicroelectronics S.A. Procédé de fabrication d'un module électronique
US5005106A (en) * 1988-12-08 1991-04-02 E. I. Du Pont De Nemours And Company Multifunctional card having an electromagnetic wave protection
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
DE4109959A1 (de) * 1990-03-26 1991-10-02 Mitsubishi Electric Corp Verfahren zur herstellung einer ic-karte

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2659573C2 (de) * 1975-12-31 1986-02-27 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull, Paris Karte nach Art einer genormten Kreditkarte zur Verarbeitung von elektrischen Signalen und Verfahren zur Herstellung der Karte
DE3124332A1 (de) * 1980-07-09 1982-06-03 Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven "tragbares, aus mehreren schichten aufgebautes ausweiselement"
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3118298C2 (sv) * 1981-05-08 1989-09-28 Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen, De
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"
US4552383A (en) * 1981-12-24 1985-11-12 Gao Gesellschaft Fur Automation Und Organisation Mbh Identification card having an IC module
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
DE3535791A1 (de) * 1984-11-05 1986-05-07 Casio Computer Co., Ltd., Tokio/Tokyo Karte mit eingebautem chip
FR2586886A1 (fr) * 1985-08-09 1987-03-06 Sharp Kk Dispositif electronique mince du type carte.
FR2599893A1 (fr) * 1986-05-23 1987-12-11 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
DE3633257A1 (de) * 1986-09-30 1988-05-05 Wilde Membran Impuls Tech Metallisiertes, textiles flaechengebilde als schirmschutz gegen elektromagnetische strahlung und brandschutz bei gegenstaenden, insbesondere elektrischen und elektronischen geraeten und bauteilen sowie raeumen
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
EP0312067A2 (en) * 1987-10-16 1989-04-19 Sumitomo Metal Industries, Ltd. Metal case for housing an IC and a manufacturing method therefor
EP0317201A2 (en) * 1987-11-14 1989-05-24 Kabushiki Kaisha Toshiba Portable storage medium
US5005106A (en) * 1988-12-08 1991-04-02 E. I. Du Pont De Nemours And Company Multifunctional card having an electromagnetic wave protection
EP0391790A1 (fr) * 1989-04-07 1990-10-10 STMicroelectronics S.A. Procédé de fabrication d'un module électronique
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
DE4109959A1 (de) * 1990-03-26 1991-10-02 Mitsubishi Electric Corp Verfahren zur herstellung einer ic-karte

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
2-30597 A., M-960, Vol.14, No.177 *
JP Patents Abstracts of Japan: 2-92597 A., M-989, June 22, 1990, Vol.14, No.291 *
RIGID DISH SMART CARD. In: IBM Technical Disclo- sure Bulletin, Vol.32, No.4A, Sept. 1989, S.431-432 *
STIFFEND CARD WITH INTEGRATED CIRCUIT. In: IBM Technical Disclosure Bulletin, Vol. 28, No.11, April 1986, S.4723-4725 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29516811U1 (de) * 1995-10-25 1995-12-21 Hornig Wolfgang Dr Ing Chipkarten aus Metall

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