DE8714814U1 - - Google Patents

Info

Publication number
DE8714814U1
DE8714814U1 DE8714814U DE8714814U DE8714814U1 DE 8714814 U1 DE8714814 U1 DE 8714814U1 DE 8714814 U DE8714814 U DE 8714814U DE 8714814 U DE8714814 U DE 8714814U DE 8714814 U1 DE8714814 U1 DE 8714814U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8714814U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
J Muehlbauer 8495 Roding De GmbH
Original Assignee
J Muehlbauer 8495 Roding De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by J Muehlbauer 8495 Roding De GmbH filed Critical J Muehlbauer 8495 Roding De GmbH
Priority to DE8714814U priority Critical patent/DE8714814U1/de
Publication of DE8714814U1 publication Critical patent/DE8714814U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
DE8714814U 1987-11-06 1987-11-06 Expired DE8714814U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8714814U DE8714814U1 (en) 1987-11-06 1987-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8714814U DE8714814U1 (en) 1987-11-06 1987-11-06

Publications (1)

Publication Number Publication Date
DE8714814U1 true DE8714814U1 (en) 1989-03-09

Family

ID=6813852

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8714814U Expired DE8714814U1 (en) 1987-11-06 1987-11-06

Country Status (1)

Country Link
DE (1) DE8714814U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10394243B4 (en) * 2003-06-02 2015-10-29 Amicra Microtechnologies Gmbh Bonding device and bonding method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337303B2 (en) * 1972-07-26 1975-05-15 Hitachi, Ltd., Tokio Automatic connection device, in particular for assembling semiconductor devices
DE2618715A1 (en) * 1976-04-28 1977-11-17 Eberle & Cie Gmbh J N Transmission with continuous speed variation for limited rotation - has two interlocking gear wheels whose radii vary continuously in spiral form
DE2148088C2 (en) * 1971-04-14 1984-07-12 John C. Sunnyvale Calif. Diepeveen Bonding device for bonding wires to semiconductor components
DE3447587A1 (en) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München MACHINE FOR FASTENING THE CONNECTING WIRE AT THE CONNECTION SITES OF A SEMICONDUCTOR COMPONENT AND THE SEMICONDUCTOR COMPONENT HOUSING
DE3616343A1 (en) * 1985-05-17 1986-11-20 Mitsubishi Denki K.K., Tokio/Tokyo TRANSLATION GEARBOX

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2148088C2 (en) * 1971-04-14 1984-07-12 John C. Sunnyvale Calif. Diepeveen Bonding device for bonding wires to semiconductor components
DE2337303B2 (en) * 1972-07-26 1975-05-15 Hitachi, Ltd., Tokio Automatic connection device, in particular for assembling semiconductor devices
DE2618715A1 (en) * 1976-04-28 1977-11-17 Eberle & Cie Gmbh J N Transmission with continuous speed variation for limited rotation - has two interlocking gear wheels whose radii vary continuously in spiral form
DE3447587A1 (en) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München MACHINE FOR FASTENING THE CONNECTING WIRE AT THE CONNECTION SITES OF A SEMICONDUCTOR COMPONENT AND THE SEMICONDUCTOR COMPONENT HOUSING
DE3616343A1 (en) * 1985-05-17 1986-11-20 Mitsubishi Denki K.K., Tokio/Tokyo TRANSLATION GEARBOX

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10394243B4 (en) * 2003-06-02 2015-10-29 Amicra Microtechnologies Gmbh Bonding device and bonding method

Similar Documents

Publication Publication Date Title
DE8701766U1 (en)
DE8706196U1 (en)
DE8702756U1 (en)
DE8703340U1 (en)
DE8702526U1 (en)
DE8704894U1 (en)
DE8702763U1 (en)
DE8703060U1 (en)
DE8706101U1 (en)
DE8701413U1 (en)
DE8702823U1 (en)
DE8700161U1 (en)
DE8703191U1 (en)
DE8703740U1 (en)
DE8702421U1 (en)
DE8703139U1 (en)
DE8705198U1 (en)
DE8707147U1 (en)
DE8702738U1 (en)
DE8714814U1 (en)
DE8706560U1 (en)
DE8701032U1 (en)
DE8706726U1 (en)
DE8702130U1 (en)
DE8705534U1 (en)