DE69805412D1 - Kontaktlose chipkarte - Google Patents

Kontaktlose chipkarte

Info

Publication number
DE69805412D1
DE69805412D1 DE69805412T DE69805412T DE69805412D1 DE 69805412 D1 DE69805412 D1 DE 69805412D1 DE 69805412 T DE69805412 T DE 69805412T DE 69805412 T DE69805412 T DE 69805412T DE 69805412 D1 DE69805412 D1 DE 69805412D1
Authority
DE
Germany
Prior art keywords
chip card
contactless chip
contactless
card
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69805412T
Other languages
English (en)
Other versions
DE69805412T2 (de
Inventor
Yoshihiro Ikefuji
Hiroharu Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Application granted granted Critical
Publication of DE69805412D1 publication Critical patent/DE69805412D1/de
Publication of DE69805412T2 publication Critical patent/DE69805412T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE69805412T 1997-07-10 1998-06-08 Kontaktlose chipkarte Expired - Lifetime DE69805412T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9184702A JPH1131784A (ja) 1997-07-10 1997-07-10 非接触ｉｃカード
PCT/JP1998/002540 WO1999003062A1 (en) 1997-07-10 1998-06-08 Noncontact ic card

Publications (2)

Publication Number Publication Date
DE69805412D1 true DE69805412D1 (de) 2002-06-20
DE69805412T2 DE69805412T2 (de) 2002-11-07

Family

ID=16157888

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69805412T Expired - Lifetime DE69805412T2 (de) 1997-07-10 1998-06-08 Kontaktlose chipkarte

Country Status (8)

Country Link
US (1) US6404644B1 (de)
EP (1) EP0994440B1 (de)
JP (1) JPH1131784A (de)
KR (1) KR20010015548A (de)
AU (1) AU741148B2 (de)
CA (1) CA2295567A1 (de)
DE (1) DE69805412T2 (de)
WO (1) WO1999003062A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6651891B1 (en) * 1997-11-04 2003-11-25 Elke Zakel Method for producing contactless chip cards and corresponding contactless chip card
DE60037717T2 (de) * 1999-08-31 2009-01-15 Nxp B.V. Datenträger mit integriertem schaltkreis und übertragungsspule
EP1234275B1 (de) * 1999-12-02 2004-03-31 Infineon Technologies AG Chipkartenmodul mit anisotrop leitfähiger trägerfolie
JP2002319011A (ja) * 2001-01-31 2002-10-31 Canon Inc 半導体装置、半導体装置の製造方法及び電子写真装置
ES2331728T3 (es) * 2001-04-26 2010-01-14 Nxp B.V. Portador de datos que comprende un circuito integrado con un condensador principal integrado y condensadores adicionales integrados.
FR2828570B1 (fr) * 2001-08-09 2003-10-31 Cybernetix Procede de fabrication de cartes a puce sans contact et/ou mixte
WO2003049026A1 (en) * 2001-12-07 2003-06-12 Sokymat S.A Chip scale package for a transponder
DE10205208A1 (de) * 2002-02-08 2003-09-18 Conti Temic Microelectronic Schaltungsanordnung mit einer mit einem programmierbaren Speicherelement bestückten Leiterplatte
KR20040083527A (ko) * 2002-02-19 2004-10-02 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 트랜스폰더 및 이의 제조 방법
FR2841023B1 (fr) * 2002-06-14 2005-10-21 Store Electronic Systems Techn Antenne pour etiquette electronique
WO2005013360A1 (ja) * 2003-08-05 2005-02-10 Lintec Corporation フリップチップ実装用基板
WO2005013191A1 (en) 2003-08-05 2005-02-10 Koninklijke Philips Electronics N.V. Module with at least two pairs of module connecting plates
EP1709688A4 (de) 2004-01-30 2014-12-31 Semiconductor Energy Lab Halbleiterbauelement
JP5159024B2 (ja) * 2004-01-30 2013-03-06 株式会社半導体エネルギー研究所 半導体装置
KR100602621B1 (ko) * 2004-06-16 2006-07-19 한국조폐공사 조립식 콤비카드 및 이의 제조방법
DE102004034768B4 (de) * 2004-07-19 2007-11-15 Infineon Technologies Ag Identifikations-Datenträger
CN100592484C (zh) * 2005-05-24 2010-02-24 富士通株式会社 Ic标签的安装结构及安装用ic芯片
KR100717576B1 (ko) * 2005-08-25 2007-05-15 주식회사 나래나노텍 개선된 알에프아이디 태그
JP4829956B2 (ja) * 2008-12-15 2011-12-07 ルネサスエレクトロニクス株式会社 半導体装置
DE102010028444B4 (de) * 2010-04-30 2016-06-23 Bundesdruckerei Gmbh Dokument mit einem Chip und Verfahren zur Herstellung eines Dokuments
JP6546711B1 (ja) * 2019-04-10 2019-07-17 株式会社エスケーエレクトロニクス 非接触情報担体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63232485A (ja) 1987-03-20 1988-09-28 日本電気株式会社 半導体装置のリ−ド端子接続方法
DE4410732C2 (de) 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
JPH08227447A (ja) 1995-02-21 1996-09-03 Citizen Watch Co Ltd 通信ｉｃカード
JP2814477B2 (ja) 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式ｉｃカード及びその製造方法
DE19642378C2 (de) * 1996-10-14 2000-06-08 Fraunhofer Ges Forschung Kontaktlose Chipkarte

Also Published As

Publication number Publication date
AU7552798A (en) 1999-02-08
DE69805412T2 (de) 2002-11-07
CA2295567A1 (en) 1999-01-21
AU741148B2 (en) 2001-11-22
JPH1131784A (ja) 1999-02-02
EP0994440B1 (de) 2002-05-15
WO1999003062A1 (en) 1999-01-21
US6404644B1 (en) 2002-06-11
EP0994440A4 (de) 2000-05-24
KR20010015548A (ko) 2001-02-26
EP0994440A1 (de) 2000-04-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition