DE8432775U1 - Vorrichtung zum Temperieren integrierter elektronischer Bauteile - Google Patents
Vorrichtung zum Temperieren integrierter elektronischer BauteileInfo
- Publication number
- DE8432775U1 DE8432775U1 DE19848432775 DE8432775U DE8432775U1 DE 8432775 U1 DE8432775 U1 DE 8432775U1 DE 19848432775 DE19848432775 DE 19848432775 DE 8432775 U DE8432775 U DE 8432775U DE 8432775 U1 DE8432775 U1 DE 8432775U1
- Authority
- DE
- Germany
- Prior art keywords
- rails
- components
- heat
- conducting medium
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005496 tempering Methods 0.000 title claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 6
- 239000011796 hollow space material Substances 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19848432775 DE8432775U1 (de) | 1984-11-09 | 1984-11-09 | Vorrichtung zum Temperieren integrierter elektronischer Bauteile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19848432775 DE8432775U1 (de) | 1984-11-09 | 1984-11-09 | Vorrichtung zum Temperieren integrierter elektronischer Bauteile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE8432775U1 true DE8432775U1 (de) | 1991-04-04 |
Family
ID=6772500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19848432775 Expired DE8432775U1 (de) | 1984-11-09 | 1984-11-09 | Vorrichtung zum Temperieren integrierter elektronischer Bauteile |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE8432775U1 (ru) |
-
1984
- 1984-11-09 DE DE19848432775 patent/DE8432775U1/de not_active Expired
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3850195T2 (de) | Aufschmelzofen. | |
| DE3441179C2 (de) | Temperiereinrichtung für Mikro-Küvettenanordnungen, insbesondere für Mikrotitrationsplatten | |
| DE3876988T2 (de) | Loetgeraet. | |
| DE3939858C2 (de) | Vorrichtung zur Kapillarelektrophorese | |
| DE3600396C2 (ru) | ||
| DE2356764B2 (de) | Heißkanal-Spritzgießwerkzeug mit mehreren Formhohlräumen | |
| DE3016702A1 (de) | Vorrichtung fuer angussfreies giessen unter druck von polymererzeugnissen | |
| DE20100840U1 (de) | Heißkanaldüse | |
| DE3124909A1 (de) | Duesendichtung fuer spritzgiessvorrichtungen | |
| DE2816014A1 (de) | Ventilnadel fuer spritzgiesswerkzeug | |
| DE2638535B2 (de) | Beheizte Heißkanaldüse für Kunststoff -Spritzgießmaschinen | |
| DE68912699T2 (de) | Lötvorrichtung eines Rückflusstyps. | |
| DE60029444T2 (de) | Spritzgiess-heizelement mit integriertem schmelze-kanal | |
| EP0820374B1 (de) | Heisskanal-spritzwerkzeug | |
| DE69830479T2 (de) | Vorrichtung und verfahren zum spinnen mit einer mehrfachen temperatur-überwachung | |
| DE69103371T2 (de) | Wärmeverteilungskanal in einer durch einen Brenner erwärmten Einbaubohle. | |
| DE3427088A1 (de) | Vorrichtung zum abkuehlen eines heissen produktgases | |
| DE2812065C2 (de) | Schneckenstrangpresse mit einer Zylindertemperiereinrichtung zur Verarbeitung von thermoplastischen Kunststoffen und Kautschuk | |
| DE69303671T2 (de) | Intermittierende Heizvorrichtung für plastifizierte Fluide in Spritzgiessen oder dergleichen | |
| DE112005001013T5 (de) | Formverteiler mit geringem Abstand | |
| EP0936965B1 (de) | Spritzgussdüse | |
| DE2324599A1 (de) | Spinnduesenplatte fuer duesenpakete von schmelzspinnanlagen und verfahren zu ihrer herstellung | |
| DE3440896A1 (de) | Vorrichtung zum temperieren integrierter elektronischer bauteile | |
| DE2322918A1 (de) | Kuehlkanal zur kombinierten strahlungs-, kontakt- und konvektionskuehlung | |
| DE8432775U1 (de) | Vorrichtung zum Temperieren integrierter elektronischer Bauteile |