DE69913060D1 - Verfahren zur Behandlung eines Resists - Google Patents

Verfahren zur Behandlung eines Resists

Info

Publication number
DE69913060D1
DE69913060D1 DE69913060T DE69913060T DE69913060D1 DE 69913060 D1 DE69913060 D1 DE 69913060D1 DE 69913060 T DE69913060 T DE 69913060T DE 69913060 T DE69913060 T DE 69913060T DE 69913060 D1 DE69913060 D1 DE 69913060D1
Authority
DE
Germany
Prior art keywords
resist
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69913060T
Other languages
English (en)
Other versions
DE69913060T2 (de
Inventor
Minoru Komori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Original Assignee
Ushio Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Publication of DE69913060D1 publication Critical patent/DE69913060D1/de
Application granted granted Critical
Publication of DE69913060T2 publication Critical patent/DE69913060T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/36—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of phenols with aldehydes or ketones
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/143—Electron beam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Magnetic Heads (AREA)
DE69913060T 1998-09-11 1999-09-09 Verfahren zur Behandlung eines Resists Expired - Lifetime DE69913060T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25899698A JP3365320B2 (ja) 1998-09-11 1998-09-11 レジストの処理方法
JP25899698 1998-09-11

Publications (2)

Publication Number Publication Date
DE69913060D1 true DE69913060D1 (de) 2004-01-08
DE69913060T2 DE69913060T2 (de) 2004-08-26

Family

ID=17327916

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69913060T Expired - Lifetime DE69913060T2 (de) 1998-09-11 1999-09-09 Verfahren zur Behandlung eines Resists

Country Status (6)

Country Link
US (1) US6087071A (de)
EP (1) EP0986072B1 (de)
JP (1) JP3365320B2 (de)
KR (1) KR100505080B1 (de)
DE (1) DE69913060T2 (de)
TW (1) TW430876B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6319655B1 (en) * 1999-06-11 2001-11-20 Electron Vision Corporation Modification of 193 nm sensitive photoresist materials by electron beam exposure
US6358670B1 (en) * 1999-12-28 2002-03-19 Electron Vision Corporation Enhancement of photoresist plasma etch resistance via electron beam surface cure
US6664023B2 (en) 2001-03-13 2003-12-16 International Business Machines Corporation Controlled aging of photoresists for faster photospeed
JP2003140362A (ja) * 2001-11-02 2003-05-14 Mitsubishi Electric Corp レジストパターンの強化方法
JP3816784B2 (ja) * 2001-11-09 2006-08-30 富士通株式会社 リソグラフィー方法及び加工方法
WO2003067636A1 (fr) * 2002-01-22 2003-08-14 Tokyo Electron Limited Dispositif et procede de traitement de surface
JP2004335667A (ja) * 2003-05-06 2004-11-25 Tokyo Electron Ltd 表面処理装置
DE102006015759A1 (de) * 2006-04-04 2007-10-18 Atmel Germany Gmbh Vorrichtung und Verfahren zum Behandeln von Wafern
US20110005287A1 (en) * 2008-09-30 2011-01-13 Bibber Sr John Method for improving light gauge building materials

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62215265A (ja) * 1986-03-17 1987-09-21 Ushio Inc レジスト処理方法
JPH06275513A (ja) * 1993-03-24 1994-09-30 Nippon Telegr & Teleph Corp <Ntt> パタ―ン化層形成法
JPH0744818A (ja) * 1993-07-30 1995-02-14 Matsushita Electric Ind Co Ltd 薄膜磁気ヘッドの製造方法
JP2655474B2 (ja) * 1993-12-17 1997-09-17 日本電気株式会社 電子線直接描画方法及びその装置
JPH0817016A (ja) * 1994-06-30 1996-01-19 Sanyo Electric Co Ltd 薄膜磁気ヘッドの製造方法
US5648198A (en) * 1994-12-13 1997-07-15 Kabushiki Kaisha Toshiba Resist hardening process having improved thermal stability
JP3420896B2 (ja) * 1996-09-10 2003-06-30 アルプス電気株式会社 薄膜磁気ヘッドおよびその製造方法

Also Published As

Publication number Publication date
EP0986072A3 (de) 2001-11-14
KR100505080B1 (ko) 2005-07-29
US6087071A (en) 2000-07-11
JP3365320B2 (ja) 2003-01-08
JP2000090414A (ja) 2000-03-31
TW430876B (en) 2001-04-21
EP0986072A2 (de) 2000-03-15
EP0986072B1 (de) 2003-11-26
DE69913060T2 (de) 2004-08-26
KR20000047485A (ko) 2000-07-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition