DE8627860U1 - Verschraubung eines Leistungshalbleiters an einem Kühlkörper - Google Patents
Verschraubung eines Leistungshalbleiters an einem KühlkörperInfo
- Publication number
- DE8627860U1 DE8627860U1 DE19868627860 DE8627860U DE8627860U1 DE 8627860 U1 DE8627860 U1 DE 8627860U1 DE 19868627860 DE19868627860 DE 19868627860 DE 8627860 U DE8627860 U DE 8627860U DE 8627860 U1 DE8627860 U1 DE 8627860U1
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- power semiconductor
- screwing
- internal thread
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 29
- 238000001816 cooling Methods 0.000 claims 1
- 244000309464 bull Species 0.000 description 3
- 238000003908 quality control method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19868627860 DE8627860U1 (de) | 1986-10-18 | 1986-10-18 | Verschraubung eines Leistungshalbleiters an einem Kühlkörper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19868627860 DE8627860U1 (de) | 1986-10-18 | 1986-10-18 | Verschraubung eines Leistungshalbleiters an einem Kühlkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
DE8627860U1 true DE8627860U1 (de) | 1986-12-18 |
Family
ID=6799368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19868627860 Expired DE8627860U1 (de) | 1986-10-18 | 1986-10-18 | Verschraubung eines Leistungshalbleiters an einem Kühlkörper |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE8627860U1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994029901A1 (de) * | 1993-06-07 | 1994-12-22 | Melcher Ag | Befestigungsvorrichtung für halbleiter-schaltelemente |
FR2931523A1 (fr) * | 2008-05-21 | 2009-11-27 | Fagorbrandt Sas | Dispositif de fixation de composants et appareil electromenager associe |
-
1986
- 1986-10-18 DE DE19868627860 patent/DE8627860U1/de not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994029901A1 (de) * | 1993-06-07 | 1994-12-22 | Melcher Ag | Befestigungsvorrichtung für halbleiter-schaltelemente |
US5648889A (en) * | 1993-06-07 | 1997-07-15 | Melcher, Ag | Attachment device for semiconductor circuit elements |
FR2931523A1 (fr) * | 2008-05-21 | 2009-11-27 | Fagorbrandt Sas | Dispositif de fixation de composants et appareil electromenager associe |
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