DE69941977D1 - ESD-Schutz-Bauteil für mittlere Triggerspannung - Google Patents
ESD-Schutz-Bauteil für mittlere TriggerspannungInfo
- Publication number
- DE69941977D1 DE69941977D1 DE69941977T DE69941977T DE69941977D1 DE 69941977 D1 DE69941977 D1 DE 69941977D1 DE 69941977 T DE69941977 T DE 69941977T DE 69941977 T DE69941977 T DE 69941977T DE 69941977 D1 DE69941977 D1 DE 69941977D1
- Authority
- DE
- Germany
- Prior art keywords
- trigger
- components
- voltages
- esd protection
- trigger voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0259—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements
- H01L27/0262—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements including a PNP transistor and a NPN transistor, wherein each of said transistors has its base coupled to the collector of the other transistor, e.g. silicon controlled rectifier [SCR] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99870110A EP1058308B8 (de) | 1999-06-01 | 1999-06-01 | ESD-Schutz-Bauteil für mittlere Triggerspannung |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69941977D1 true DE69941977D1 (de) | 2010-03-18 |
Family
ID=8243840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69941977T Expired - Lifetime DE69941977D1 (de) | 1999-06-01 | 1999-06-01 | ESD-Schutz-Bauteil für mittlere Triggerspannung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6570226B1 (de) |
EP (1) | EP1058308B8 (de) |
AT (1) | ATE456861T1 (de) |
DE (1) | DE69941977D1 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002124580A (ja) * | 2000-10-18 | 2002-04-26 | Yamaha Corp | 入力保護回路 |
DE10111462A1 (de) * | 2001-03-09 | 2002-09-19 | Infineon Technologies Ag | Thyristorstruktur und Überspannungsschutzanordnung mit einer solchen Thyristorstruktur |
JP4137510B2 (ja) * | 2001-05-17 | 2008-08-20 | セイコーインスツル株式会社 | 差動増幅回路を有する半導体装置 |
US6664909B1 (en) * | 2001-08-13 | 2003-12-16 | Impinj, Inc. | Method and apparatus for trimming high-resolution digital-to-analog converter |
KR100431066B1 (ko) * | 2001-09-27 | 2004-05-12 | 삼성전자주식회사 | 정전 방전 보호 기능을 가진 반도체 장치 |
EP1432035B1 (de) | 2002-12-20 | 2018-07-25 | IMEC vzw | Schutzbauelement gegen elektrostatische Entladung |
DE10335383A1 (de) * | 2003-07-28 | 2005-02-24 | Atmel Germany Gmbh | Monolithisch integrierbare Schaltungsanordnung zum Überspannungsschutz |
US20050083618A1 (en) * | 2003-10-21 | 2005-04-21 | Steinhoff Robert M. | ESD protection for integrated circuits |
US7245466B2 (en) | 2003-10-21 | 2007-07-17 | Texas Instruments Incorporated | Pumped SCR for ESD protection |
US7804670B2 (en) | 2005-01-07 | 2010-09-28 | Semiconductor Components Industries, L.L.C. | Hybrid ESD clamp |
DE102005019305B4 (de) | 2005-04-26 | 2010-04-22 | Infineon Technologies Ag | ESD-Schutzstruktur mit Diodenreihenschaltung und Halbleiterschaltung mit derselben |
US7355250B2 (en) * | 2005-09-08 | 2008-04-08 | System General Corp. | Electrostatic discharge device with controllable holding current |
DE102005056908B4 (de) | 2005-11-29 | 2008-02-28 | Infineon Technologies Ag | Integrierte Schaltungsanordnung mit Shockleydiode oder Thyristor und Verfahren zum Herstellen |
US7709896B2 (en) * | 2006-03-08 | 2010-05-04 | Infineon Technologies Ag | ESD protection device and method |
US8247839B2 (en) * | 2008-07-09 | 2012-08-21 | Sofics Bvba | ESD protection device with increased holding voltage during normal operation |
US8653557B2 (en) * | 2010-02-22 | 2014-02-18 | Sofics Bvba | High holding voltage electrostatic discharge (ESD) device |
US9041054B2 (en) | 2010-02-22 | 2015-05-26 | Sofics Bvba | High holding voltage electrostatic discharge protection device |
CN112466939A (zh) * | 2020-11-26 | 2021-03-09 | 中国科学院微电子研究所 | 一种具有静电放电保护功能的可控硅器件 |
CN113871383B (zh) * | 2021-09-24 | 2023-08-18 | 电子科技大学 | 一种反向二极管降低触发电压的改进型lvtscr器件 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4760433A (en) * | 1986-01-31 | 1988-07-26 | Harris Corporation | ESD protection transistors |
US5591661A (en) * | 1992-04-07 | 1997-01-07 | Shiota; Philip | Method for fabricating devices for electrostatic discharge protection and voltage references, and the resulting structures |
JPH07122650A (ja) * | 1993-10-22 | 1995-05-12 | Yamaha Corp | 半導体装置 |
US6078083A (en) * | 1994-05-16 | 2000-06-20 | Texas Instruments Incorporated | ESD protection circuit for dual 3V/5V supply devices using single thickness gate oxides |
US5602404A (en) * | 1995-01-18 | 1997-02-11 | National Semiconductor Corporation | Low voltage triggering silicon controlled rectifier structures for ESD protection |
JP2882309B2 (ja) * | 1995-04-28 | 1999-04-12 | 日本電気株式会社 | 入力保護回路及び半導体集積回路装置の製造方法 |
KR100496362B1 (ko) * | 1995-07-11 | 2006-05-02 | 텍사스 인스트루먼츠 인코포레이티드 | 기판트리거된래터럴npn을이용한집적esd보호회로 |
JPH09162298A (ja) * | 1995-12-12 | 1997-06-20 | Fujitsu Ltd | 半導体装置 |
US5821572A (en) * | 1996-12-17 | 1998-10-13 | Symbios, Inc. | Simple BICMOS process for creation of low trigger voltage SCR and zener diode pad protection |
US5898205A (en) * | 1997-07-11 | 1999-04-27 | Taiwan Semiconductor Manufacturing Co. Ltd. | Enhanced ESD protection circuitry |
-
1999
- 1999-06-01 AT AT99870110T patent/ATE456861T1/de not_active IP Right Cessation
- 1999-06-01 EP EP99870110A patent/EP1058308B8/de not_active Expired - Lifetime
- 1999-06-01 DE DE69941977T patent/DE69941977D1/de not_active Expired - Lifetime
-
2000
- 2000-06-01 US US09/586,699 patent/US6570226B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1058308A1 (de) | 2000-12-06 |
ATE456861T1 (de) | 2010-02-15 |
EP1058308B8 (de) | 2010-04-07 |
US6570226B1 (en) | 2003-05-27 |
EP1058308B1 (de) | 2010-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: IMEC, LEUVEN, BE Owner name: STMICROELECTRONICS N.V., SCHIPHOL AIRPORT, NL |
|
8364 | No opposition during term of opposition |