DE69919161D1 - Wasserlösliche, negativ arbeitende photoresistzusammensetzung - Google Patents
Wasserlösliche, negativ arbeitende photoresistzusammensetzungInfo
- Publication number
- DE69919161D1 DE69919161D1 DE69919161T DE69919161T DE69919161D1 DE 69919161 D1 DE69919161 D1 DE 69919161D1 DE 69919161 T DE69919161 T DE 69919161T DE 69919161 T DE69919161 T DE 69919161T DE 69919161 D1 DE69919161 D1 DE 69919161D1
- Authority
- DE
- Germany
- Prior art keywords
- soluble
- water
- photoresist composition
- negative working
- working photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F246/00—Copolymers in which the nature of only the monomers in minority is defined
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85880 | 1987-08-14 | ||
US09/085,880 US5998092A (en) | 1998-05-27 | 1998-05-27 | Water soluble negative-working photoresist composition |
PCT/EP1999/003418 WO1999061497A1 (en) | 1998-05-27 | 1999-05-18 | Water soluble negative-working photoresist composition |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69919161D1 true DE69919161D1 (de) | 2004-09-09 |
DE69919161T2 DE69919161T2 (de) | 2005-08-11 |
Family
ID=22194573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69919161T Expired - Fee Related DE69919161T2 (de) | 1998-05-27 | 1999-05-18 | Wasserlösliche, negativ arbeitende photoresistzusammensetzung |
Country Status (9)
Country | Link |
---|---|
US (1) | US5998092A (de) |
EP (1) | EP1084165B1 (de) |
JP (1) | JP2002516422A (de) |
KR (1) | KR20010043752A (de) |
CN (1) | CN1145651C (de) |
DE (1) | DE69919161T2 (de) |
MY (1) | MY114642A (de) |
TW (1) | TW476867B (de) |
WO (1) | WO1999061497A1 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI234567B (en) * | 1998-11-27 | 2005-06-21 | Hyundai Electronics Ind | Cross-linker for photoresist, and photoresist composition comprising the same |
KR100557609B1 (ko) * | 1999-02-22 | 2006-03-10 | 주식회사 하이닉스반도체 | 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물 |
KR100520670B1 (ko) | 1999-05-06 | 2005-10-10 | 주식회사 하이닉스반도체 | 포토레지스트 패턴의 형성방법 |
EP1240552B1 (de) * | 1999-08-13 | 2012-09-19 | Intellectual Ventures Holding 40 LLC | Wässrig entwickelbare fotoresistzusammensetzungen |
US6696370B2 (en) * | 2000-06-16 | 2004-02-24 | The Penn State Research Foundation | Aqueous-based photolithography on organic materials |
JP4790153B2 (ja) * | 2000-09-01 | 2011-10-12 | 富士通株式会社 | ネガ型レジスト組成物、レジストパターンの形成方法及び電子デバイスの製造方法 |
KR100759442B1 (ko) * | 2001-08-10 | 2007-10-04 | 삼성에스디아이 주식회사 | 포토레지스트 중합체 및 이를 포함하는 포토레지스트조성물과 형광막 조성물 |
US6800415B2 (en) | 2001-09-28 | 2004-10-05 | Clariant Finance (Bvi) Ltd | Negative-acting aqueous photoresist composition |
US6634805B1 (en) | 2001-10-10 | 2003-10-21 | Advanced Micro Devices, Inc. | Parallel plate development |
US6819427B1 (en) | 2001-10-10 | 2004-11-16 | Advanced Micro Devices, Inc. | Apparatus of monitoring and optimizing the development of a photoresist material |
US7208249B2 (en) * | 2002-09-30 | 2007-04-24 | Applied Materials, Inc. | Method of producing a patterned photoresist used to prepare high performance photomasks |
US6905621B2 (en) * | 2002-10-10 | 2005-06-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for preventing the etch transfer of sidelobes in contact hole patterns |
US7235348B2 (en) * | 2003-05-22 | 2007-06-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Water soluble negative tone photoresist |
US7300739B2 (en) * | 2003-05-29 | 2007-11-27 | International Business Machines Corporation | Negative resists based on a acid-catalyzed elimination of polar molecules |
US7033735B2 (en) | 2003-11-17 | 2006-04-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Water soluble negative tone photoresist |
IN263389B (de) | 2005-11-22 | 2014-01-31 | Segetis Inc | |
KR101389057B1 (ko) | 2006-04-13 | 2014-05-13 | 시바 홀딩 인크 | 설포늄 염 개시제 |
BRPI0818370A2 (pt) * | 2007-10-09 | 2017-05-16 | Segetis Inc | métodos de fabricar cetais e acetais |
EP2205606A2 (de) * | 2007-10-09 | 2010-07-14 | Segetis, Inc. | Polyketalverbindungen, synthese und anwendungen |
WO2009146202A2 (en) * | 2008-04-16 | 2009-12-03 | Segetis, Inc. | Transketalized compositions, synthesis, and applications |
CA2736636A1 (en) * | 2008-09-25 | 2010-04-01 | Segetis, Inc. | Ketal ester derivatives |
JP5882204B2 (ja) | 2009-06-22 | 2016-03-09 | サジティス・インコーポレイテッド | ケタール化合物およびそれらの使用 |
US20110300083A1 (en) | 2010-05-10 | 2011-12-08 | Segetis, Inc. | Personal care formulations containing alkyl ketal esters and methods of manufacture |
JP5886856B2 (ja) | 2010-08-03 | 2016-03-16 | サジティス・インコーポレイテッド | アセタールおよびケタールの製造方法、ならびにこの方法により製造されるアセタールおよびケタール |
CA2803389C (en) | 2010-08-12 | 2016-10-11 | Segetis, Inc. | Carboxy ester ketal removal compositions, methods of manufacture, and uses thereof |
US9074065B2 (en) | 2010-08-12 | 2015-07-07 | Segetis, Inc. | Latex coating compositions including carboxy ester ketal coalescents, methods of manufacture, and uses thereof |
WO2012033813A2 (en) | 2010-09-07 | 2012-03-15 | Segetis, Inc. | Compositions for dyeing keratin fibers |
WO2012065116A2 (en) | 2010-11-11 | 2012-05-18 | Segetis, Inc. | Polyhydroxy ketal ester adducts, methods of manufacture and uses thereof |
BR112013009359A2 (pt) | 2010-11-11 | 2016-07-26 | Segetis Inc | ácidos cetocarboxílicos, ésteres cetocarboxílicos, métodos de fabricação e usos dos mesmos. |
BR112013011149A2 (pt) | 2010-11-11 | 2016-08-02 | Segetis Inc | adutos poliacetal, métodos de fabricação e seus usos. |
JP5902671B2 (ja) * | 2011-03-31 | 2016-04-13 | キッセイ薬品工業株式会社 | ベンジルピラゾール誘導体の製造方法およびその製造中間体 |
US20130087073A1 (en) | 2011-10-11 | 2013-04-11 | Segetis, Inc. | Stabilized levulinic ester ketals |
US9458414B2 (en) | 2012-09-21 | 2016-10-04 | Gfbiochemicals Limited | Cleaning, surfactant, and personal care compositions |
WO2014085609A1 (en) | 2012-11-29 | 2014-06-05 | Segetis, Inc. | Carboxy ester ketals, methods of manufacture, and uses thereof |
US9695280B2 (en) * | 2015-03-03 | 2017-07-04 | Ricoh Co., Ltd. | Methods for solid freeform fabrication |
US9808993B2 (en) | 2015-03-03 | 2017-11-07 | Ricoh Co., Ltd. | Method for solid freeform fabrication |
US10066119B2 (en) | 2015-03-03 | 2018-09-04 | Ricoh Co., Ltd. | Method for solid freeform fabrication |
US10688770B2 (en) | 2015-03-03 | 2020-06-23 | Ricoh Co., Ltd. | Methods for solid freeform fabrication |
TWI746628B (zh) * | 2016-12-08 | 2021-11-21 | 南韓商三星電子股份有限公司 | 光阻組成物以及使用該光阻組成物形成精細圖案的方法 |
KR102428331B1 (ko) * | 2016-12-08 | 2022-08-04 | 삼성전자주식회사 | 포토 레지스트 조성물 및 이를 이용한 미세 패턴 형성 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4737426A (en) * | 1985-05-15 | 1988-04-12 | Ciba-Geigy Corporation | Cyclic acetals or ketals of beta-keto esters or amides |
EP0347381B1 (de) * | 1988-06-13 | 1992-02-12 | Ciba-Geigy Ag | Ungesättigte beta-Ketoesteracetale und ihre Anwendungen |
US5532106A (en) * | 1994-08-31 | 1996-07-02 | Cornell Research Foundation, Inc. | Positive-tone photoresist containing diester dissolution inhibitors |
KR0164981B1 (ko) * | 1995-11-28 | 1999-03-20 | 김흥기 | 아세탈기를 함유하는 알콕시-스틸렌 중합체와 그의 제조방법 및 알콕시-스틸렌 중합체를 주요 구성성분으로 하는 화학증폭형 포토레지스트 재료 |
-
1998
- 1998-05-27 US US09/085,880 patent/US5998092A/en not_active Expired - Fee Related
-
1999
- 1999-05-05 TW TW088107263A patent/TW476867B/zh not_active IP Right Cessation
- 1999-05-18 JP JP2000550898A patent/JP2002516422A/ja not_active Withdrawn
- 1999-05-18 KR KR1020007013109A patent/KR20010043752A/ko active IP Right Grant
- 1999-05-18 WO PCT/EP1999/003418 patent/WO1999061497A1/en active IP Right Grant
- 1999-05-18 EP EP99926324A patent/EP1084165B1/de not_active Expired - Lifetime
- 1999-05-18 DE DE69919161T patent/DE69919161T2/de not_active Expired - Fee Related
- 1999-05-18 CN CNB998066028A patent/CN1145651C/zh not_active Expired - Fee Related
- 1999-05-26 MY MYPI99002075A patent/MY114642A/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP1084165A1 (de) | 2001-03-21 |
JP2002516422A (ja) | 2002-06-04 |
TW476867B (en) | 2002-02-21 |
KR20010043752A (ko) | 2001-05-25 |
EP1084165B1 (de) | 2004-08-04 |
CN1303401A (zh) | 2001-07-11 |
US5998092A (en) | 1999-12-07 |
DE69919161T2 (de) | 2005-08-11 |
MY114642A (en) | 2002-11-30 |
WO1999061497A1 (en) | 1999-12-02 |
CN1145651C (zh) | 2004-04-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: AZ ELECTRONIC MATERIALS USA CORP. (N.D.GES.D. STAA |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: PATENTANWAELTE ISENBRUCK BOESL HOERSCHLER WICHMANN HU |
|
8339 | Ceased/non-payment of the annual fee |