DE69906301T2 - Nachbehandlung von kupfer auf gedruckten schaltungsplatten - Google Patents
Nachbehandlung von kupfer auf gedruckten schaltungsplatten Download PDFInfo
- Publication number
- DE69906301T2 DE69906301T2 DE69906301T DE69906301T DE69906301T2 DE 69906301 T2 DE69906301 T2 DE 69906301T2 DE 69906301 T DE69906301 T DE 69906301T DE 69906301 T DE69906301 T DE 69906301T DE 69906301 T2 DE69906301 T2 DE 69906301T2
- Authority
- DE
- Germany
- Prior art keywords
- copper
- conversion coating
- acid
- organometallic conversion
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemical Treatment Of Metals (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US9133998P | 1998-07-01 | 1998-07-01 | |
| US91339P | 1998-07-01 | ||
| PCT/US1999/014983 WO2000002426A1 (en) | 1998-07-01 | 1999-07-01 | Post-treatment for copper on printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69906301D1 DE69906301D1 (de) | 2003-04-30 |
| DE69906301T2 true DE69906301T2 (de) | 2004-01-22 |
Family
ID=22227266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69906301T Expired - Lifetime DE69906301T2 (de) | 1998-07-01 | 1999-07-01 | Nachbehandlung von kupfer auf gedruckten schaltungsplatten |
Country Status (7)
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE50108246D1 (de) * | 2001-09-01 | 2006-01-05 | Trumpf Lasertechnik Gmbh | Verfahren zum Herstellen von Löchern in einer Mehrlagenleiterplatte |
| JP4773399B2 (ja) * | 2007-05-18 | 2011-09-14 | 矢崎総業株式会社 | スズまたはスズ合金めっき層の定量分析方法 |
| KR101663112B1 (ko) * | 2014-01-13 | 2016-10-06 | (주)켐프로스 | 통신용 ｒｆ 필터에 적용된 마그네슘 합금용 구리표면 부식방지제 조성물 및 처리방법 |
| CN111954378B (zh) * | 2020-07-20 | 2024-07-09 | 上海空间电源研究所 | 一种铜质焊盘表面铜氧化层还原修复剂及常温原位还原修复方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61176192A (ja) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | 銅と樹脂との接着方法 |
| US5261154A (en) * | 1991-07-22 | 1993-11-16 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
| GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
-
1999
- 1999-07-01 JP JP2000558701A patent/JP4242566B2/ja not_active Expired - Lifetime
- 1999-07-01 KR KR1020017000009A patent/KR100592746B1/ko not_active IP Right Cessation
- 1999-07-01 CA CA002335816A patent/CA2335816A1/en not_active Abandoned
- 1999-07-01 DE DE69906301T patent/DE69906301T2/de not_active Expired - Lifetime
- 1999-07-01 EP EP99933653A patent/EP1097618B1/en not_active Expired - Lifetime
- 1999-07-01 WO PCT/US1999/014983 patent/WO2000002426A1/en active IP Right Grant
- 1999-07-01 AT AT99933653T patent/ATE235796T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002520827A (ja) | 2002-07-09 |
| KR20010053363A (ko) | 2001-06-25 |
| JP4242566B2 (ja) | 2009-03-25 |
| EP1097618B1 (en) | 2003-03-26 |
| EP1097618A1 (en) | 2001-05-09 |
| ATE235796T1 (de) | 2003-04-15 |
| CA2335816A1 (en) | 2000-01-13 |
| WO2000002426A1 (en) | 2000-01-13 |
| DE69906301D1 (de) | 2003-04-30 |
| KR100592746B1 (ko) | 2006-06-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |