DE69841153D1 - Verstärkung aus vliesstoff für grundplatten einer leiterplatten, und verfahren zu ihrer herstellung - Google Patents

Verstärkung aus vliesstoff für grundplatten einer leiterplatten, und verfahren zu ihrer herstellung

Info

Publication number
DE69841153D1
DE69841153D1 DE69841153T DE69841153T DE69841153D1 DE 69841153 D1 DE69841153 D1 DE 69841153D1 DE 69841153 T DE69841153 T DE 69841153T DE 69841153 T DE69841153 T DE 69841153T DE 69841153 D1 DE69841153 D1 DE 69841153D1
Authority
DE
Germany
Prior art keywords
nonwovens
pcb
reinforcement
production
base plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69841153T
Other languages
English (en)
Inventor
Morio Gaku
Mitsuru Nozaki
Kenji Saimen
Tamemaru Esaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Application granted granted Critical
Publication of DE69841153D1 publication Critical patent/DE69841153D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10—Organic non-cellulose fibres
    • D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/24—Polyesters
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H17/00—Non-fibrous material added to the pulp, characterised by its constitution; Paper-impregnating material characterised by its constitution
    • D21H17/20—Macromolecular organic compounds
    • D21H17/33—Synthetic macromolecular compounds
    • D21H17/46—Synthetic macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H17/53—Polyethers; Polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
    • D21H25/04—Physical treatment, e.g. heating, irradiating
    • D21H25/06—Physical treatment, e.g. heating, irradiating of impregnated or coated paper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2475—Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonwoven Fabrics (AREA)
  • Paper (AREA)
DE69841153T 1997-10-07 1998-10-07 Verstärkung aus vliesstoff für grundplatten einer leiterplatten, und verfahren zu ihrer herstellung Expired - Lifetime DE69841153D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29031097 1997-10-07

Publications (1)

Publication Number Publication Date
DE69841153D1 true DE69841153D1 (de) 2009-10-29

Family

ID=17754458

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69841153T Expired - Lifetime DE69841153D1 (de) 1997-10-07 1998-10-07 Verstärkung aus vliesstoff für grundplatten einer leiterplatten, und verfahren zu ihrer herstellung

Country Status (5)

Country Link
US (1) US6229096B1 (de)
EP (1) EP0908559B8 (de)
KR (1) KR100522480B1 (de)
DE (1) DE69841153D1 (de)
TW (1) TW533130B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4479238B2 (ja) * 2004-01-08 2010-06-09 住友化学株式会社 樹脂含浸基材
WO2006115266A1 (ja) * 2005-04-26 2006-11-02 Unitika Fibers Ltd. Ｘ線造影糸、ｘ線造影被覆糸、前記ｘ線造影糸および、またはｘ線造影被覆糸を用いた繊維構造体
JP3981889B2 (ja) 2005-06-15 2007-09-26 東洋紡績株式会社 高周波用電子部品
JP5732045B2 (ja) * 2009-05-01 2015-06-10 スリーエム イノベイティブ プロパティズ カンパニー 受動電気物品
US9554463B2 (en) * 2014-03-07 2017-01-24 Rogers Corporation Circuit materials, circuit laminates, and articles formed therefrom
CN109936911A (zh) * 2017-12-18 2019-06-25 东莞文殊电子科技有限公司 一种pcb板及其制作方法
CN115075057B (zh) * 2022-07-05 2023-11-07 广东生益科技股份有限公司 一种低介电损耗无纺布及其制备方法和应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4140831A (en) * 1977-03-23 1979-02-20 Minnesota Mining And Manufacturing Company Flame-retardant metal-clad dielectric sheeting comprising a non-woven fibrous layer provided with dimensional stability under etching and soldering conditions by a polyester-diepoxide adhesive
US4973382A (en) 1988-07-26 1990-11-27 International Paper Company Filtration fabric produced by wet laid process
JP3029487B2 (ja) * 1991-05-13 2000-04-04 住友ベークライト株式会社 銅張積層板の製造方法
KR950700463A (ko) 1992-01-21 1995-01-16 제임스 더블유.게드리 재생성 중합체 합성지 및 그것의 제조방법(recyclable polymeric synthetic paper and method for its manufacture)
US5631073A (en) * 1992-02-03 1997-05-20 Minnesota Mining And Manufacturing Company Nonwoven sheet materials, tapes and methods
ZA929997B (en) 1992-09-25 1994-06-20 Casa Bernardo Ltda 100% Polyester reinforced material for the manufacture of a laminated film to form an applicator for holding a pest control agent.
US5346747A (en) 1992-12-24 1994-09-13 Granmont, Inc. Composite printed circuit board substrate and process for its manufacture
US5415738A (en) 1993-03-22 1995-05-16 Evanite Fiber Corporation Wet-laid non-woven fabric and method for making same
US5665452A (en) * 1994-03-03 1997-09-09 The Procter & Gamble Company Three-dimensional, macroscopically expanded, apertured laminate webs
US5954920A (en) 1994-06-07 1999-09-21 Kuraray Co., Ltd. Paper comprising aromatic polyester and process for producing the same
JPH08170295A (ja) 1994-12-19 1996-07-02 Kuraray Co Ltd 耐熱シ−ト
EP0768334B1 (de) * 1995-10-16 2004-02-18 Sumitomo Chemical Company Limited Prepreg, Verfahren zur Herstellung und gedrucktes Leiterplattensubstrat und dessen Verwendung

Also Published As

Publication number Publication date
TW533130B (en) 2003-05-21
KR100522480B1 (ko) 2006-01-27
EP0908559B1 (de) 2009-09-16
US6229096B1 (en) 2001-05-08
KR19990036900A (ko) 1999-05-25
EP0908559A3 (de) 2000-03-29
EP0908559B8 (de) 2009-12-09
EP0908559A2 (de) 1999-04-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition