DE69933726D1 - Verfahren und Apparat für verbesserte Inspektionsmessungen - Google Patents

Verfahren und Apparat für verbesserte Inspektionsmessungen

Info

Publication number
DE69933726D1
DE69933726D1 DE69933726T DE69933726T DE69933726D1 DE 69933726 D1 DE69933726 D1 DE 69933726D1 DE 69933726 T DE69933726 T DE 69933726T DE 69933726 T DE69933726 T DE 69933726T DE 69933726 D1 DE69933726 D1 DE 69933726D1
Authority
DE
Germany
Prior art keywords
improved inspection
inspection measurements
measurements
improved
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69933726T
Other languages
English (en)
Other versions
DE69933726T2 (de
Inventor
Christopher J Gould
Donald C Wheeler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda AG
International Business Machines Corp
Original Assignee
Infineon Technologies AG
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG, International Business Machines Corp filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of DE69933726D1 publication Critical patent/DE69933726D1/de
Publication of DE69933726T2 publication Critical patent/DE69933726T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Indication And Recording Devices For Special Purposes And Tariff Metering Devices (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
DE69933726T 1998-03-31 1999-03-31 Verfahren und Apparat für verbesserte Inspektionsmessungen Expired - Fee Related DE69933726T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5228298A 1998-03-31 1998-03-31
US52282 1998-03-31

Publications (2)

Publication Number Publication Date
DE69933726D1 true DE69933726D1 (de) 2006-12-07
DE69933726T2 DE69933726T2 (de) 2007-10-04

Family

ID=21976580

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69933726T Expired - Fee Related DE69933726T2 (de) 1998-03-31 1999-03-31 Verfahren und Apparat für verbesserte Inspektionsmessungen

Country Status (6)

Country Link
EP (1) EP0947828B1 (de)
JP (1) JPH11325877A (de)
KR (1) KR19990078430A (de)
CN (1) CN1238461A (de)
DE (1) DE69933726T2 (de)
TW (1) TW414992B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW494519B (en) * 2000-06-19 2002-07-11 Infineon Technologies Corp Method for determining overlay measurement uncertainty
US6727989B1 (en) 2000-06-20 2004-04-27 Infineon Technologies Ag Enhanced overlay measurement marks for overlay alignment and exposure tool condition control
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US7068833B1 (en) 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
WO2002019415A1 (en) * 2000-08-30 2002-03-07 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
US7804994B2 (en) 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
US7075639B2 (en) 2003-04-25 2006-07-11 Kla-Tencor Technologies Corporation Method and mark for metrology of phase errors on phase shift masks
US7608468B1 (en) 2003-07-02 2009-10-27 Kla-Tencor Technologies, Corp. Apparatus and methods for determining overlay and uses of same
US7346878B1 (en) 2003-07-02 2008-03-18 Kla-Tencor Technologies Corporation Apparatus and methods for providing in-chip microtargets for metrology or inspection
US9927718B2 (en) 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
US10890436B2 (en) 2011-07-19 2021-01-12 Kla Corporation Overlay targets with orthogonal underlayer dummyfill
WO2013150585A1 (ja) * 2012-04-02 2013-10-10 三菱電機株式会社 エッジ検出装置
CN103995439B (zh) * 2014-06-12 2016-03-02 上海华力微电子有限公司 一种在线确定光刻工艺窗口的方法
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry
EP3499311A1 (de) * 2017-12-14 2019-06-19 ASML Netherlands B.V. Verfahren zur steuerung einer fertigungsvorrichtung und zugehörige vorrichtungen
EP3779882B1 (de) * 2019-08-16 2022-07-20 Sick IVP AB Bereitstellen einer intensitätsspitzenposition in bilddaten aus der lichttriangulation in einem system zur dreidimensionalen bildgebung
CN112631090B (zh) * 2019-09-24 2022-09-27 长鑫存储技术有限公司 套刻标记和套刻误差测试方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4149085A (en) * 1978-01-16 1979-04-10 International Business Machines Corporation Automatic overlay measurements using an electronic beam system as a measurement tool
US5124927A (en) * 1990-03-02 1992-06-23 International Business Machines Corp. Latent-image control of lithography tools
GB9603262D0 (en) * 1996-02-16 1996-04-17 Bio Rad Micromeasurements Ltd Positional measurements
JP2842362B2 (ja) * 1996-02-29 1999-01-06 日本電気株式会社 重ね合わせ測定方法

Also Published As

Publication number Publication date
TW414992B (en) 2000-12-11
DE69933726T2 (de) 2007-10-04
CN1238461A (zh) 1999-12-15
EP0947828A3 (de) 2001-10-31
EP0947828A2 (de) 1999-10-06
EP0947828B1 (de) 2006-10-25
JPH11325877A (ja) 1999-11-26
KR19990078430A (ko) 1999-10-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: INTERNATIONAL BUSINESS MACHINES CORP., ARMONK,, US

Owner name: QIMONDA AG, 81739 MUENCHEN, DE

8339 Ceased/non-payment of the annual fee