DE69920700D1 - Spritzgiessbares verbundmaterial - Google Patents
Spritzgiessbares verbundmaterialInfo
- Publication number
- DE69920700D1 DE69920700D1 DE69920700T DE69920700T DE69920700D1 DE 69920700 D1 DE69920700 D1 DE 69920700D1 DE 69920700 T DE69920700 T DE 69920700T DE 69920700 T DE69920700 T DE 69920700T DE 69920700 D1 DE69920700 D1 DE 69920700D1
- Authority
- DE
- Germany
- Prior art keywords
- composite material
- injection moldable
- moldable composite
- injection
- moldable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/362—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith for broadside radiating helical antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3456—Antennas, e.g. radomes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Details Of Aerials (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9811664A GB2337756B (en) | 1998-05-29 | 1998-05-29 | Composite injection mouldable material |
GB9811664 | 1998-05-29 | ||
GB9828532 | 1998-12-23 | ||
GBGB9828532.3A GB9828532D0 (en) | 1998-12-23 | 1998-12-23 | Composite injection mouldable material |
PCT/EP1999/003714 WO1999062841A1 (en) | 1998-05-29 | 1999-05-28 | Composite injection mouldable material |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69920700D1 true DE69920700D1 (de) | 2004-11-04 |
DE69920700T2 DE69920700T2 (de) | 2006-02-16 |
Family
ID=26313767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69920700T Expired - Lifetime DE69920700T2 (de) | 1998-05-29 | 1999-05-28 | Spritzgiessbares verbundmaterial |
Country Status (5)
Country | Link |
---|---|
US (1) | US6476774B1 (de) |
EP (1) | EP1091915B1 (de) |
AU (1) | AU4502399A (de) |
DE (1) | DE69920700T2 (de) |
WO (1) | WO1999062841A1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040198415A1 (en) * | 2002-06-14 | 2004-10-07 | Cheng-Hsiung Lin | Mobile phone of reducing radiation injury |
US7301504B2 (en) | 2004-07-14 | 2007-11-27 | Ems Technologies, Inc. | Mechanical scanning feed assembly for a spherical lens antenna |
FR2893450A1 (fr) * | 2005-11-17 | 2007-05-18 | Purple Labs Soc Par Actions Si | Antenne en f inverse a element rayonnant enroule et telephone portable la comportant |
JP4692677B2 (ja) | 2007-05-02 | 2011-06-01 | 株式会社村田製作所 | アンテナ構造およびそれを備えた無線通信装置 |
US10374315B2 (en) | 2015-10-28 | 2019-08-06 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US10601137B2 (en) | 2015-10-28 | 2020-03-24 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US11367959B2 (en) | 2015-10-28 | 2022-06-21 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US10476164B2 (en) | 2015-10-28 | 2019-11-12 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
US10355361B2 (en) | 2015-10-28 | 2019-07-16 | Rogers Corporation | Dielectric resonator antenna and method of making the same |
US11283189B2 (en) | 2017-05-02 | 2022-03-22 | Rogers Corporation | Connected dielectric resonator antenna array and method of making the same |
US11876295B2 (en) | 2017-05-02 | 2024-01-16 | Rogers Corporation | Electromagnetic reflector for use in a dielectric resonator antenna system |
CN110754017B (zh) | 2017-06-07 | 2023-04-04 | 罗杰斯公司 | 介质谐振器天线系统 |
GB2566934B (en) * | 2017-09-20 | 2022-11-23 | Bae Systems Plc | Material for 3D printing and a 3D printed device |
US11491706B2 (en) | 2017-09-20 | 2022-11-08 | Bae Systems Plc | Material for 3D printing and a 3D printed device |
EP3459995A1 (de) * | 2017-09-20 | 2019-03-27 | BAE SYSTEMS plc | Material zum 3d-drucken und 3d-gedruckte vorrichtung |
US11519364B2 (en) | 2017-10-13 | 2022-12-06 | The Commonwealth Of Australia | Rigid thermal protection composition |
US11616302B2 (en) | 2018-01-15 | 2023-03-28 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US10892544B2 (en) | 2018-01-15 | 2021-01-12 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US10910722B2 (en) | 2018-01-15 | 2021-02-02 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US11198263B2 (en) | 2018-03-22 | 2021-12-14 | Rogers Corporation | Melt processable thermoplastic composite comprising a multimodal dielectric filler |
US11691324B2 (en) * | 2018-03-30 | 2023-07-04 | Mazda Motor Corporation | Injection molding device, injection molding method, and injection molding resin material |
US11552390B2 (en) | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
US11031697B2 (en) | 2018-11-29 | 2021-06-08 | Rogers Corporation | Electromagnetic device |
WO2020117489A1 (en) | 2018-12-04 | 2020-06-11 | Rogers Corporation | Dielectric electromagnetic structure and method of making the same |
US11482790B2 (en) | 2020-04-08 | 2022-10-25 | Rogers Corporation | Dielectric lens and electromagnetic device with same |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59204295A (ja) | 1983-04-29 | 1984-11-19 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | 金属回路構造体 |
US4772653A (en) | 1985-11-08 | 1988-09-20 | Amoco Corporation | Stain resistant cookware from blends comprising an interpolymer of an unsaturated dicarboxylic acid compound |
JPH0770410B2 (ja) | 1986-09-03 | 1995-07-31 | 株式会社東芝 | コンデンサ |
JPS63301258A (ja) | 1987-05-29 | 1988-12-08 | Otsuka Chem Co Ltd | スクロ−ル型圧縮機部材用樹脂組成物及びスクロ−ル型圧縮機部品の製造方法 |
US5236988A (en) | 1989-09-26 | 1993-08-17 | Sekisui Chemical Co., Ltd. | Engineering plastic composition and articles made of the same |
JPH03179805A (ja) * | 1989-12-07 | 1991-08-05 | Murata Mfg Co Ltd | 誘電体レンズアンテナ用複合材料 |
JPH04197718A (ja) | 1990-11-29 | 1992-07-17 | Nitto Boseki Co Ltd | 紫外線不透過性射出成形樹脂基板 |
JP2979736B2 (ja) | 1991-06-27 | 1999-11-15 | 株式会社村田製作所 | 誘電体アンテナ用複合材料 |
DE4208476A1 (de) * | 1992-03-17 | 1993-09-23 | Basf Ag | Vergiessbare formmassen |
ES2126612T3 (es) * | 1992-05-07 | 1999-04-01 | Raytheon Co | Componentes para microondas con plastico moldeado metalizado y procedimiento de fabricacion. |
CH691098A5 (fr) * | 1997-03-24 | 2001-04-12 | Em Microelectronic Marin Sa | Structure monolithique de circuits intégrés et de bobine d'antenne, munie d'un anneau de protection périphérique. |
-
1999
- 1999-05-28 WO PCT/EP1999/003714 patent/WO1999062841A1/en active IP Right Grant
- 1999-05-28 EP EP99927791A patent/EP1091915B1/de not_active Expired - Lifetime
- 1999-05-28 AU AU45023/99A patent/AU4502399A/en not_active Abandoned
- 1999-05-28 DE DE69920700T patent/DE69920700T2/de not_active Expired - Lifetime
- 1999-07-16 US US09/355,018 patent/US6476774B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1091915B1 (de) | 2004-09-29 |
DE69920700T2 (de) | 2006-02-16 |
WO1999062841A1 (en) | 1999-12-09 |
EP1091915A1 (de) | 2001-04-18 |
US6476774B1 (en) | 2002-11-05 |
AU4502399A (en) | 1999-12-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |