DE69937090D1 - Halbleiterträger, seine Herstellung, Aufbau und dessen Herstellung - Google Patents
Halbleiterträger, seine Herstellung, Aufbau und dessen HerstellungInfo
- Publication number
- DE69937090D1 DE69937090D1 DE69937090T DE69937090T DE69937090D1 DE 69937090 D1 DE69937090 D1 DE 69937090D1 DE 69937090 T DE69937090 T DE 69937090T DE 69937090 T DE69937090 T DE 69937090T DE 69937090 D1 DE69937090 D1 DE 69937090D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- construction
- semiconductor carrier
- semiconductor
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000010276 construction Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Ceramic Products (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22661398 | 1998-07-28 | ||
JP22661398 | 1998-07-28 | ||
JP19766699 | 1999-07-12 | ||
JP11197666A JP2000106391A (ja) | 1998-07-28 | 1999-07-12 | 半導体支持装置、その製造方法、接合体の製造方法および接合体 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69937090D1 true DE69937090D1 (de) | 2007-10-25 |
DE69937090T2 DE69937090T2 (de) | 2008-06-05 |
Family
ID=26510495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69937090T Expired - Lifetime DE69937090T2 (de) | 1998-07-28 | 1999-07-27 | Halbleiterträger, seine Herstellung, Aufbau und dessen Herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6486542B1 (de) |
EP (1) | EP0977260B1 (de) |
JP (1) | JP2000106391A (de) |
KR (1) | KR100368627B1 (de) |
DE (1) | DE69937090T2 (de) |
TW (1) | TW440893B (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004055608A (ja) * | 2002-07-16 | 2004-02-19 | Sumitomo Osaka Cement Co Ltd | 電極内蔵型サセプタ |
JP4569077B2 (ja) * | 2003-06-05 | 2010-10-27 | 住友電気工業株式会社 | 半導体あるいは液晶製造装置用保持体およびそれを搭載した半導体あるいは液晶製造装置 |
JP4266886B2 (ja) | 2004-06-21 | 2009-05-20 | 株式会社ソディック | セラミック素子とその製造方法 |
KR100559783B1 (ko) * | 2004-07-07 | 2006-03-10 | 한미반도체 주식회사 | 반도체 처리장치 |
JP4421595B2 (ja) * | 2006-11-16 | 2010-02-24 | 日本碍子株式会社 | 加熱装置 |
KR100932233B1 (ko) * | 2007-11-06 | 2009-12-16 | 주식회사 메카로닉스 | 히터 제조방법 |
TWI450353B (zh) * | 2008-01-08 | 2014-08-21 | Ngk Insulators Ltd | A bonding structure and a semiconductor manufacturing apparatus |
JP4209456B1 (ja) * | 2008-02-22 | 2009-01-14 | 三菱重工業株式会社 | 積層接合装置用治具 |
US8932690B2 (en) * | 2011-11-30 | 2015-01-13 | Component Re-Engineering Company, Inc. | Plate and shaft device |
US9556074B2 (en) * | 2011-11-30 | 2017-01-31 | Component Re-Engineering Company, Inc. | Method for manufacture of a multi-layer plate device |
US9418959B1 (en) | 2015-07-08 | 2016-08-16 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems of bonded substrates |
US20210358775A1 (en) * | 2018-09-28 | 2021-11-18 | Kyocera Corporation | Ceramic structure and wafer system |
CN112267039B (zh) * | 2020-10-10 | 2022-02-01 | 中国科学院金属研究所 | 一种高体积分数碳化硅颗粒增强铝基复合材料的制备工艺 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3609471A (en) * | 1969-07-22 | 1971-09-28 | Gen Electric | Semiconductor device with thermally conductive dielectric barrier |
JPS59137379A (ja) * | 1983-01-24 | 1984-08-07 | 工業技術院長 | 複合焼結セラミクスと金属との接着方法 |
JPS6254045A (ja) * | 1985-09-02 | 1987-03-09 | Toyota Motor Corp | 炭化ケイ素及び窒化ケイ素短繊維強化アルミニウム合金 |
CA2010611A1 (en) * | 1989-02-24 | 1990-08-24 | Charles N. Wilson | Method for orienting anisotropic superconducting crystals in a metal matrix composite |
EP0506391B1 (de) * | 1991-03-26 | 2002-02-27 | Ngk Insulators, Ltd. | Verwendung eines Korrosion beständiger Substratshalter aus Aluminiumnitrid |
JP3813654B2 (ja) * | 1995-02-09 | 2006-08-23 | 日本碍子株式会社 | セラミックスの接合構造およびその製造方法 |
US5633073A (en) * | 1995-07-14 | 1997-05-27 | Applied Materials, Inc. | Ceramic susceptor with embedded metal electrode and eutectic connection |
JPH09213773A (ja) | 1996-01-30 | 1997-08-15 | Kyocera Corp | ウェハ保持部材及び耐プラズマ用部材 |
-
1999
- 1999-07-12 JP JP11197666A patent/JP2000106391A/ja active Pending
- 1999-07-14 TW TW088111911A patent/TW440893B/zh not_active IP Right Cessation
- 1999-07-27 EP EP99305953A patent/EP0977260B1/de not_active Expired - Lifetime
- 1999-07-27 US US09/361,743 patent/US6486542B1/en not_active Expired - Lifetime
- 1999-07-27 DE DE69937090T patent/DE69937090T2/de not_active Expired - Lifetime
- 1999-07-27 KR KR10-1999-0030496A patent/KR100368627B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2000106391A (ja) | 2000-04-11 |
KR20000011983A (ko) | 2000-02-25 |
TW440893B (en) | 2001-06-16 |
DE69937090T2 (de) | 2008-06-05 |
US6486542B1 (en) | 2002-11-26 |
EP0977260B1 (de) | 2007-09-12 |
KR100368627B1 (ko) | 2003-01-24 |
EP0977260A3 (de) | 2002-04-10 |
EP0977260A2 (de) | 2000-02-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |